Semiconductor structure and method for forming the same
A semiconductor structure includes a substrate including a first region and a second region, a first FET device disposed in the first region, and a second FET device disposed in the second region. The first FET device includes a fin structure, a first work function metal layer disposed over the fin structure, and a high-k gate dielectric layer between the first work function metal layer and the fin structure. The second FET device includes a plurality of nanosheets stacked over the substrate and separated from each other, a second work function metal layer surrounding each of the nanosheets, and the high-k gate dielectric layer between the second work function metal layer and each of the nanosheets. In some embodiments, the fin structure has a first width, each of the nanosheets has a second width, and the second width is greater than the first width.
1. A semiconductor structure comprising:
a substrate comprising a first region and a second region;
an isolation disposed in the substrate and separating the first region and the second region from each other;
a first field effect transistor (FET) device disposed in the first region, wherein the first FET device comprises:
a fin structure;
a first work function metal layer over the fin structure; and
a high-k gate dielectric layer between the first work function metal layer and the fin structure, wherein a portion of the high-k gate dielectric layer is directly over the isolation; and
a second FET device disposed in the second region, wherein the second FET device comprises:
a plurality of nanosheets stacked over the substrate and separated from each other;
a second work function metal layer surrounding each of the nanosheets; and
the high-k gate dielectric layer between the second work function metal layer and each of the nanosheets,
wherein the fin structure has a first width, each of the nanosheets has a second width, and the second width is greater than the first width.
2. The semiconductor structure of claim 1 , wherein the first work function metal layer is a p-type work function metal layer, and the second work function metal layer is an n-type work function metal layer.
3. The semiconductor structure of claim 2 , wherein the second FET device further comprises a third work function metal layer, and the third work function metal layer is a p-type work function metal layer.
4. The semiconductor structure of claim 3 , wherein a thickness of the third work function metal layer is equal to or greater than a thickness of the first work function metal layer.
5. The semiconductor structure of claim 1 , wherein the first work function metal layer and the second work function metal layer are n-type work function metal layers.
6. The semiconductor structure of claim 5 , wherein the second FET device further comprises a fourth work function metal layer, and the fourth work function metal layer is same material as to the first work function metal layer.
7. The semiconductor structure of claim 1 , wherein the high-k gate dielectric layer is in contact with the isolation.
8. A semiconductor structure, comprising:
a substrate having a first region, a second region, a third region and a fourth region defined thereon;
a first FinFET device disposed in the first region, wherein the first FinFET device comprises a first fin structure, a high-k gate dielectric layer over the first fin structure, and a first work function metal layer over the high-k gate dielectric layer;
a second FinFET device disposed in the second region, wherein the second FinFET device comprises a second fin structure, the high-k gate dielectric layer over the second fin structure, and a second work function metal layer over the high-k gate dielectric layer;
a third FinFET device disposed in the third region, wherein the third FinFET device comprises a third fin structure, the high-k gate dielectric layer over the third fin structure, and a third work function metal layer over the high-k gate dielectric layer; and
a nanosheet FET device disposed in the fourth region, wherein the nanosheet FET device comprises a plurality of nanosheets stacked over the substrate, the high-k gate dielectric layer surrounding each of the nanosheets, and a fourth work function metal layer over the high-k gate dielectric layer and surrounding each of the nanosheets.
9. The semiconductor structure of claim 8 , wherein the first work function metal layer and the fourth work function metal layer are n-type work function metal layers.
10. The semiconductor structure of claim 9 , wherein the first work function metal layer is different from the fourth work function metal layer.
11. The semiconductor structure of claim 10 , wherein the nanosheet FET device further comprises a fifth work function metal layer, and the fifth work function metal layer and the first work function metal layer are the same.
12. The semiconductor structure of claim 8 , wherein the second work function metal layer and the third work function metal layer are p-type work function metal layers.
13. The semiconductor structure of claim 12 , wherein the second work function metal layer is different from the third work function metal layer.
14. The semiconductor structure of claim 12 , wherein the nanosheet FET device further comprises a sixth work function metal layer, and the sixth work function metal layer and the third work function metal layer are the same.
15. The semiconductor structure of claim 12 , wherein a crystal plane of each of the nanosheets is a (100) plane.
16. A method for forming a semiconductor structure comprising:
receiving a substrate;
forming a first fin structure, a second fin structure, a third fin structure and a nanosheet stack over the substrate, wherein the nanosheet stack comprises a plurality of nanosheets separated from each other;
forming a high-k gate dielectric layer over the first fin structure, the second fin structure and the third fin structure, and surrounding each of the nanosheets;
forming a first work function metal layer to surround each of the nanosheets;
forming a first passivation layer to wrap each of the nanosheets;
forming a second work function metal layer to cover the first fin structure, the third fin structure and the nanosheet stack;
forming a third work function metal layer to cover the second fin structure, the third fin structure and the nanosheet stack; and
forming a fourth work function metal layer to cover the first fin structure, the second fin structure, the third fin structure and the nanosheet stack.
17. The method of claim 16 , wherein the first work function metal layer and the fourth work function metal layer are complementary to the second work function metal layer and the third work function metal layer.
18. The method of claim 16 , wherein the forming of the second work function metal layer to cover the first fin structure, the third fin structure and the nanosheet stack further comprises:
forming the second work function metal layer over the substrate to cover the first fin structure, the second fin structure, the third fin structure and the nanosheet stack; and
removing a portion of the second work function metal layer to expose the high-k gate dielectric over the second fin structure.
19. The method of claim 16 , wherein the forming of the third work function metal layer to cover the second fin structure, the third fin structure and the nanosheet stack further comprises:
forming the third work function metal layer over the substrate to cover the first fin structure, the second fin structure, the third fin structure and the nanosheet stack; and
removing a portion of the third work function metal layer to expose the high-k gate dielectric over the first fin structure.
20. The method of claim 16 , further comprising forming a second passivation layer to cover the first fin structure, the second fin structure, the third fin structure and the nanosheet stack.