Apparatus for direct transfer of semiconductor device die
A semiconductor device die transfer apparatus includes a first frame to hold a wafer tape having a plurality of semiconductor device die disposed on a side of the wafer tape and a second frame to secure a product substrate having a circuit trace thereon. The second frame is configured to secure the product substrate such that the circuit trace is disposed facing the plurality of semiconductor device die on the wafer tape. Additionally, a rotary transfer collet is disposed between the wafer tape and the product substrate. The rotary transfer collet has a rotational axis allowing rotation from a first position facing the wafer tape to pick a die of the plurality of semiconductor device die to a second position facing the circuit trace on the product substrate to release the die, thereby applying the die directly on the product substrate during a transfer operation.
1. A method of effectuating improved transfer of a semiconductor die from a wafer tape, the method comprising:
positioning the wafer tape having the semiconductor die thereon, the semiconductor die being disposed on a first side of the wafer tape;
positioning a substrate adjacent to the wafer tape;
selecting, based, at least in part, on one or more characteristics of the semiconductor die, a needle to transfer the semiconductor die;
selecting, based, at least in part, on the one or more characteristics of the semiconductor die, a gap distance between the substrate and a bottom surface of the semiconductor die, and the bottom surface of the semiconductor die being opposite a top surface of the semiconductor die adhered to the wafer tape;
sensing, in real-time, a condition of the wafer tape to adjust a position at which the semiconductor die is transferred;
positioning, based, at least in part, on the gap distance, an end of the needle adjacent to a second surface of the wafer tape; and
transferring, via actuation of the needle, the semiconductor die onto the substrate.
2. The method of claim 1 , wherein the end of the needle includes:
a longitudinal surface extending in a direction toward the wafer tape;
a tip; and
a tapered portion interposed between the longitudinal surface and the tip, and
wherein a height of the tapered portion is based, at least in part, on a height of the semiconductor die.
3. The method of claim 1 , wherein selecting the gap distance is further based, at least in part, on an adhesion force between the semiconductor die and the wafer tape.
4. The method of claim 1 , wherein transferring the semiconductor die occurs at a predetermined rate of transfer that is based, at least in part, on an amount of adhesion force adhering the semiconductor die to the wafer tape.
5. The method of claim 1 , wherein the needle has a resting position and a transfer position,
wherein a cycle of the needle includes starting at the resting position, transitioning to the transfer position, and returning to the resting position, and
wherein a stroke rate of the cycle occurs at predetermined amount of time.
6. The method of claim 5 , wherein the needle is in the transfer position for about 30 milliseconds.
7. The method of claim 6 , wherein in the resting position, a distance between the end of the needle and the second surface of the wafer tape is about 1 mm.
8. The method of claim 1 , wherein the one or more characteristics include:
a height of the semiconductor die;
a cross-sectional dimension of the semiconductor die; or
a type of the semiconductor die.
9. The method of claim 1 , wherein the gap distance is further based at least in part on a height of the substrate and other components disposed thereon, to which the semiconductor die is transferred.
10. A system for improving semiconductor die transfer, the system including: a first frame, a second frame, a needle actuator, and one or more computing systems configured with executable instructions, which when executed, cause the one or more computing systems to perform acts of a method, the method comprising:
positioning, via the first frame, a wafer tape including semiconductor die;
positioning, via the second frame, a substrate adjacent to the wafer tape;
selecting, based, at least in part, on the semiconductor die, a needle;
determining, based, at least in part, on the needle, a gap distance interposed between a bottom surface of the semiconductor die and the substrate;
determining, based, at least in part, on the gap distance, a rate of transfer for transferring the semiconductor die;
sensing, in real-time, a condition of the wafer tape to adjust a position at which the semiconductor die is transferred; and
transferring, via actuating the needle actuator and based, at least in part, on the rate of transfer, the semiconductor die onto the substrate.
11. The system of claim 10 , wherein the rate of transfer is further based, at least in part, on an adhesion force between the semiconductor die and the wafer tape.
12. The system of claim 10 , wherein the needle includes:
a longitudinal surface;
a tip; and
a tapered portion interposed between the longitudinal surface and the tip, and
wherein a taper of the tapered portion is based, at least in part, on the semiconductor die.
13. The system of claim 10 , wherein the wafer tape is a first wafer tape, wherein the substrate includes a product substrate having a conductive trace facing the semiconductor die, and
wherein transferring the semiconductor die onto the substrate includes transferring the semiconductor die into contact with the conductive trace.
14. The system of claim 10 , wherein the semiconductor die are disposed on a first side of the wafer tape, and
wherein the method further comprises positioning, based, at least in part, on the gap distance, an end of the needle adjacent to a second side of the wafer tape, the second side being opposite the first side of the wafer tape.
15. The system of claim 10 , wherein selecting the needle is based, at least in part, on one or more dimensions of the semiconductor die.
16. The system of claim 10 , wherein the gap distance is further based at least in part on a height of the substrate and other components disposed thereon, to which the semiconductor die is transferred.
17. A method of effectuating improved transfer of a semiconductor die from a wafer tape, the method comprising:
positioning the wafer tape having the semiconductor die thereon, the semiconductor die being disposed on a first side of the wafer tape;
positioning a substrate adjacent to the wafer tape;
selecting, based, at least in part, on one or more characteristics of the semiconductor die, a needle to transfer the semiconductor die;
sensing, in real-time, a condition of the wafer tape to adjust a position at which the semiconductor die is transferred;
positioning, based, at least in part, on the condition of the wafer tape, an end of the needle adjacent to a second surface of the wafer tape; and
transferring, via actuation of the needle, the semiconductor die onto the substrate.
18. A system for improving semiconductor die transfer, the system including: a first frame, a second frame, a needle actuator, and one or more computing systems configured with executable instructions, which when executed, cause the one or more computing systems to perform acts of a method, the method comprising:
positioning, via the first frame, a wafer tape including semiconductor die;
positioning, via the second frame, a substrate adjacent to the wafer tape;
selecting, based, at least in part, on the semiconductor die, a needle;
sensing, in real-time, a condition of the wafer tape to adjust a position at which the semiconductor die is transferred; and
transferring, via actuating the needle actuator and based, at least in part, on tea rate of transfer, the semiconductor die onto the substrate.