Epitaxial semiconductor liner for enhancing uniformity of a charged layer in a deep trench and methods of forming the same
View Patent ↗Photodetectors, transistors, and metal interconnect structures may be formed on a front side of the semiconductor substrate. A trench is formed through a backside surface of the semiconductor substrate toward the front side by an anisotropic etch process, which provides a vertical or tapered surface with a first root-mean-square surface roughness greater than 0.5 nm. A single crystalline semiconductor liner is deposited by performing an epitaxial growth process at a growth temperature less than 500 degrees Celsius on the vertical or tapered surface of the trench. A physically exposed side surface of the single crystalline semiconductor liner may have a second root-mean-square surface roughness less than 0.5 nm. At least one dielectric metal oxide liner having a uniform thickness may be formed on the physically exposed side surface to provide a uniform negatively charged film, which may be advantageously used to reduce dark current and white pixels.
1. A semiconductor structure comprising: a semiconductor substrate including a substrate semiconductor layer having a first planar surface and a second planar surface that is parallel to the first planar surface and containing a trench that extends from the second planar surface toward the first planar surface, wherein a first single crystalline semiconductor material of the substrate semiconductor layer has a vertical or tapered surface with a first root-mean-square surface roughness greater than 0.5 nm at a sidewall of the trench; a single crystalline semiconductor liner including a second single crystalline semiconductor material containing a vertically-extending portion that has a first side surface that contacts the vertical or tapered surface on a first side and a second side surface with a second root-mean-square surface roughness less than 0.5 nm; and at least one dielectric metal oxide liner located on the second side surface of the single crystalline semiconductor liner.
2. The semiconductor structure of claim 1 , wherein:
more than 50% of an entire surface area of the vertical or tapered surface comprises surface segments that do not contain faceted surfaces of the first single crystalline semiconductor material; and
more than 50% of an entire surface area of the second side surface of the second single crystalline semiconductor material comprises surface segments that are faceted surfaces of the second single crystalline semiconductor material.
3. The semiconductor structure of claim 1 , wherein the at least one dielectric metal oxide liner comprises an aluminum oxide layer contacting the single crystalline semiconductor liner and having a thickness in a range from 0.8 nm to 1.6 nm, and having a root-mean-square thickness variation less than 0.1 nm.
4. The semiconductor structure of claim 1 , wherein:
the at least dielectric metal oxide liner comprises at least one oxygen-rich dielectric metal oxide material and having a net negative charge; and
a silicon oxide material portion is located inside the trench and contacts a surface of the dielectric metal oxide liner.
5. The semiconductor structure of claim 1 , wherein:
the single crystalline semiconductor liner has an average thickness in a range from 1.5 nm to 10 nm; and
the first root-mean-square surface roughness is at least three times the second root-mean-square surface roughness.
6. An image sensor comprising:
an array of pixels located on a semiconductor substrate including a substrate semiconductor layer, wherein each pixel within the array of pixels comprises at least one subpixel, and each subpixel comprise a respective photodetector and a respective sensing circuit located on a front surface of the semiconductor substrate;
a plurality of trenches that extends from a backside surface of the semiconductor substrate toward the front surface at boundaries between neighboring pairs of the subpixels, wherein a first single crystalline semiconductor material of the substrate semiconductor layer has a vertical or tapered surface with a first root-mean-square surface roughness greater than 0.5 nm at a sidewall of a trench of the plurality of trenches;
a single crystalline semiconductor liner including a second single crystalline semiconductor material containing a vertically-extending portion that has a first side surface that contacts the vertical or tapered surface on a first side and a second side surface with a second root-mean-square surface roughness less than 0.5 nm; and
at least one dielectric metal oxide liner located on the second side surface of the single crystalline semiconductor liner.
7. The image sensor of claim 6 , wherein:
the substrate semiconductor layer has a p-type doping;
each photodetector comprises an n-doped pinned photodiode layer; and
the at least one dielectric metal oxide liner comprises at least one oxygen-rich dielectric metal oxide material and having a net negative charge.
8. The image sensor of claim 7 , wherein the net negative charge has an areal density from 5.0×10 9 electrons per cm 2 to 1.0×10 14 electrons per cm 2 .
9. The image sensor of claim 6 , wherein:
the second single crystalline semiconductor material is epitaxially aligned to the first single crystalline semiconductor material; and
the first single crystalline semiconductor material and the second single crystalline semiconductor material have p-type doping; and
the second single crystalline semiconductor material has a lower atomic concentration of p-type dopants than a portion of the first single crystalline semiconductor material in contact with the second single crystalline semiconductor material.
