Semiconductor package with elastic coupler and related methods
Implementations of semiconductor packages may include: a die coupled to a substrate; a housing coupled to the substrate and at least partially enclosing the die within a cavity of the housing, and; a pin fixedly coupled to the housing and electrically coupled with the die, wherein the pin includes a reversibly elastically deformable lower portion configured to compress to prevent a lower end of the pin from lowering beyond a predetermined point relative to the substrate when the housing is lowered to be coupled to the substrate.
1. A pin for a semiconductor package, comprising:
a shaft comprising an upper portion configured to couple with a housing and comprising a lower portion;
wherein the lower portion comprises a reversibly elastically deformable portion;
wherein the reversibly elastically deformable lower portion is configured to be located between the housing and a substrate;
wherein the upper portion is configured to extend through the housing; and
wherein the reversibly elastically deformable portion is configured to compress when the housing is coupled over the substrate.
2. The pin of claim 1 , wherein a base of the pin is coupled to the substrate with a spring.
3. The pin of claim 1 , wherein the pin is configured to at least temporarily fixedly couple in a top of the housing and is configured to be coupled with the substrate by lowering the housing towards the substrate.
4. The pin of claim 1 , wherein the reversibly elastically deformable lower portion comprises a spring.
5. The pin of claim 1 , wherein the reversibly elastically deformable lower portion is configured to compress to prevent a lower end of the pin from lowering beyond a predetermined point relative to the lower end of pin when the housing is lowered to be coupled to the substrate.
6. The pin of claim 1 , wherein the pin is configured to couple to a connection trace coupled to a semiconductor die, wherein the semiconductor die is at least partially enclosed within a cavity of the housing.
7. The pin of claim 1 , wherein the upper portion is configured to be molded into and fixedly coupled to the housing.
8. The pin of claim 1 , wherein the pin is configured to directly couple to the substrate through a solderless connection.
9. A pin for a semiconductor package, comprising:
a shaft comprising an upper portion configured to couple with a housing and comprising a lower portion;
wherein the lower portion comprises a reversibly elastically deformable portion;
wherein the reversibly elastically deformable portion is configured to be located between the housing and a substrate;
wherein the upper portion is configured to extend through the housing;
wherein the reversibly elastically deformable portion is configured to compress when the housing is coupled over the substrate; and
wherein the pin is configured to be coupled with the substrate by lowering the housing towards the substrate.
10. The pin of claim 9 , wherein a base of the pin is configured to couple to the substrate with a spring.
11. The pin of claim 9 , wherein the reversibly elastically deformable portion comprises a spring.
12. The pin of claim 9 , wherein the pin is configured to couple to a connection trace coupled to a semiconductor die, wherein the semiconductor die is at least partially enclosed within a cavity of the housing.
13. The pin of claim 9 , wherein the lower portion is configured to directly couple to the substrate through a solderless connection.
14. A pin for a semiconductor package, comprising:
a shaft comprising an upper portion configured to couple with a housing and comprising a lower portion;
wherein the lower portion comprises a spring;
wherein the spring biases the upper portion of the pin towards the housing;
wherein the shaft is configured to extend through the housing; and
wherein the spring is configured to be located between the housing and a substrate.
15. The pin of claim 14 , wherein the spring comprises a coil spring.
16. The pin of claim 14 , wherein the spring is configured to be compressed along a direction substantially parallel with the shaft of the pin.
17. The pin of claim 14 , wherein the spring is configured to prevent a contact surface of the pin from lowering beyond a predetermined point relative to the substrate when the housing is lowered towards the substrate.
18. The pin of claim 14 , wherein the spring is a helical spring.
19. The pin of claim 14 , wherein the pin is configured to be compressed when the housing is placed over the substrate.
20. The pin of claim 14 , wherein the lower portion is configured to directly couple to the substrate through a solderless connection.