IP Library › Granted Patent US 11,233,132
Granted Patent B2
US 11,233,132 · App. 16/822,350 · Granted Jan 25, 2022

Semiconductor device

Inventor: Hajime Kimura (Atsugi, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L29/4908H01L27/124H01L27/1225H01L27/1288H01L29/458H01L29/7869H01L21/02554H01L21/02565
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,233,132
App. No.
16/822,350
Granted
Jan 25, 2022
Kind
B2
Abstract

A semiconductor device includes a semiconductor layer over a substrate; a gate insulating film covering the semiconductor layer; a gate wiring including a gate electrode, which is provided over the gate insulating film and is formed by stacking a first conductive layer and a second conductive layer; an insulating film covering the semiconductor layer and the gate wiring including the gate electrode; and a source wiring including a source electrode, which is provided over the insulating film, is electrically connected to the semiconductor layer, and is formed by stacking a third conductive layer and a fourth conductive layer. The gate electrode is formed using the first conductive layer. The gate wiring is formed using the first conductive layer and the second conductive layer. The source electrode is formed using the third conductive layer. The source wiring is formed using the third conductive layer and the fourth conductive layer.

Claims (44)

1. A semiconductor device comprising:

a pixel portion over a substrate;

a driver circuit portion over the substrate;

the pixel portion comprising:

a first semiconductor layer comprising a channel formation region;

a first electrode electrically connected to the first semiconductor layer;

a first insulating film over the first semiconductor layer and the first electrode;

a second electrode overlapping with the channel formation region with the first insulating film interposed therebetween;

a second insulating film over the second electrode;

a third electrode over and in contact with the second insulating film, the third electrode having a region overlapping with the channel formation region with the second electrode interposed therebetween; and

a fourth electrode over and in contact with the second insulating film, the fourth electrode having the same material as the third electrode,

wherein the second electrode has a region overlapped with the fourth electrode,

wherein the third electrode is in contact with the first electrode through an opening provided in the first insulating film and the second insulating film,

wherein the opening does not overlap with the first semiconductor layer,

wherein each of the second electrode and the third electrode has a light-transmitting property, and

the driver circuit portion comprising:

a second semiconductor layer comprising a channel formation region;

the first insulating film over the second semiconductor layer;

a fifth electrode over the first insulating film; and

a sixth electrode in contact with the fifth electrode,

wherein the fifth electrode has a light-transmitting property, and

wherein the sixth electrode has a light-blocking property.

2. A semiconductor device comprising:

a pixel portion over a substrate;

a driver circuit portion over the substrate;

the pixel portion comprising:

a first semiconductor layer comprising a channel formation region;

a first electrode electrically connected to the first semiconductor layer;

a first insulating film over the first semiconductor layer and the first electrode;

a second electrode overlapping with the channel formation region with the first insulating film interposed therebetween;

a second insulating film over the second electrode;

a third electrode over and in contact with the second insulating film, the third electrode having a region overlapping with the entire channel formation region with the second electrode interposed therebetween; and

a fourth electrode over and in contact with the second insulating film, the fourth electrode having the same material as the third electrode,

wherein the second electrode has a region overlapped with the fourth electrode,

wherein the third electrode is in contact with the first electrode through an opening provided in the first insulating film and the second insulating film,

wherein the opening does not overlap with the first semiconductor layer,

wherein each of the second electrode and the third electrode has a light-transmitting property, and

the driver circuit portion comprising:

a second semiconductor layer comprising a channel formation region;

the first insulating film over the second semiconductor layer;

a fifth electrode over the first insulating film; and

a sixth electrode in contact with the fifth electrode,

wherein the fifth electrode has a light-transmitting property, and

wherein the sixth electrode has a light-blocking property.

Priority Claims (1)
JP JP2009-051899 · Mar 5, 2009 · national
Continuity (2)
Continuation 12711667 · Feb 24, 2010
Related Publication 20200219988A1 · Jul 9, 2020
Cited By (5)
US 12,432,981 US 12,433,090 US 12,461,418 US 12,572,046 US 12,696,362