Granted Patent B2

US 12,629,796 · App. 18/305,793 · Granted May 19, 2026

Inventors: Haosheng Wu (San Jose, CA); Jianshe Tang (San Jose, CA); Hari Soundararajan (Sunnyvale, CA); Shou-Sung Chang (Mountain View, CA); Paul D. Butterfield (San Jose, CA); Hui Chen (San Jose, CA); Chih Chung Chou (San Jose, CA); Alexander John Fisher (Santa Clara, CA)

Assignee: Applied Materials, Inc.

B24B53/017B08B3/00B24B53/005B24B57/02B24B41/061

Abstract

Claims (16)

1 . A chemical mechanical polishing system, comprising:

a platen to support a polishing pad;

a sensor to monitor a temperature of the polishing pad;

a boiler;

a component that is moveable between a first position spaced from the polishing pad and a second position in contact with the polishing pad;

a plurality of nozzles to direct heated fluid from the boiler onto the component of the polishing system when located at the first position, wherein said heated fluid comprises steam;

an actuator to move the component from the first position spaced from the polishing pad to the second position in contact with the polishing pad; and

a controller configured to

cause the nozzles to direct the heated fluid onto the component to raise a temperature of the component to an elevated temperature that exceeds the temperature of the polishing pad,

cause the actuator to move the component from the first position into contact with the polishing pad before the component returns to an ambient temperature, and

cause the temperature of the component to reach the elevated temperature such that the component cools to the same or substantially the same temperature as the polishing pad as the component moves from the first position to the second position.

2 . The system of claim 1 , wherein the component comprises a carrier head.

3 . The system of claim 2 , wherein the plurality of nozzles are located in a substrate transfer station.

4 . The system of claim 1 , wherein the controller is configured to calculate a target temperature based on a measured temperature from the sensor.

5 . The system of claim 1 , wherein the controller is configured to set a timer and to halt delivery of the heated fluid at expiration of the timer.

6 . The system of claim 1 , wherein the heated fluid has a temperature of 70-100° C.

Assignments (1)

Continuity (3)

References Cited (179)