Method for making electronic package
A method for making an electronic package is provided. The method includes providing a substrate strip comprising substrate assemblies, each substrate assembly comprises a first substrate and a second substrate connected to the first substrate via a flexible link, the first substrate comprises a first mounting surface, the second substrate comprises a second mounting surface that is not at a same side of the substrate assembly as the first mounting surface; disposing the substrate strip on a first carrier; attaching a first electronic component onto the first mounting surface; disposing the substrate strip on a second carrier with a plurality of cavities, the first electronic component is received within one of the plurality of cavities; attaching a second electronic component onto the second mounting surface; singulating the substrate assemblies from each other; and bending the flexible link to form an angle between the first substrate and the second substrate.
1 . A method for making an electronic package, the method comprising:
providing a substrate strip comprising a plurality of substrate assemblies, wherein each substrate assembly comprises a first substrate and a second substrate that is connected to the first substrate via a flexible link, and wherein the first substrate of each substrate assembly comprises a first mounting surface and the second substrate of each substrate assembly comprises a second mounting surface that is not at a same side of the substrate assembly as the first mounting surface;
disposing the substrate strip on a first carrier such that the first mounting surface of each first substrate is facing away from the first carrier and the second mounting surface of each second substrate is facing towards the first carrier;
attaching a first electronic component onto the first mounting surface of each first substrate;
disposing the substrate strip on a second carrier with a plurality of cavities, such that the first mounting surface of each first substrate is facing towards the second carrier and the second mounting surface of the second substrate is facing away from the second carrier, and the first electronic component attached onto each first substrate is received within one of the plurality of cavities;
attaching a second electronic component onto the second mounting surface of each second substrate;
singulating the plurality of substrate assemblies from each other; and
bending the flexible link of each substrate assembly to form an angle between the first substrate and the second substrate of each substrate assembly.
2 . The method of claim 1 , wherein before attaching the first electronic component onto the first mounting surface of each first substrate, the method further comprises:
forming a plurality of bumps over the first mounting surface of each first substrate.
3 . The method of claim 1 , wherein the first carrier comprises a substrate strip cavity to receive the substrate strip.
4 . The method of claim 1 , attaching the first electronic component onto the first mounting surface of each first substrate further comprises:
disposing a first substrate mask having a plurality of first openings on the substrate strip, wherein each first opening is aligned with the first substrate of each substrate assembly to expose the first mounting surface;
mounting the first electronic component onto the first mounting surface of each first substrate through the corresponding first opening; and
removing the first substrate mask from the first carrier.
5 . The method of claim 1 , wherein before attaching the second electronic component onto the second mounting surface of each second substrate, the method further comprises:
forming a plurality of bumps over the second mounting surface of each second substrate.
6 . The method of claim 1 , wherein attaching the second electronic component onto the second mounting surface of each second substrate further comprises:
disposing a second substrate mask having a plurality of second openings on the substrate strip, wherein each second opening is aligned with the second substrate of a substrate assembly to expose the second mounting surface;
mounting the second electronic component onto the second mounting surface of each second substrate through the corresponding second opening; and
removing the second substrate mask from the second carrier.
7 . The method of claim 1 , wherein the first electronic component is an antenna.
8 . The method of claim 1 , wherein the second electronic component is an electronic package.
9 . The method of claim 1 , wherein each of the plurality of cavities has a depth greater than a height of the first electronic component.