Method for processing a workpiece using a multi-cycle thermal treatment process
View Patent ↗A method for processing a workpiece is provided. The method can include placing a workpiece on a susceptor disposed within a processing chamber. The method can include performing a multi-cycle thermal treatment process on the workpiece in the processing chamber. The multi-cycle thermal treatment process can include at least two thermal cycles. Each thermal cycle of the at least two thermal cycles can include performing a first treatment on the workpiece at a first temperature; heating a device side surface of the workpiece to a second temperature in less than one second; performing a second treatment on the workpiece at approximately the second temperature; and cooling the workpiece subsequent to performing the second treatment.
1. A method for processing a workpiece, the method comprising:
placing a workpiece on a susceptor disposed within a processing chamber;
performing a multi-cycle thermal treatment process on the workpiece while the workpiece is disposed within the processing chamber and without removing the workpiece from the processing chamber, the multi-cycle thermal treatment process comprising at least two thermal cycles, each thermal cycle of the at least two thermal cycles comprising:
performing a first treatment on the workpiece at a first temperature, the first treatment comprising exposing the workpiece to one or more species generated in a remote plasma chamber;
heating, by one or more heat sources, a device side surface of the workpiece to a second temperature;
performing a second treatment on the workpiece at approximately the second temperature; and
subsequent to performing the second treatment, providing a flow of fluid through an interior of the susceptor to cool the workpiece for approximately the first temperature;
wherein the first treatment comprises an etch process or a deposition process;
wherein the second treatment comprises a surface activation process.
2. The method of claim 1 , wherein the etch process removes at least a portion of a layer of material from the workpiece.
3. The method of claim 1 , wherein the deposition process at least partially deposits layer of material onto the workpiece.
4. The method of claim 1 , wherein the fluid comprises Freon fluid or water.
5. The method of claim 1 , wherein the fluid comprises ethylene glycol.
6. The method of claim 1 , wherein a difference between the first temperature and the second temperature is greater than about 100 degrees Kelvin.
7. The method of claim 1 , wherein the device side surface of the workpiece is heated to the second temperature in less than about 1 second.
8. The method of claim 1 , wherein the device side surface of the workpiece is heated to the second temperature in a range of about 0.5 ms to about 10 ms.
9. The method of claim 1 , wherein a duration of time between thermal cycles is greater than a duration of each thermal cycle.
10. The method of claim 1 , wherein performing the first treatment comprises exposing the device side surface of the workpiece to one or more gases.
11. The method of claim 1 , wherein performing the second treatment comprises exposing the device side surface of the workpiece to one or more gases.
12. The method of claim 1 , further comprising removing the workpiece from the processing chamber subsequent to performing the multi-cycle thermal treatment process.