Hot-melt adhesive composition intended to form a film suitable for wrapping a hot-melt adhesive product, and its use

1. Hot-melt adhesive composition intended to form a film, the composition comprising, by weight with respect to the total weight of the composition:

a) from 20 to 60% of at least one styrene block copolymer, chosen from the group formed by the triblock copolymers of formula A-B-A in which A represents a non-elastomeric styrene block (or polystyrene) and B represents a totally or partially hydrogenated polybutadiene elastomeric block, the diblock copolymers of formula A-B in which A and B are as defined previously, and their mixtures;

b) from 5 to 55% of at least one tackifying resin having a number-average molecular weight comprised between 200 Da and 10 kDa (determined by gel permeation chromatography—GPC—with polystyrene standard), and chosen from the group formed by the resins capable of being obtained:

i) by hydrogenation, polymerization or copolymerization (with or without aromatic hydrocarbon) from mixtures of unsaturated aliphatic hydrocarbons having approximately 5 or 9 carbon atoms, and originating from petroleum cuts, and

ii) by polymerisation of terpenic hydrocarbons in the presence of Friedel-Crafts catalysts, and

iii) by polymerization, followed optionally by at least partial hydrogenation, of alpha methylstyrene units and optionally styrene;

c) from 10 to 40% of at least one wax having a melting point from 75 to 125° C. and a number-average molecular weight from 500 to 1500 Da (determined by gel permeation chromatography—GPC—with polystyrene standard); and

d) from 1 to 30% of at least one constituent chosen from polyethylene waxes and polyolefins polymerized by metallocene catalysis;

said composition having a Brookfield viscosity at 180° C. comprised within a range from 3,000 to 70,000 mPa·s, a softening point comprised within a range from 80 to 130° C. and a modulus of elasticity at 60° C., comprised within a range from 2×10 5 to 10 8 Pa, as measured by rheological scanning test at a temperature from 150° C. to 10° C. at 10° C./min and at the constant oscillation frequency of 10 rad/s.

2. Composition according to claim 1 , such that it has an intersection point of the moduli of elasticity and viscosity by rheological scanning test at a temperature of 150 to 10° C. at 10° C./min and at the constant oscillation frequency of 10 rad/s, comprised within a range from 70 to 100° C.

3. Composition according to claim 1 , such that it has moreover a DSC enthalpy of fusion comprised within the range from 40 to 100 J/g.

4. Composition according to claim 1 , such that constituent a) has a weight-average molecular weight M W comprised between 5 kDa and 500 kDa (determined by gel permeation chromatography—GPC—with polystyrene standard), and a styrenes content of the styrene block copolymer generally comprised within a range from 10 to 50%.

5. Composition according to claim 1 , such that constituent a) is a mixture of diblock copolymers and triblock copolymers having the same elastomeric block B, the content of diblock copolymers in the mixture of styrene block copolymers being comprised within a range from 0 to 80%.

6. Composition according to claim 1 , such that constituent a) is a SEBS type copolymer.

7. Composition according to claim 6 , such that constituent a) contains moreover from 0 to 15% of at least one SBC copolymer from a category other than SEBS copolymer.

8. Composition according to claim 1 , such that the tackifying resin is chosen from the group formed by the tackifying resins belonging to the following category i) or ii) and/or from the group of tackifying resins belonging to the following category iii):

i) hydrocarbon resins with C 5 units; DCPD (dicyclopentadiene) hydrogenated resins; C 9 modified DCPD hydrogenated resins; C 9 -modified hydrocarbon resins with C 5 units; hydrogenated resins with C 5 units;

ii) Terpene resins;

iii) The at least partially hydrogenated C 9 type aromatic resins.

9. Composition according to claim 1 , such that constituent a) is a Fischer-Tropsch type wax.

10. Composition according to claim 1 , characterized in that it comprises moreover from 0 to 20% of at least one paraffin wax.

11. Composition according to claim 1 , characterized in that it comprises moreover from 0 to 7% of at least one amide wax.

12. Composition according to claim 1 , comprising moreover from 0 to 10% of at least one naphthenic and/or paraffinic oil.

13. Film for hot-melt adhesive product constituted by at least one hot-melt adhesive material, said film being constituted by at least one composition according to claim 1 .

14. Ready-to-use hot-melt adhesive product comprising:

at least one hot-melt adhesive product constituted by at least one hot-melt adhesive material, and

at least one coating of the hot-melt adhesive product, the coating being constituted by a film according to claim 13 .

15. Method for the production of a ready-to-use hot-melt adhesive product, comprising at least one hot-melt adhesive product constituted by at least one hot-melt adhesive material, and at least one coating of the hot-melt adhesive product constituted by a film, said method being characterized in that it comprises a step of co-extrusion of a film of a composition according to claim 1 around the hot-melt adhesive product.