Organic light-emitting display panel and manufacturing method thereof

1. An organic light-emitting display panel having a light-transmitting area and a display area surrounding the light-transmitting area, the organic light-emitting display panel comprising:

a functional structure layer;

a light-emitting layer provided on the functional structure layer;

a thin-film encapsulation layer covering the light-emitting layer; and

a light-transmitting hole penetrating from the light-emitting layer to the functional structure layer and corresponding to the light-transmitting area;

wherein the thin-film encapsulation layer extends from a surface of the light-emitting layer away from the functional structure layer to a wall surface of the functional structure layer facing to the light-transmitting hole,

wherein the functional structure layer comprises:

a dielectric layer;

a planarization layer provided on the dielectric layer;

a pixel defining layer provided on the planarization layer;

a plurality of spacers provided on the pixel defining layer; and

an overflow-preventing groove passing through the spacers, the pixel defining layer, the planarization layer, and the dielectric layer, and located between the light-transmitting hole and a pixel electrode, wherein a portion of the thin-film encapsulation layer is filled into the overflow-preventing groove to prevent an organic layer of the thin-film encapsulation from overflowing.

2. The organic light-emitting display panel according to claim 1 , wherein the functional structure layer comprises:

a polyimide layer;

a buffer layer provided on the polyimide layer;

an active layer provided on the buffer layer;

a gate insulating layer provided on the active layer and the buffer layer;

a gate layer provided on the gate insulating layer;

the dielectric layer provided on the gate layer and the gate insulating layer;

a source/drain electrode provided on the dielectric layer and connected to the active layer;

the planarization layer provided on the source/drain electrode and the dielectric layer;

the pixel electrode provided on the planarization layer and connected to the source/drain electrode;

the pixel defining layer provided on the pixel electrode and the planarization layer;

the spacers provided on the pixel defining layer; and

an overflow-preventing groove extended from the spacers to the dielectric layer and located between the light-transmitting hole and the source/drain electrode and the pixel electrode.

3. The organic light-emitting display panel according to claim 1 , further comprising:

a touch panel provided on the thin-film encapsulation layer;

a polarizer provided on the touch panel;

a back plate provided on a surface of the functional structure layer away from the light-emitting layer;

a cover plate provided on the polarizer; and

a light absorbing film provided between the polarizer and the cover plate, and located at an edge of the light-transmitting hole;

wherein the light-transmitting hole penetrates from the polarizer to the functional structure layer.

4. The organic light-emitting display panel according to claim 1 , wherein a diameter of the light-transmitting hole is smaller than or equal to a diameter of the light-transmitting area.

5. A manufacturing method of an organic light-emitting display panel, comprising steps of:

providing a substrate;

forming a functional structure layer on the substrate, and forming a light-transmitting hole in the functional structure layer, wherein the functional structure layer comprises: a dielectric layer;

a planarization layer provided on the dielectric layer; a pixel defining layer provided on the planarization layer; and a plurality of spacers provided on the pixel defining layer;;

forming a light-emitting layer on the functional structure layer;

forming an overflow-preventing groove passing through the spacers, the pixel defining layer, the planarization layer, and the dielectric layer, and located between the light-transmitting hole and a pixel electrode;

forming a thin-film encapsulation layer on the substrate, wherein a portion of the thin-film encapsulation layer is filled into the overflow-preventing groove to prevent an organic layer of the thin-film encapsulation from overflowing; and

removing the thin-film encapsulation layer on the substrate and in the light-transmitting hole.

6. The manufacturing method according to claim 5 , wherein the step of forming the functional structure layer comprises steps of:

forming a polyimide layer on the substrate;

sequentially forming a buffer layer, an active layer, a gate insulating layer, and a gate layer on the polyimide layer, and forming the light-transmitting hole in the buffer layer and the gate insulating layer;

forming the dielectric layer, a source/drain electrode, the planarization layer, the pixel electrode, the pixel defining layer and a plurality of the spacers on the gate layer, and forming the light-transmitting hole in the dielectric layer, the planarization layer, the pixel defining layer and the spacers; and

removing the polyimide layer in the light-transmitting hole.

7. The manufacturing method according to claim 5 , wherein the step of forming the light-emitting layer comprises steps of:

depositing material of the light-emitting layer on the functional structure layer by an evaporation process; and

patterning the light-emitting layer by a laser lithography technology to remove the light-emitting layer in the light-transmitting hole.

8. The manufacturing method according to claim 5 , wherein the step of removing the thin-film encapsulation layer on the substrate and in the light-transmitting hole comprises step of:

peeling the substrate by a laser peeling technology, wherein the laser peeling technology causes the thin-film encapsulation layer in the light-transmitting hole to be broken and peeled off.

9. The manufacturing method according to claim 8 , wherein the thin-film encapsulation layer extends from a surface of the light-emitting layer away from the functional structure layer to a wall surface of the functional structure layer facing to the light-transmitting hole.

10. The manufacturing method according to claim 5 , wherein between the step of forming the thin-film encapsulation layer and the step of removing the thin-film encapsulation layer on the substrate and in the light-transmitting hole further comprises a step of:

forming a touch panel and a polarizer on the thin-film encapsulation layer; and

wherein the manufacturing method of the organic light-emitting display panel further comprises steps of:

providing a back plate and attaching the back plate to a surface of the functional structure layer away from the light-emitting layer;

provide a cover plate;

forming a light absorbing film on the cover plate; and

attaching a surface of the cover plate having the light absorbing film to the polarizer.