Printed circuit board and switching power supply
A printed circuit board has: a first wiring pattern laid in a first layer such that, when a predetermined component is mounted in a predetermined mounting region, a first current path in an open ring shape leading from a first end to a second end is formed; a second wiring pattern laid in a second layer different from the first layer such that a second current path in an open ring shape leading from a third end to a fourth end is formed; a first conductive member formed between the second and third ends; and a second conductive member formed between the first and fourth ends. The first and second wiring patterns are so laid that, as seen in their respective plan views, the directions of the currents flowing across the first and second current paths, respectively, are opposite to each other.
1. A printed circuit board comprising:
a first wiring pattern;
a second wiring pattern;
a first region surrounded by the first wiring pattern; and
a second region surrounded by the second wiring pattern,
wherein
a first current path is formed by the first wiring pattern,
a second current path is formed by the second wiring pattern,
a direction of a current flowing across the first current path and a direction of a current flowing across the second current path are opposite to each other,
the first and second current paths are located above each other in a thickness direction of the printed circuit board,
at least part of the first region and at least part of the second region overlap each other as seen in a plan view of the printed circuit board.
2. The printed circuit board according to claim 1 , further comprising:
a first conductive member connected to the first current path, the first conductive member letting a current flow in a first direction pointing from the first current path to the second current path.
3. The printed circuit board according to claim 1 , wherein
a capacitor is disposed in at least one of the first and second current paths.
4. The printed circuit board according to claim 1 , wherein
a switching device is disposed in at least one of the first and second current paths.
5. The printed circuit board according to claim 1 , wherein
the first and second current paths are both in a shape of an open ring.
6. A switching power supply comprising:
the printed circuit board according to claim 1 ; and
a switching output stage and a bypass capacitor mounted on the printed circuit board to form, along with the first wiring pattern, the first current path.
7. The printed circuit board according to claim 2 , further comprising:
a second conductive member connected to the second current path, the second conductive member letting a current flow in a second direction pointing from the second current path to the first current path.
8. The printed circuit board according to claim 2 , wherein
the first conductive member is connected also to the second current path.
9. The printed circuit board according to claim 7 , wherein
the first and second conductive members are twisted around each other.
10. The printed circuit board according to claim 7 , comprising a plurality of sets each comprising the first wiring pattern, the second wiring pattern, the first conductive member, and the second conductive member.
11. The switching power supply according to claim 6 , wherein
the switching output stage is integrated into a semiconductor device.
12. The switching power supply according to claim 6 , wherein
spectrum spreading is applied to a driving frequency of the switching output stage.
13. An electronic appliance comprising:
the switching power supply according to claim 6 ; and
a load operating by being supplied with electric power from the switching power supply.
14. The printed circuit board according to claim 7 , wherein
the first and second conductive members are located next to each other.
15. The printed circuit board according to claim 7 , wherein
the second conductive member is connected also to the first current path.
16. The switching power supply according to claim 11 , wherein
the bypass capacitor is disposed near the semiconductor device.
17. A switching power supply comprising:
a printed circuit board comprising:
a first wiring pattern;
a second wiring pattern;
a first region surrounded by the first wiring pattern; and
a second region surrounded by the second wiring pattern,
wherein
a first current path is formed by the first wiring pattern,
a second current path is formed by the second wiring pattern,
a direction of a current flowing across the first current path and a direction of a current flowing across the second current path are opposite to each other,
the first and second current paths are located above each other in a thickness direction of the printed circuit board, and
at least part of the first region and at least part of the second region overlap each other as seen in a plan view of the printed circuit board,
the switching power supply further comprising a switching output stage and a bypass capacitor mounted on the printed circuit board to form, along with the first wiring pattern, the first current path,
wherein
the switching output stage includes a plurality of switching elements, and
the plurality of switching elements, together with the first wiring pattern, surround the first region.