Ternary paraelectric material with space group Cc and method of manufacturing the same
A ternary paraelectric having a Cc structure and a method of manufacturing the same are provided. The ternary paraelectric having a Cc structure includes a material having a chemical formula of A 2 B 4 O 11 that has a monoclinic system, is a space group No. 9, and has a dielectric constant of 150 to 250, wherein “A” is a Group 1 element, and “B” is a Group 5 element. “A” may include one of Na, K, Li and Rb. “B” may include one of Nb, V, and Ta. The A 2 B 4 O 11 material may be Na 2 Nb 4 O 11 in which bandgap energy thereof is greater than that of STO. The A 2 B 4 O 11 material may have relative density that is greater than 90% or more.
1. A ternary paraelectric having a Cc structure comprising:
a material having a chemical formula of A 2 B 4 O 11 that belongs to a monoclinic system, is a space group No. 9, and has a dielectric constant of 150 to 250,
wherein “A” is a Group 1 element, and “B” is a Group 5 element.
2. The ternary paraelectric of claim 1 , wherein “A” comprises one of Na, K, Li and Rb.
3. The ternary paraelectric of claim 1 , wherein “B” comprises one of Nb, V, and Ta.
4. The ternary paraelectric of claim 1 , wherein the A 2 B 4 O 11 material comprises Na 2 Nb 4 O 11 in which a bandgap energy thereof is greater than that of STO.
5. The ternary paraelectric of claim 1 , wherein a relative density of the A 2 B 4 O 11 material is 90% or more compared to a fully dense A 2 B 4 O 11 not containing a pore.
6. A capacitor comprising:
a first electrode;
a second electrode; and
a dielectric layer, the dielectric layer comprising the ternary paraelectric having the Cc structure of claim 1 .
7. A semiconductor device comprising the ternary paraelectric having the Cc structure of claim 1 .
8. A method of manufacturing a ternary paraelectric having a Cc structure, the method comprising:
preparing ternary dielectric powder, the ternary dielectric powder comprising an A 2 B 4 O 11 material;
compacting the prepared ternary dielectric powder; and
sintering the compacted ternary dielectric powder;
wherein the ternary paraelectric includes a material that belongs to a monoclinic system, is a space group No. 9, and has a dielectric constant of 150 to 250, “A” is a Group 1 element, and “B” is a Group 5 element.
9. The method of claim 8 , further comprising re-heating a resultant product of the sintering.
10. The method of claim 9 , wherein the sintering comprises a spark plasma sintering (SPS) operation.
11. The method of claim 9 , wherein the re-heating is performed at a higher temperature than the sintering.
12. The method of claim 8 , wherein the preparing of the ternary dielectric powder comprises:
mixing a first precursor including “A” with a second precursor including “B”;
milling the mixture of the first and second precursors after adding a solvent to the mixture;
drying a resultant product after the milling is completed; and
calcining the dried resultant product.
13. The method of claim 12 , wherein the milling comprises a planetary milling operation.
14. The method of claim 8 , wherein the compacting comprises:
molding the ternary dielectric powder into a pellet shape; and
compacting the molded ternary dielectric powder.
15. The method of claim 8 , wherein “A” is one of Na, K, Li, and Rb.
16. The method of claim 8 , wherein “B” is one of Nb, V, and Ta.
17. The method of claim 8 , wherein the A 2 B 4 O 11 material comprises Na 2 Nb 4 O 11 in which bandgap energy thereof is greater than that of STO.
18. The method of claim 8 , wherein a relative density of the A 2 B 4 O 11 material is 90% or more compared to a fully dense A 2 B 4 O 11 not containing a pore.
19. The ternary paraelectric of claim 4 , wherein the A 2 B 2 O 11 material has a band offset of 1 eV or more to one of an upper electrode and a lower electrode of a capacitor.
20. The capacitor of claim 6 , wherein the ternary paraelectric having the Cc structure has a band offset of 1 eV or more to one of the first electrode and the second electrode.