Solid state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus
The present technique aims to provide a solid-state imaging device that reduces shading and color mixing between pixels. The present invention also provides a method of manufacturing the solid-state imaging device. The present technique further relates to a solid-state imaging device that enables provision of an electronic apparatus that uses the solid-state imaging device, a method of manufacturing the solid-state imaging device, and an electronic apparatus. The solid-state imaging device includes a substrate, pixels each including a photoelectric conversion unit formed in the substrate, and a color filter layer formed on the light incidence surface side of the substrate. The solid-state imaging device also includes a device isolating portion that is formed to divide the color filter layer and the substrate for the respective pixels, and has a lower refractive index than the refractive indexes of the color filter layer and the substrate.
1. An imaging device comprising:
a semiconductor substrate;
a first photoelectric conversion region disposed in the semiconductor substrate;
a second photoelectric conversion region disposed in the semiconductor substrate adjacent to the first photoelectric conversion region;
a first color filter disposed over the first photoelectric conversion region;
a second color filter disposed over the second photoelectric conversion region;
a groove portion disposed in the semiconductor substrate between the first photoelectric conversion region and the second photoelectric conversion region;
a first insulating film disposed in the groove portion; and
a first air gap disposed between the first color filter and the second color filter.
2. The imaging device of claim 1 , wherein the groove portion forms a second air gap between the first photoelectric conversion region and the second photoelectric conversion region.
3. The imaging device of claim 2 , wherein the second air gap is disposed at an inner side of the first insulating film in the groove portion.
4. The imaging device of claim 2 , wherein the first insulating film is disposed on two sides of the groove portion in a cross-sectional view.
5. The imaging device of claim 4 , wherein the second air gap is disposed between the two sides of the first insulating film in the groove portion in the cross-sectional view.
6. The imaging device of claim 2 , further comprising:
a second insulating film disposed between the first air gap and the first color filter.
7. The imaging device of claim 6 , wherein the second insulating film contacts the first color filter.
8. The imaging device of claim 6 , further comprising:
a third insulating film disposed above the first photoelectric conversion region.
9. The imaging device of claim 8 , wherein the first insulating film includes a fixed charge film.
10. The imaging device of claim 8 , wherein the third insulating film includes a fixed charge film.
11. The imaging device of claim 8 , wherein the first insulating film and the third insulating film include a same material.
12. An electronic apparatus, comprising:
a signal processing circuit; and
an imaging device including:
a semiconductor substrate;
a first photoelectric conversion region disposed in the semiconductor substrate;
a second photoelectric conversion region disposed in the semiconductor substrate adjacent to the first photoelectric conversion region;
a first color filter disposed over the first photoelectric conversion region;
a second color filter disposed over the second photoelectric conversion region;
a groove portion disposed in the semiconductor substrate between the first photoelectric conversion region and the second photoelectric conversion region;
a first insulating film disposed in the groove portion; and
a first air gap disposed between the first color filter and the second color filter.
13. The electronic apparatus of claim 12 , wherein the groove portion forms a second air gap between the first photoelectric conversion region and the second photoelectric conversion region.
14. The electronic apparatus of claim 13 , wherein the second air gap is disposed at an inner side of the first insulating film in the groove portion.
15. The electronic apparatus of claim 13 , wherein the first insulating film is disposed on two sides of the groove portion in a cross-sectional view.
16. The electronic apparatus of claim 15 , wherein the second air gap is disposed between the two sides of the first insulating film in the groove portion in the cross-sectional view.
17. The electronic apparatus of claim 13 , further comprising:
a second insulating film disposed between the first air gap and the first color filter.
18. The electronic apparatus of claim 17 , wherein the second insulating film contacts the first color filter.