IP Library › Granted Patent US 11,236,948
Granted Patent B2
US 11,236,948 · App. 16/820,662 · Granted Feb 1, 2022

Heat dissipation assembly

Inventors: Wei-Fang Wu (Taoyuan, TW); Li-Kuang Tan (Taoyuan, TW)
Assignee: DELTA ELECTRONICS, INC.
F28D15/0266F28D15/04H05K7/20309H05K7/20318H05K7/20336H05K7/20418
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Quick Facts
Patent No.
US 11,236,948
App. No.
16/820,662
Granted
Feb 1, 2022
Kind
B2
Abstract

A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.

Claims (13)

1. A heat dissipation assembly, comprising:

a condenser having a condensing chamber therein, wherein the condensing chamber has a recess indenting therefrom;

an evaporator;

a vapor conduit, wherein a first end of the vapor conduit is connected to the condenser, and a second end of the vapor conduit is connected to the evaporator;

a liquid conduit, wherein a first end of the liquid conduit is connected to the condenser, a second end of the liquid conduit is connected to the evaporator, and the first end of the liquid conduit is positioned within the recess;

wherein the condensing chamber has a first surface and a second surface, the recess is between the first surface and the second surface, and a length of the first surface is shorter than a length of the second surface; and

wherein the first surface and the second surface are located in a bottom portion of the condensing chamber.

2. The heat dissipation assembly of claim 1 , wherein the first end of the liquid conduit is in contact with the recess.

3. The heat dissipation assembly of claim 1 , wherein the first surface is a first oblique surface and the second surface is a second oblique surface.

4. The heat dissipation assembly of claim 3 , wherein an included angle is included between the first oblique surface and the second oblique surface, and the included angle is in a range from 60 degrees to 179 degrees.

5. The heat dissipation assembly of claim 1 , wherein the first surface and the second surface are parallel to a bottom surface of the condenser.

6. The heat dissipation assembly of claim 1 , wherein a geometric center of the liquid conduit in the condensing chamber is lower than a geometric center of the condensing chamber.

7. The heat dissipation assembly of claim 1 , wherein the evaporator has an evaporating chamber, and a geometric center of the liquid conduit in the evaporating chamber is lower than or equal to a geometric center of the evaporating chamber.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 17, 2020
From: WU, WEI-FANG; TAN, LI-KUANG
To: DELTA ELECTRONICS, INC.
Reel/Frame 052130/0262 →
Priority Claims (1)
CN 201610714849.4 · Aug 24, 2016 · national
Continuity (2)
Continuation In Part 15336758 · Oct 27, 2016
Related Publication 20200217595A1 · Jul 9, 2020