Systems and methods for post-treatment of dry adhesive microstructures
Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.
1. A system for manipulating an object, comprising:
a backing layer;
a printed circuit board coupled to said backing layer;
a plurality of microstructure stalks coupled to said backing layer, wherein a microstructure stalk of said plurality of microstructure stalks comprises material doped with a conductive additive; and
a polymer layer disposed at a tip of said microstructure stalk of said plurality of microstructure stalks, wherein a longitudinal axis of said polymer layer is different from a longitudinal axis of said microstructure stalk.
2. The system of claim 1 , wherein said conductive additive comprises a carbon nanotube.
3. The system of claim 1 , wherein said conductive additive comprises carbon black.
4. The system of claim 1 , wherein said conductive additive protrudes from an outer surface of said microstructure stalk as asperities.
5. The system of claim 1 , wherein respective longitudinal axes of each of said plurality of microstructure is oriented substantially along the same direction with respect to a plane of said backing layer.
6. The system of claim 5 , wherein said same direction is not normal to said plane of said backing layer.
7. The system of claim 1 , wherein said longitudinal axis of said polymer layer is substantially parallel to a plane of said backing layer.
8. The system of claim 1 , wherein said microstructure stalk is at most 60 micrometers in height from said backing layer.
9. The system of claim 1 , wherein said printed circuit board comprises a plurality of sensing electrodes, and wherein said plurality of sensing electrodes are configured to detect engagement of said polymer layer with a surface.
10. A method for manipulating an object, comprising:
(a) providing a gripping system comprising (i) a backing layer, (ii) a printed circuit board coupled to said backing layer, and (iii) a plurality of microstructure stalks coupled to said backing layer, wherein a microstructure stalk of said plurality of microstructure stalks comprises material doped with a conductive additive, and (iv) a polymer layer disposed at a tip of said microstructure stalk of said plurality of microstructure stalks, wherein a longitudinal axis of said polymer layer is different from a longitudinal axis of said microstructure stalk; and
(b) contacting a surface of said object with said polymer layer to engage said object.
11. The method of claim 10 , wherein said conductive additive comprises a carbon nanotube.
12. The method of claim 10 , wherein said conductive additive comprises carbon black.
13. The method of claim 10 , wherein said conductive additive protrudes from an outer surface of said microstructure stalk as asperities.
14. The method of claim 10 , wherein respective longitudinal axes of each of said plurality of microstructure is oriented substantially along the same direction with respect to a plane of said backing layer.
15. The method of claim 14 , wherein said same direction is not normal to said plane of said backing layer.
16. The method of claim 10 , wherein said longitudinal axis of said polymer layer is substantially parallel to a plane of said backing layer.
17. The method of claim 10 , wherein said microstructure stalk is at most 60 micrometers in height from said backing layer.
18. The method of claim 10 , wherein said printed circuit board comprises a plurality of sensing electrodes.
19. The method of claim 10 , further comprising using said plurality of sensing electrodes to detect engagement of said polymer layer with said surface of said object.