Steam treatment stations for chemical mechanical polishing system

1. An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system, comprising:

a cleaning cup having a cavity that is open at top and that is sized and positioned to receive the conditioner head of the chemical mechanical polishing system;

a boiler to generate steam;

one or more nozzles positioned to direct steam inwardly into the cavity defined by the cleaning cup and onto the conditioner head and/or the conditioner disk held by the conditioner head when positioned in the cleaning cup; and

a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

2. The apparatus of claim 1 , further comprising the conditioner head, and wherein the conditioner head is rotatable within the cleaning cup.

3. The apparatus of claim 1 , further comprising a vertically actuatable drive shaft to lift and lower the conditioner head within the cleaning cup.

4. The apparatus of claim 1 , comprising a temperature sensor to monitor a temperature of the conditioner head and/or conditioner disk.

5. The apparatus of claim 4 , comprising a controller configured to receive the temperature from the sensor and to halt a flow of steam to the conditioner head or conditioner disk when the conditioner head or conditioner disk reaches a target temperature.

6. The apparatus of claim 1 , further comprising a controller configured to start a timer when the steam begins to flow onto conditioner head or conditioner disk and to halt the flow of steam when the timer expires.

7. The apparatus of claim 1 , wherein the one or more nozzles include a first nozzle, and further comprising a controller is configured to cause steam to flow through the first nozzle onto a bottom surface of the conditioner disk when the conditioner head is positioned in the cleaning cup.

8. The apparatus of claim 1 , wherein the one or more nozzles include a second nozzle, and further comprising a controller configured to cause steam to flow through the second nozzle onto an outer surface of the conditioner head when the conditioner head is positioned in the cleaning cup.

9. The apparatus of claim 1 , wherein at least one nozzle of the one or more nozzles is located on a floor of the cleaning cup.

10. The apparatus of claim 1 , wherein at least one nozzle of the one or more nozzles is located on a side wall of the cleaning cup.

11. A chemical mechanical polishing system, comprising:

a platen to support a polishing pad;

a carrier head to hold a substrate in contact with the polishing pad;

a conditioner system including a base and a conditioner head configured to hold a conditioner disk, the conditioner head connected to the base by a movable arm;

a cleaning cup having a cavity that is open at top and that is sized and positioned to receive the conditioner head, wherein the conditioner head is movable by the arm from a first position over the polishing pad to a second position over the cleaning cup;

a boiler to generate steam;

one or more nozzles positioned to direct steam inwardly into the cavity defined by the cleaning cup and onto the conditioner head and/or the conditioner disk held by the conditioner head when positioned in the cleaning cup; and

a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.

12. The system of claim 11 , further comprising a vertically actuatable drive shaft to lift the conditioner head out of the cleaning cup and lower the conditioner head into the cleaning cup.

13. The system of claim 11 , wherein the cleaning cup is vertically actuatable such that the cleaning cup is liftable to surround the conditioner head and lowerable below the conditioner head.

14. The system of claim 11 , wherein at least one nozzle of the one or more nozzles is located on a floor of the cleaning cup.

15. The system of claim 11 , wherein at least one nozzle of the one or more nozzles is located on a side wall of the cleaning cup.