Non-planar semiconductor packaging systems and related methods
Implementations of a packaging system may include a wafer; and a curvature adjustment structure coupled thereto where the curvature adjustment structure may be configured to alter a curvature of a largest planar surface of the wafer.
1. A packaging system comprising:
a wafer; and
a curvature adjustment structure permanently coupled thereto;
wherein the curvature adjustment structure is configured to induce a curvature of a largest planar surface of the wafer.
2. The packaging system of claim 1 , wherein the curvature adjustment structure comprises a wheel and spoke structure.
3. The packaging system of claim 2 , wherein the wheel and spoke structure comprises at least two spokes.
4. The packaging system of claim 1 , wherein the curvature adjustment structure comprises two or more strips coupled across the largest planar surface of the wafer.
5. The packaging system of claim 1 , wherein the curvature adjustment structure comprises two or more intersecting strips comprised on the largest planar surface of the wafer.
6. The packaging system of claim 1 , wherein at least a portion of the curvature adjustment structure is positioned on an edge of the largest planar surface of the wafer.
7. The packaging system of claim 1 , wherein at least a portion of the curvature adjustment structure is comprised on an interior surface of the largest planar surface of the wafer.
8. A packaging system comprising:
a wafer; and
an organic material permanently bonded to a largest planar surface of the wafer;
wherein the organic material is configured to increase a curvature of the largest planar surface of the wafer.
9. The packaging system of claim 8 , wherein the organic material comprises a wheel and spoke structure.
10. The packaging system of claim 9 , wherein the wheel and spoke structure comprises at least two spokes.
11. The packaging system of claim 8 , wherein the organic material comprises two or more strips coupled across the largest planar surface of the wafer.
12. The packaging system of claim 8 , wherein the organic material comprises two or more intersecting strips comprised on the largest planar surface of the wafer.
13. The packaging system of claim 8 , wherein at least a portion of the organic material is positioned on an edge of the largest planar surface of the wafer.
14. The packaging system of claim 8 , wherein at least a portion of the organic material is comprised on an interior surface of the largest planar surface of the wafer.
15. A packaging system comprising:
a wafer; and
an organic material permanently bonded to a largest planar surface of the wafer;
wherein the organic material is configured to deflect at least a portion of the largest planar surface of the wafer and increase curvature in the largest planar surface of the wafer.
16. The packaging system of claim 15 , wherein the organic material comprises a wheel and spoke structure.
17. The packaging system of claim 15 , wherein the organic material comprises two or more strips coupled across the largest planar surface of the wafer.
18. The packaging system of claim 15 , wherein the organic material comprises two or more intersecting strips comprised on the largest planar surface of the wafer.
19. The packaging system of claim 15 , wherein at least a portion of the organic material is positioned on an edge of the largest planar surface of the wafer.
20. The packaging system of claim 15 , wherein at least a portion of the organic material is comprised on an interior surface of the largest planar surface of the wafer.