10. The image sensor of claim 6 , wherein:
the at least one dielectric metal oxide liner comprises an aluminum oxide layer contacting the single crystalline semiconductor liner and having a thickness in a range from 0.8 nm to 1.6 nm, and having a root-mean-square thickness variation less than 0.1 nm;
the at least dielectric metal oxide liner comprises an inner dielectric metal oxide liner including a dielectric metal oxide material having a dielectric constant greater than 7.9, having a material composition different from aluminum oxide, and contacting the aluminum oxide layer; and
a silicon oxide material portion is located inside the trench and contacts a surface of the inner dielectric metal oxide liner.
11. The image sensor of claim 6 , wherein:
the single crystalline semiconductor liner has an average thickness in a range from 1.5 nm to 10 nm; and
the first root-mean-square surface roughness is at least three times the second root-mean-square surface roughness.
12. The image sensor of claim 6 , wherein:
more than 50% of an entire surface area of the vertical or tapered surface comprises surface segments that do not contain faceted surfaces of the first single crystalline semiconductor material; and
more than 50% of an entire surface area of the second side surface of the second single crystalline semiconductor material comprises surface segments that are faceted surfaces of the second single crystalline semiconductor material.
13. The image sensor of claim 6 , further comprising:
a grid structure overlying the backside surface of the semiconductor substrate and having an array of openings within areas of a respective one of the subpixels;
an array of color filters overlying the grid structure; and
an array of lenses that overlie the array of color filters.
14. An image sensor comprising:
an array of pixels located on a semiconductor substrate including a substrate semiconductor layer, wherein each pixel within the array of pixels comprises at least one subpixel, and each subpixel comprise a respective photodetector and a respective sensing circuit located on a front surface of the semiconductor substrate;
a plurality of trenches that extends from a backside surface of the semiconductor substrate toward the front surface at boundaries between neighboring pairs of the subpixels, wherein a first single crystalline semiconductor material of the substrate semiconductor layer has a vertical or tapered surface with a first root-mean-square surface roughness greater than 0.5 nm at a sidewall of a trench of the plurality of trenches;
a single crystalline semiconductor liner including a second single crystalline semiconductor material containing a vertically-extending portion that has a first side surface that contacts the vertical or tapered surface on a first side and a second side surface with a second root-mean-square surface roughness less than 0.5 nm; and
at least one dielectric metal oxide liner located on the second side surface of the single crystalline semiconductor liner, wherein the at least one dielectric metal oxide liner comprises an aluminum oxide layer contacting the single crystalline semiconductor liner and having a thickness in a range from 0.8 nm to 1.6 nm, and having a root-mean-square thickness variation less than 0.1 nm.
15. The image sensor of claim 14 , wherein:
the substrate semiconductor layer has a p-type doping;
each photodetector comprises an n-doped pinned photodiode layer; and
the at least one dielectric metal oxide liner comprises at least one oxygen-rich dielectric metal oxide material and having a net negative charge.
16. The image sensor of claim 15 , wherein the net negative charge has an areal density from 5.0×10 9 electrons per cm 2 to 1.0×10 14 electrons per cm 2 .
17. The image sensor of claim 14 , wherein:
the second single crystalline semiconductor material is epitaxially aligned to the first single crystalline semiconductor material; and
the first single crystalline semiconductor material and the second single crystalline semiconductor material have p-type doping; and
the second single crystalline semiconductor material has a lower atomic concentration of p-type dopants than a portion of the first single crystalline semiconductor material in contact with the second single crystalline semiconductor material.
18. The image sensor of claim 14 , wherein:
the at least dielectric metal oxide liner comprises an inner dielectric metal oxide liner including a dielectric metal oxide material having a dielectric constant greater than 7.9, having a material composition different from aluminum oxide, and contacting the aluminum oxide layer; and
a silicon oxide material portion is located inside the trench and contacts a surface of the inner dielectric metal oxide liner.
19. The image sensor of claim 14 , wherein:
more than 50% of an entire surface area of the vertical or tapered surface comprises surface segments that do not contain faceted surfaces of the first single crystalline semiconductor material; and
more than 50% of an entire surface area of the second side surface of the second single crystalline semiconductor material comprises surface segments that are faceted surfaces of the second single crystalline semiconductor material.
20. The image sensor of claim 14 , further comprising:
a grid structure overlying the backside surface of the semiconductor substrate and having an array of openings within areas of a respective one of the subpixels;
an array of color filters overlying the grid structure; and
an array of lenses that overlie the array of color filters.