IP Library Granted Patent US 12,473,129
Granted Patent B2
US 12,473,129 · App. 16/900,353 · Granted Nov 18, 2025

Film-wrapped type hot melt adhesive

Inventors: Takeshi Kiyohara (Osaka, JP); Shigekazu Saito (Osaka, JP); Takanori Okuda (Osaka, JP)
Assignee: HENKEL AG & CO. KGaA
B65D65/38B65B3/04B65B63/08C08L23/06C09J5/06C09J7/241C09J7/245C09J9/00B65B25/06C08L2203/16C08L2205/02C08L2205/025C08L2207/06C08L2314/02C08L2314/06
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Quick Facts
Patent No.
US 12,473,129
App. No.
16/900,353
Granted
Nov 18, 2025
Kind
B2
Abstract

Disclosed is a film-wrapped type hot melt adhesive, comprising: a film made from a thermoplastic resin composition and a hot melt adhesive wrapped by the film, wherein the thermoplastic resin composition comprises an ethylene homopolymer, and a concavo-convex is formed on a surface of the film. The film-wrapped type hot melt adhesive has blocking resistance and thermal stability which are improved in a balanced manner.

Claims (14)

1 . A film-wrapped hot melt adhesive, comprising:

a film, comprising an ethylene homopolymer present in an amount of from 90 parts by weight to 100 parts by weight, inclusive, based on the total weight of the film; and

a block of hot melt adhesive, the block of hot melt adhesive being olefin-based or thermoplastic block copolymer-based, wherein:

the film wraps the block of hot melt adhesive and is in direct contact with the block of hot melt adhesive,

the film has an embossed concavo-convex pattern comprising concave portions and convex portions,

a height of the convex portions is between 100 microns and 500 microns, inclusive,

a depth of the concave portions is between 100 microns and 500 microns, inclusive,

a thickness of the film is between 30 and 150 microns, inclusive,

the thickness of the film is less than the height of the convex portions and less than the depth of the concave portions, and

the film has a melting point of from 70° C. to 120° C., wherein the melting point of the film is less than a melt processing temperature of the block of hot melt adhesive.

2 . The film-wrapped hot melt adhesive of claim 1 , wherein the film further comprises at least one of an ethylene-vinyl acetate copolymer, an ethylene-(meth)acrylate copolymer, or a propylene homopolymer.

3 . The film-wrapped hot melt adhesive of claim 1 , wherein the block of hot melt adhesive is olefin-based.

4 . The film-wrapped hot melt adhesive of claim 1 , wherein the block of hot melt adhesive is thermoplastic block copolymer-based.

5 . The film-wrapped hot melt adhesive of claim 1 , wherein the melt processing temperature of the block of hot melt adhesive is about 150° C.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 13, 2025
From: HENKEL JAPAN LTD.
To: HENKEL AG & CO. KGAA
Reel/Frame 072546/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2025
From: KIYOHARA, TAKESHI; OKUDA, TAKANORI; SAITO, SHIGEKAZU
To: HENKEL JAPAN LTD.
Reel/Frame 072391/0594 →
Priority Claims (1)
JP 2017-241611 · Dec 18, 2017 · national
Continuity (2)
Continuation PCTJP2018044857 · Dec 6, 2018
Related Publication 20200307880A1 · Oct 1, 2020
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