Shape memory polymer foams for endovascular therapies
A system for occluding a physical anomaly. One embodiment comprises a shape memory material body wherein the shape memory material body fits within the physical anomaly occluding the physical anomaly. The shape memory material body has a primary shape for occluding the physical anomaly and a secondary shape for being positioned in the physical anomaly.
1. A system comprising:
an open cell, thermoset, shape memory polymer (SMP) foam including cells; and
a retention member configured to retain the SMP foam within an anatomical void;
wherein the SMP foam has a primary form and a compressed secondary form;
wherein (a)(i) the SMP foam substantially surrounds the retention member in a plane that is orthogonal to a central axis of the retention member; (a)(ii) the SMP foam has hysteresis in a modulus temperature curve of the SMP foam; (a)(iii) the hysteresis is based on exposure of the SMP foam to an aqueous environment; and (a)(iv) the SMP foam has an expansion ratio between a volume of the SMP foam in the primary form and a volume of the SMP foam in the compressed secondary form that is between 2 and 200.
2. The system of claim 1 , wherein the retention member comprises at least one of a stent, a diaphragm, a coil, or combinations thereof.
3. The system of claim 2 , wherein the SMP foam has a thermal transition, between a glassy state and a rubbery state, which is higher during heating than during cooling.
4. The system of claim 3 wherein the hysteresis is between 5 degrees Celsius and 50 degrees Celsius.
5. The system of claim 4 wherein the hysteresis is based on plasticization.
6. The system of claim 1 wherein the hysteresis is between 5 degrees Celsius and 50 degrees Celsius.
7. The system of claim 1 wherein the hysteresis is based on plasticization.
8. The system of claim 1 wherein in response to the exposure of the SMP foam to the aqueous environment, the SMP foam is configured to transition from the compressed secondary form to the primary form.
9. The system of claim 8 , wherein the SMP foam includes an actuation temperature of between 20 degrees Celsius and 80 degrees Celsius for transition from the compressed secondary form to the primary form.
10. The system of claim 9 , wherein the SMP foam is in the compressed secondary form.
11. A system comprising:
an open cell, thermoset, shape memory polymer (SMP) foam including cells; and
a retention member configured to retain the SMP foam within an anatomical void;
wherein the SMP foam has a primary form and a compressed secondary form;
wherein (a)(i) the SMP foam substantially surrounds the retention member in a plane that is orthogonal to a central axis of the retention member; (a)(ii) the SMP foam has hysteresis in a modulus temperature curve of the SMP foam; (a)(iii) the hysteresis is based on exposure of the SMP foam to a solvent; and (a)(iv) the SMP foam has an expansion ratio between a volume of the SMP foam in the primary form and a volume of the SMP foam in the compressed secondary form that is between 2 and 200.
12. The system of claim 11 , wherein the retention member comprises at least one of a stent, a diaphragm, a coil, or combinations thereof.
13. The system of claim 12 , wherein the SMP foam has a thermal transition, between a glassy state and a rubbery state, which is higher during heating than during cooling.
14. The system of claim 13 wherein the hysteresis is between 5 degrees Celsius and 50 degrees Celsius.
15. The system of claim 14 wherein the hysteresis is based on plasticization.
16. The system of claim 11 wherein the hysteresis is between 5 degrees Celsius and 50 degrees Celsius.
17. The system of claim 11 wherein the hysteresis is based on plasticization.
18. The system of claim 11 wherein in response to the exposure of the SMP foam to the solvent, the SMP foam is configured to transition from the compressed secondary form to the primary form.
19. The system of claim 18 , wherein the SMP foam includes an actuation temperature of between 20 degrees Celsius and 80 degrees Celsius for transition from the compressed secondary form to the primary form.
20. The system of claim 19 , wherein the SMP foam is in the compressed secondary form.