Optical engine
An optical engine. In some embodiments, the optical engine includes an electronic interfacing component including: an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board, a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements, and a plurality of vias extending from the lower surface to the upper surface.
1. An optical engine, comprising:
an electronic interfacing component comprising:
an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board,
a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements,
a lower redistribution layer on the lower surface and comprising an insulating material and at least one conductive trace,
an upper redistribution layer on the upper surface and comprising an insulating material and at least one conductive trace, and
a plurality of vias extending from the lower surface to the upper surface.
2. The optical engine of claim 1 , wherein:
the electronic interfacing component comprises a through-silicon via die, and
the plurality of vias comprises a plurality of through-silicon vias in the through-silicon via die.
3. The optical engine of claim 2 , wherein the through-silicon via die comprises silicon with a resistivity of at least 30 ohms-cm.
4. The optical engine of claim 1 , wherein the electronic interfacing component comprises a silicon integrated circuit comprising a transistor circuit selected from the group consisting of:
amplifier circuits for receiving and amplifying photodetector signals, and
driver circuits for driving optical modulators.
5. The optical engine of claim 1 , further comprising an opto-electronic device, the opto-electronic device being an element selected from the group consisting of photodetectors and modulators.
6. The optical engine of claim 5 , further comprising a conductive path from a transistor circuit to the opto-electronic device, the conductive path having a length of less than 500 microns.
7. The optical engine of claim 1 , further comprising a silicon photonics integrated circuit, the electronic interfacing component being secured to a top surface of the silicon photonics integrated circuit, the plurality of conductors of the lower surface of the electronic interfacing component being connected to an interconnect layer on the top surface of the silicon photonics integrated circuit.
8. The optical engine of claim 1 , wherein:
the electronic interfacing component comprises a silicon integrated circuit comprising a through-silicon via portion, and
the plurality of vias comprises a plurality of through-silicon vias in the through-silicon via portion.
9. The optical engine of claim 8 , wherein the silicon integrated circuit comprises silicon with a resistivity of at least 30 ohms-cm.
10. The optical engine of claim 8 , wherein the electronic interfacing component comprises a transistor circuit selected from the group consisting of:
amplifier circuits for receiving and amplifying photodetector signals, and
driver circuits for driving optical modulators.
11. The optical engine of claim 8 , further comprising an opto-electronic device, the opto-electronic device being an element selected from the group consisting of photodetectors and modulators.
12. The optical engine of claim 11 , further comprising a conductive path from a transistor circuit to the opto-electronic device, the conductive path having a length of less than 250 microns.
13. An optical engine, comprising:
an electronic interfacing component comprising:
an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board,
a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements,
a silicon integrated circuit or a fanout wafer level package between the lower surface and the upper surface, and
a plurality of vias extending from the lower surface to the upper surface; and
a silicon photonics integrated circuit,
an interconnect layer being on a top surface of the silicon photonics integrated circuit and comprising an insulating material and one or more conductive traces, the electronic interfacing component being secured to the top surface of the silicon photonics integrated circuit, and a conductor of the plurality of conductors of the lower surface of the electronic interfacing component being in contact with a conductive trace of the one or more conductive traces of the interconnect layer.
14. The optical engine of claim 8 , further comprising a silicon photonics integrated circuit, the electronic interfacing component being secured to a top surface of the silicon photonics integrated circuit, the plurality of conductors of the lower surface of the electronic interfacing component being connected to an interconnect layer on the top surface of the silicon photonics integrated circuit.
15. The optical engine of claim 13 , wherein the electronic interfacing component comprises a global interconnect layer at the lower surface of the electronic interfacing component.
16. The optical engine of claim 13 , wherein the optical engine comprises a transistor circuit or an electronic integrated circuit between the lower surface and the upper surface.
17. The optical engine of claim 16 , wherein the silicon photonics integrated circuit comprises an opto-electronic device, and a conductive path from the transistor circuit to the opto-electronic device, or from the electronic integrated circuit to the opto-electronic device, is less than 500 microns.
18. An optical engine, comprising:
an electronic interfacing component comprising:
an upper surface having a plurality of conductors for forming a corresponding plurality of connections to a host board,
a lower surface having a plurality of conductors for forming a corresponding plurality of connections to one or more optoelectronic elements,
a lower redistribution layer on the lower surface and comprising at least one conductive trace, or an upper redistribution layer on the upper surface and comprising at least one conductive trace, and
a plurality of vias extending from the lower surface to the upper surface; and
a silicon photonics integrated circuit,
an interconnect layer being on a top surface of the silicon photonics integrated circuit and comprising an insulating material and one or more conductive traces, the electronic interfacing component being secured to the top surface of the silicon photonics integrated circuit, and a conductor of the plurality of conductors of the lower surface of the electronic interfacing component being in contact with a conductive trace of the one or more conductive traces of the interconnect layer.