Raised via for terminal connections on different planes

1. A structure comprising:

a first metal pad and a second metal pad, wherein top surfaces of the first metal pad and the second metal pad are coplanar;

a dielectric layer;

a first metal layer and a second metal layer, each comprising:

a lower portion extending into the dielectric layer to contact a respective pad in the first metal pad and the second metal pad; and

an upper portion higher than the dielectric layer, wherein the upper portion extends laterally beyond respective edges of the lower portion;

a component device overlapping and contacting the first metal layer;

a raised via over and contacting the second metal layer;

an encapsulant encapsulating the raised via and the component device therein;

a third metal pad in the dielectric layer; and

a wire bond structure bonded to the third metal pad, wherein the wire bond structure penetrates through the encapsulant, and the wire bond structure comprises a bond ball and a wire connected to the bond ball.

2. The structure of claim 1 , wherein the component device is a two-terminal device comprising:

a bottom terminal contacting the first metal layer; and

a top terminal at a top surface of the component device.

3. The structure of claim 2 , wherein the bottom terminal is planar, and edges of the bottom terminal are flushed with respective edges of the first metal layer.

4. The structure of claim 3 , wherein the first metal layer has undercuts extending directly underlying edge portions of the bottom terminal, wherein the undercuts are in the upper portion of the first metal layer higher than the dielectric layer.

5. The structure of claim 1 , wherein the upper portion of the first metal layer is inside the encapsulant.

6. The structure of claim 1 , wherein the component device comprises a capacitor.

7. A structure comprising:

a first metal layer and a second metal layer formed of a same material, wherein an entire first top surface of the first metal layer and an entire second top surface of the second metal layer are planar surfaces;

a capacitor overlapping the first metal layer, wherein a first terminal of the capacitor is in contact with the entire first top surface of the first metal layer;

a raised via over and contacting the second metal layer;

an encapsulant, with the capacitor and the raised via being in the encapsulant, wherein top portions of the first metal layer and the second metal layer are in the encapsulant, and wherein the encapsulant physically contacts the first metal layer; and

a redistribution line on the encapsulant, wherein the redistribution line connects a second terminal of the capacitor to the raised via.

8. The structure of claim 7 , wherein the encapsulant physically contacting the capacitor physical also contacts the capacitor to form a first vertical interface, and physically contacts the first metal layer to form a second vertical interface, and wherein the first vertical interface joins the second vertical interface to form a continuous and straight interface.

9. The structure of claim 7 , wherein the first metal layer and the second metal layer comprise lower portions underlying the encapsulant.

10. The structure of claim 9 , wherein the capacitor further comprises a top electrode over and contacting a capacitor insulator of the capacitor, and a bottom electrode underlying and contacting the capacitor insulator, and wherein both of the top electrode and the bottom electrode are in physical contact with the encapsulant.

11. The structure of claim 7 , wherein the second terminal has a ring-shape.

12. The structure of claim 7 , wherein the redistribution line extends into the encapsulant to be in physical contact with the second terminal.

13. The structure of claim 7 , wherein an entirety of the encapsulant is formed of a homogeneous material.

14. The structure of claim 7 further comprising a wire bonding structure comprising:

a bond ball, wherein a first bottom surface of the bond ball is coplanar with a second bottom surface of the raised via; and

a bond wire connected to the bond ball, wherein the wire bonding structure penetrates through the encapsulant.

15. The structure of claim 7 , wherein the entire first top surface of the first metal layer and the entire second top surface of the second metal layer are coplanar.

16. The structure of claim 7 , wherein an entirety of the encapsulant is formed of a homogeneous material with no interface therein.

17. A structure comprising:

a dielectric layer comprising a first top surface;

a layer-stack comprising:

a first portion higher than the dielectric layer, wherein the first portion of the layer-stack comprises a passive device higher than the dielectric layer; and

a second portion extending into the dielectric layer, wherein the layer-stack comprises a first straight edge extending from a second top surface of the passive device to the first top surface of the dielectric layer;

a conductive feature comprising a raised via and a metal layer underlying the raised via, wherein the conductive feature comprises a second straight edge, and wherein the second straight edge is higher than the first top surface of the dielectric layer; and

an encapsulant encapsulating the first portion of the layer-stack and the raised via therein, wherein top ends of both of the first straight edge and the second straight edge are lower than an additional top surface of the encapsulant.

18. The structure of claim 17 , wherein the encapsulant physically contacts the metal layer.

19. The structure of claim 17 further comprising a wire bonding structure comprising:

a bond ball extending into the dielectric layer; and

a bond wire connected to the bond ball, wherein the wire bonding structure penetrates through the encapsulant.

20. The structure of claim 17 , wherein the encapsulant physically contacts both of a first sidewall of the raised via and a second sidewall of the metal layer to form a vertical interface, and the vertical interface extends to a level lower than the first top surface of the metal layer.