Steam treatment stations for chemical mechanical polishing system
An apparatus for steam treatment of a carrier head or a substrate in a chemical mechanical polishing system includes a load cup, a pedestal in a cavity defined by the load cup, the pedestal configured to receive a substrate from or supply a substrate to a carrier head, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into the cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.
1. An apparatus for steam treatment of a carrier head or a substrate in a chemical mechanical polishing system, comprising:
a load cup;
a pedestal in a cavity defined by the load cup, the pedestal configured to receive a substrate from or supply a substrate to a carrier head;
a boiler to generate steam;
one or more nozzles positioned to direct steam inwardly into the cavity defined by the load cup; and
a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.
2. The apparatus of claim 1 , comprising a motor to rotate the carrier head when the carrier head is within the load cup.
3. The apparatus of claim 1 , comprising an actuator to lift or lower the carrier head within the load cup.
4. The apparatus of claim 1 , comprising a temperature sensor to monitor a temperature of the carrier head and/or substrate.
5. The apparatus of claim 4 , comprising a controller configured to receive the temperature from the sensor and to halt a flow of steam when the carrier head or substrate reaches a target temperature.
6. The apparatus of claim 1 , further comprising a controller configured to start a timer when the steam begins to flow onto the carrier head or substrate and to halt the flow of steam when the timer expires.
7. The apparatus of claim 1 , wherein the one or more nozzles include a first nozzle, and further comprising a controller configured to cause steam to flow through the first nozzle onto an outer surface of the carrier head when the carrier head is positioned in the load cup.
8. The apparatus of claim 1 , wherein the one or more nozzles include a second nozzle, and further comprising a controller configured to cause steam to flow through the second nozzle onto an interior surface of the carrier head when the substrate is positioned on the pedestal.
9. The apparatus of claim 8 , wherein the controller is configured to cause steam to flow through the second nozzle onto a bottom surface of the substrate when the substrate is loaded in the carrier head.
10. The apparatus of claim 1 , wherein the one or more nozzles comprise a third nozzle, and further comprising a controller configured to cause steam to flow through the third nozzle onto a top surface of the substrate when the substrate is positioned on the pedestal.
11. The apparatus of claim 10 , wherein the one or more nozzles include a fourth nozzle, and wherein the controller is configured to cause steam to flow through the fourth nozzle onto a bottom surface of the substrate when the substrate is positioned on the pedestal.