Method and apparatus for processing wafer-shaped articles
An apparatus for processing wafer-shaped articles comprises a rotary chuck and a heating assembly that faces a wafer-shaped article when positioned on the rotary chuck. A liquid dispenser positioned so as to dispense liquid onto a surface of a wafer-shaped article that faces away from the rotary chuck when positioned on the rotary chuck. The heating assembly comprises an array of radiant heating elements distributed among at least five individually controllable groups. The liquid dispenser comprises one or more dispensing orifices configured to move a discharge point from a more central region of the rotary chuck to a more peripheral region of the rotary chuck. A controller controls power supplied to each of the at least five individually controllable groups of radiant heating elements based on a position of the discharge point of the liquid dispenser.
1. A method of processing wafer-shaped articles, comprising:
holding, using a rotary chuck, a wafer-shaped article of a predetermined diameter thereon;
dispensing, using a discharge nozzle of a liquid dispenser, liquid onto a surface of the wafer-shaped article that faces away from a heating assembly when positioned on the rotary chuck, wherein the heating assembly faces the wafer-shaped article when positioned on the rotary chuck, the heating assembly comprising an array of radiant heating elements distributed among at least five individually controllable groups each occupying a respectively different zone extending from a more central region of the rotary chuck to a more peripheral region of the rotary chuck;
moving, using the liquid dispenser, the discharge nozzle of the liquid dispenser from the more central region of the rotary chuck to the more peripheral region of the rotary chuck while the discharge nozzle dispenses liquid; and
controlling, using a controller, power supplied to each of the at least five individually controllable groups of radiant heating elements based on a radial position of the discharge nozzle while the liquid dispenser moves the discharge nozzle from the more central region of the rotary chuck to the more peripheral region of the rotary chuck while the discharge nozzle dispenses liquid.
2. The method of claim 1 , wherein the at least five individually controllable groups of radiant heating elements are arranged concentrically to an axis of rotation of the rotary chuck.
3. The method of claim 1 , further comprising:
a plurality of wires connecting to the array of radiant heating elements.
4. The method of claim 1 , further comprising at least one pin configured to contact an edge of the wafer-shaped article, at least a portion of the at least one pin positioned in a periphery of a plate positioned above the heating assembly.
5. The method of claim 1 , wherein the heating elements are light-emitting diodes (LED) heating elements, the LED heating elements comprising an array of LEDs that is coextensive with the wafer-shaped article.
6. The method of claim 1 , wherein the heating assembly is positioned relative to the rotary chuck so as to heat the wafer shaped article held on the rotary chuck from one side only and without contacting the wafer shaped article.
7. The method of claim 1 , wherein the heating assembly overlies the rotary chuck and is positioned between the rotary chuck and the surface of the wafer-shaped article that faces the rotary chuck when mounted on the rotary chuck.
8. The method of claim 1 , further comprising a plate that is transparent to a wavelength of radiation emitted by the heating elements, the plate being mounted for rotation with the rotary chuck and being positioned between the heating assembly and the wafer-shaped article when positioned on the rotary chuck, wherein the plate is made of quartz or sapphire.
9. The method of claim 1 , wherein the rotary chuck comprises a rotatable chuck body surrounding a central stationary post, and wherein the heating assembly is mounted to the central stationary post.
10. The method of claim 1 , further comprising:
capturing, using a heat sink of the heating assembly, heat from the array of radiant heating elements, wherein the heat sink comprises a substrate positioned to capture the heat and is configured to prevent excessive heating of the array of radiant heating elements.
11. The method of claim 10 , wherein the heat sink comprises aluminum.