IP Library Granted Patent US 12,484,376
Granted Patent B2
US 12,484,376 · App. 18/022,392 · Granted Nov 25, 2025

Display panel and manufacturing method therefor, display screen, and electronic device

Inventors: Haohui Long (Shenzhen, CN); Shanshan Wei (Shenzhen, CN); Jianping Fang (Shenzhen, CN); Xiaolong Li (Shenzhen, CN)
Assignee: Honor Device Co., Ltd.
H10K59/121H10K59/1201H10K59/124H10K59/40H10K59/873H10K59/8731H10K59/8792H10K59/65H10K59/8791H10K71/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,484,376
App. No.
18/022,392
Granted
Nov 25, 2025
Kind
B2
Abstract

This application provides a display panel, a display screen including the display panel, and an electronic device including the display screen. The display panel includes a thin film transistor backplane, an organic layer, and a packaging layer that are successively stacked. The display panel is provided with a through hole, which runs through the thin film transistor backplane, the organic layer, and the packaging layer; the display panel includes a non-display area and a display area, the non-display area being disposed around the through hole and the display area being disposed around the non-display area; the organic layer includes a first organic layer and a second organic layer, the first organic layer is a part located in the display area, and the second organic layer is a part located in the non-display area.

Claims (31)

1 . A display panel, comprising:

a thin film transistor backplane;

an organic layer; and

a packaging layer, wherein the thin film transistor backplane, the organic layer, and the packaging layer are successively stacked;

wherein the display panel is provided with a through hole, wherein runs through the thin film transistor backplane, the organic layer, and the packaging layer;

wherein the display panel comprises a non-display area and a display area, the non-display area being disposed around the through hole and the display area being disposed around the non-display area;

wherein the organic layer comprises a first organic layer and a second organic layer, the first organic layer is partially located in the display area, and the second organic layer is partially located in the non-display area, wherein the first organic layer comprises a plurality of display devices, the second organic layer is provided with a first groove that runs through the second organic layer, and the first groove is disposed around the through hole; and

wherein the packaging layer covers the organic layer and is filled in the first groove.

2 . The display panel according to claim 1 , wherein a width of the first groove on a side closer to the packaging layer is greater than the width of the first groove on a side away from the packaging layer.

3 . The display panel according to claim 1 , wherein:

the thin film transistor backplane comprises a substrate and a dam disposed on the substrate, wherein the dam is located in the non-display area and is disposed around the through hole;

the organic layer covers the substrate and the dam, and the first groove is spaced apart from the dam; and

the packaging layer comprises a first inorganic packaging layer, an organic packaging layer, and a second inorganic packaging layer, wherein the first inorganic packaging layer covers the organic layer and is filled in the first groove, the organic packaging layer covers a part of the first inorganic packaging layer located on an outer circumference of the dam, and the second inorganic packaging layer covers the organic packaging layer and the first inorganic packaging layer.

4 . The display panel according to claim 3 , wherein the first groove is provided in both inner and outer sides of the dam.

5 . The display panel according to claim 1 , wherein the width of the first groove on the side closer to the packaging layer is 10 μm-50 μm and the width of the first groove on the side away from the packaging layer is 10 μm-50 μm.

6 . The display panel according to claim 3 ,

wherein the substrate is provided with a second groove that forms an opening on a surface of the substrate facing the organic layer, wherein the second groove does not run through the substrate, and the second groove is located between the dam and the through hole and surrounds the through hole; and

wherein the first groove is located on an outer circumference of the second groove.

7 . The display panel according to claim 1 , wherein the display panel comprises a touch layer that covers the packaging layer, and the through hole runs through the touch layer.

8 . An electronic device, comprising:

an optical device; and

a display screen,

wherein the optical device corresponds to the through hole, and the optical device is configured to acquire a light ray passing through a transparent area and the through hole,

wherein the display screen comprises a cover plate and the display panel according to claim 1 ,

wherein the cover plate is laminated to the display panel, and

wherein the packaging layer is located between the cover plate and the organic layer.

9 . The electronic device according to claim 8 ,

wherein the cover plate comprises a first transparent area, an opaque area, and a second transparent area;

wherein the first transparent area is disposed around the opaque area and the opaque area is disposed around the second transparent area; and

wherein the display area is located in the first transparent area, the opaque area corresponds to the non-display area, and the second transparent area corresponds to the through hole.

10 . The electronic device according to claim 9 , wherein a boundary of the opaque area and the second transparent area falls within a boundary of the through hole.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2023
From: LONG, HAOHUI; WEI, SHANSHAN; FANG, JIANPING; LI, XIAOLONG
To: HONOR DEVICE CO., LTD.
Reel/Frame 065786/0546 →
Priority Claims (1)
CN 202010899632.1 · Aug 31, 2020 · national
Continuity (1)
Related Publication 20230329070A1 · Oct 12, 2023
References Cited (21)
US 10741788B2 · Won et al. · 2020 [cited by applicant]
US 10861909B2 · Park · 2020 [cited by applicant]
US 11398616B2 · Ouyang et al. · 2022 [cited by applicant]
US 11462714B2 · Yun et al. · 2022 [cited by applicant]
US 11587989B2 · Wu et al. · 2023 [cited by applicant]
US 20170237038A1 · Kim et al. · 2017 [cited by applicant]
US 20200083475A1 · Kang · 2020 [cited by examiner]
US 20200119304A1 · Choi et al. · 2020 [cited by applicant]
US 20200144535A1 · Kim · 2020 [cited by examiner]
US 20200168671A1 · Jang et al. · 2020 [cited by applicant]
US 20200212139A1 · Baek et al. · 2020 [cited by applicant]
CN 110429199A · 2019 [cited by examiner]
CN 110444576A · 2019 [cited by applicant]
CN 110600511A · 2019 [cited by applicant]
CN 111081732A · 2020 [cited by applicant]
CN 111129351A · 2020 [cited by applicant]
CN 111162195A · 2020 [cited by applicant]
CN 111326553A · 2020 [cited by applicant]
CN 111403624A · 2020 [cited by applicant]
CN 111443774A · 2020 [cited by applicant]
KR 1020200025916A · 2020 [cited by applicant]