Semiconductor memory device

1. A semiconductor memory device, comprising:

a semiconductor substrate having a surface extending in a first direction and a second direction crossing the first direction,

a plurality of transistors formed in the surface of the semiconductor substrate, the transistors being arranged periodically along the first direction,

a first stacked body including a plurality of first electrode films stacked to be separated from each other along a third direction crossing the first direction and the second direction, the first stacked body including a first portion which has a staircase-like configuration and a second portion which is adjacent to the first portion in the first direction,

a second stacked body including a plurality of second electrode films stacked to be separated from each other along the third direction and being adjacent to the first stacked body in the second direction, the second stacked body including a third portion which has a staircase-like configuration and at least partially overlaps with the transistors when viewed in the third direction and a fourth portion which is adjacent to the third portion in the first direction,

a plurality of first semiconductor members each piercing the first electrode films from an upper most one thereof to a lower most one thereof,

a plurality of second semiconductor members each piercing the second electrode films from an upper most one thereof to a lower most one thereof,

a plurality of first charge storage members provided between the first semiconductor members and the first electrode films, respectively,

a plurality of second charge storage members provided between the second semiconductor members and the second electrode films, respectively,

a first contact having one end which is connected to one of the first electrode films, the first contact overlapping with the first portion when viewed in the third direction,

a second contact having one end which is connected to a source or a drain of one of the transistors, the second contact overlapping with the third portion when viewed in the third direction, and

a first interconnect connecting between the other end of the first contact and the other end of the second contact.

2. The semiconductor memory device according to claim 1 , wherein the first interconnect connects the other end of the first contact and the other end of the second contact to stride over a boundary between the first stacked body and the second stacked body.

3. The semiconductor memory device according to claim 2 , wherein the first interconnect strides over a boundary between the first portion and the third portion.

4. The semiconductor memory device according to claim 1 , wherein

in the first portion, each of the first electrode films is exposed toward one side in the third direction from the remaining first electrode films, and

in the third portion, each of the second electrode films is exposed toward the one side in the third direction from the remaining second electrode films.

5. The semiconductor memory device according to claim 4 , wherein each of the first portion and the third portion has a plurality of terraces, the terraces including a plurality of first terraces and a second terrace such that a length of one of the first terraces in the first direction is shorter than a first period of the transistors.

6. The semiconductor memory device according to claim 5 , wherein

a lower end of the first contact is connected to the one of the first electrode films at one of the terraces of the first portion, and

the second contact pierces the second stacked body at the third portion, a lower end of the second contact being connected to the source or the drain of the one of the transistors.

7. The semiconductor memory device according to claim 6 , wherein

a second region and two first regions are arranged along the first direction in the first portion, the second region being disposed between the two first regions,

the plurality of first terraces is disposed in each of the first regions,

the second terrace is disposed in the second region,

a length in the first direction of the second terrace is longer than the first period, and

a length in the first direction of one of the plurality of first terraces is shorter than the first period.

8. The semiconductor memory device according to claim 5 , further comprising:

a first chip in which the first stacked body and the second stacked body are formed; and

a second chip in which the transistors are formed.

9. The semiconductor memory device according to claim 8 , wherein

the first chip further includes a first pad,

the second chip further includes a second pad, and

the first chip and the second chip face each other such that the first pad is connected to the second pad.

10. The semiconductor memory device according to claim 9 , further comprising a bump connected between the first pad and the second pad.

11. The semiconductor memory device according to claim 9 , further comprising a pillar connected between the first pad and the second pad, the pillar being conductive.

12. The semiconductor memory device according to claim 9 , wherein the first pad contacts the second pad.

13. The semiconductor memory device according to claim 9 , wherein the first chip further includes a bit line connected to an end in the third direction of a corresponding one of the first semiconductor members and a corresponding one of the second semiconductor members, the bit line extending in the second direction.

14. The semiconductor memory device according to claim 9 , wherein

the first chip further includes a first semiconductor substrate and a first insulating film formed to cover an upper surface of the first semiconductor substrate, the first pad being exposed from the first insulating film, and

the second chip further includes a second semiconductor substrate and a second insulating film formed to cover a lower surface of the second semiconductor substrate, the second pad being exposed from the second insulating film.

15. The semiconductor memory device according to claim 9 , wherein

in the first chip, the first contact is provided in a plurality correspondingly with the first electrode films at the first portion, and the first pad is provided in a plurality correspondingly with the first contacts, and

in the second chip, the second contact is provided in a plurality correspondingly with the transistors, and the second pad is provided in a plurality correspondingly with the second contacts.

16. The semiconductor memory device according to claim 15 , wherein

the first pads are arranged in an array manner when viewed in the third direction, and

the second pads are arranged in an array manner when viewed in the third direction.

17. The semiconductor memory device according to claim 1 , wherein

in the first portion, an uppermost one of the first electrode films forms a step,

in the second portion, an uppermost one of the first electrode films which has the same position in the third direction with the uppermost one of the first electrode films in the first portion, and which is isolated from the uppermost one of the first electrode film in the first portion,

in the third portion, an uppermost one of the second electrode films forms a step, and

in the fourth portion, an uppermost one of the second electrode films which has the same position in the third direction with the uppermost one of the second electrode films in the third portion, and which is isolated from the uppermost one of the second electrode films in the third portion.

18. The semiconductor memory device according to claim 1 , wherein the staircase-like configuration of the second portion of the first stacked body and the staircase-like configuration of the third portion of the second stacked body are a line symmetric with a line extending in the first direction when viewed in the third direction.

19. The semiconductor memory device according to claim 1 , wherein

the interconnect is disposed above the plurality of first electrode films and the plurality of second electrode films in the third direction, and

the semiconductor substrate is disposed below the plurality of first electrode films and the plurality of second electrode films in the third direction.

20. A semiconductor memory device, comprising:

a semiconductor substrate having a surface extending in a first direction and a second direction crossing the first direction,

a plurality of transistors formed in the surface of the semiconductor substrate, the transistors being arranged periodically along the first direction,

a plurality of stacked bodies arranged along the second direction above the transistors in a third direction crossing the first direction and the second direction, each of the stacked bodies including a plurality of first electrode films stacked along the third direction to form a first portion which has a staircase-like configuration and a second portion which is adjacent to the first portion in the first direction,

a plurality of semiconductor members each piercing the first electrode films of a corresponding one of the stacked bodies from an upper most one thereof to a lower most one thereof,

a plurality of charge storage members provided between the first semiconductor members and the first electrode films, respectively,

a first contact having one end which is connected to one of the first electrode films of a first one of the stacked bodies, the first contact overlapping with the first portion of the first one of the stacked bodies when viewed in the third direction,

a second contact having one end which is connected to a source or a drain of one of the transistors, the second contact overlapping with the third portion of a second one of the stacked bodies adjacent to the first one of the stacked bodies in the second direction when viewed in the third direction, and

a first interconnect connecting between the other end of the first contact and the other end of the second contact.