Sub-module L-shaped millimeter wave antenna-in-package
An antenna-in-package (AiP) module is described. The AiP module includes an antenna sub-module. The antenna sub-module is composed of a first package substrate including an antenna side surface having a first group of antennas placed along a first portion of the antenna side surface and a second group of antennas placed along a second portion of the antenna side surface. The first package substrate is composed of a non-linear portion between the first group of antennas and the second group of antennas. The AiP module includes an active circuit sub-module placed on an active side surface of the first package substrate opposite the first group of antennas or the second group of antennas on the antenna side surface of the first package substrate.
1. An antenna-in-package (AiP) module, comprising:
an antenna sub-module, comprising a first package substrate including an antenna side surface having a first group of antennas placed along a first portion of the antenna side surface and a second group of antennas placed along a second portion of the antenna side surface, in which the first package substrate comprises a non-linear portion between the first group of antennas and the second group of antennas; and
an active circuit sub-module placed on an active side surface of the first package substrate opposite the first group of antennas or the second group of antennas on the antenna side surface of the first package substrate, in which the active circuit sub-module comprises:
a second package substrate,
a radio frequency integrated circuit (RFIC) on an active surface of the second package substrate and/or a power management integrated circuit (PMIC) on the active surface of the second package substrate,
an electromagnetic interference shield on the active surface of the second package substrate and encapsulating the RFIC and/or the PMIC, and
package interconnects on a passive surface of the second package substrate to couple the active surface of the first package substrate.
2. The AiP module of claim 1 , in which the first package substrate comprises flexible printed circuit board (PCB) layers.
3. The AiP module of claim 1 , in which the first package substrate comprises L-shaped, rigid printed circuit board (PCB) layers.
4. The AiP module of claim 1 , in which the first group of antennas and the second group of antennas comprise patch antennas to cover a first antenna direction and a second antenna direction.
5. The AiP module of claim 1 , in which the non-linear portion of the first package substrate comprises an exposed portion of the antenna side surface and an exposed portion of the active side surface opposite the antenna side surface.
6. The AiP module of claim 1 , in which the package interconnects comprise a ball grid array coupling the passive surface of the second package substrate to the active surface of the first package substrate.
7. The AiP module of claim 1 , in which the second package substrate comprises a printed circuit board (PCB).
8. The AiP module of claim 1 , in which the first group of antennas and the second group of antennas comprise dipole antennas to cover a first antenna direction and a second antenna direction.
9. The AiP module of claim 1 , further comprising a second AiP module placed at a different edge of a user equipment to cover four antenna directions.
10. An antenna-in-package (AiP) module, comprising:
an antenna sub-module, comprising a first package substrate including an antenna side surface having a first group of antennas placed along a first portion of the antenna side surface and a second group of antennas placed along a second portion of the antenna side surface, in which the first package substrate comprises means for bending between the first group of antennas and the second group of antennas; and
an active circuit sub-module placed on an active side surface of the first package substrate opposite the first group of antennas or the second group of antennas on the antenna side surface of the first package substrate, in which the active circuit sub-module comprises:
a second package substrate,
a radio frequency integrated circuit (RFIC) on an active surface of the second package substrate and/or a power management integrated circuit (PMIC) on the active surface of the second package substrate,
an electromagnetic interference shield on the active surface of the second package substrate and encapsulating the RFIC and/or the PMIC, and
package interconnects on a passive surface of the second package substrate to couple the active surface of the first package substrate.
11. The AiP module of claim 10 , in which the first group of antennas and the second group of antennas comprise patch antennas to cover a first antenna direction and a second antenna direction.
12. The AiP module of claim 10 , in which the package interconnects comprise a ball grid array coupling the passive surface of the second package substrate to the active surface of the first package substrate.
13. The AiP module of claim 10 , in which the second package substrate comprises a printed circuit board (PCB).
14. The AiP module of claim 10 , in which the first group of antennas and the second group of antennas comprise dipole antennas to cover a first antenna direction and a second antenna direction.
15. The AiP module of claim 10 , further comprising a second AiP module placed at a different edge of a user equipment to cover four antenna directions.
16. A method of fabricating an antenna-in-package (AiP) module, the method comprising:
placing a first group of antennas along a first portion of an antenna side surface of a first package substrate;
placing a second group of antennas along a second portion of the antenna side surface of the first package substrate, in which the first package substrate comprises a non-linear portion between the first group of antennas and the second group of antennas of an antenna sub-module; and
forming an active circuit sub-module on an active side surface of the first package substrate opposite the first group of antennas or the second group of antennas on the antenna side surface of the first package substrate by:
forming a radio frequency integrated circuit (RFIC) on an active surface of a second package substrate and/or a power management integrated circuit (PMIC) on the active surface of the second package substrate,
forming an electromagnetic interference shield on the active surface of the second package substrate and encapsulating the RFIC and/or the PMIC, and
forming package interconnects on a passive surface of the second package substrate to couple the active surface of the first package substrate.
17. The method of claim 16 , in which the first group of antennas and the second group of antennas are placed to cover a first antenna direction and a second antenna direction.