Air-cooled heat exchanger and thermal arrangement for stacked electronics
View Patent ↗A stacked electronic arrangement provides independent upgradability of active component boards and radiator boards, enabling quick changes in chip set and alternate polarizations, and includes: an active tile circuit card assembly (CCA); a passive radiator CCA; a tile frame; and a heat exchanger. The active tile CCA includes transmit/receive modules that accept, amply and transmit radar signals. The passive radiator CCA includes patch radiator plugins that receive and then radiate the amplified signal from the modules. The tile frame separates the active tile and the passive radiator CCAs. An elongated casing of the heat exchanger creates an accommodating space for air flow, and forms a first inlet, a second inlet, and a central exhaust plenum between the first and second inlets. High density fins are positioned within the accommodating space between the first and second inlets, and which have openings to the exhaust outlet.
1. A stacked electronic packaging arrangement configured for independent upgradability of active component boards and radiator boards, enabling changes in chip set and alternate polarizations, said electronic packaging arrangement comprising:
an active tile circuit card assembly, said active tile circuit card assembly comprising a plurality of transmit/receive modules each configured to accept a radar signal comprising a first strength, to amplify said signal to a second strength, and to transmit said signal;
a passive radiator circuit card assembly comprising a plurality of patch radiators plugins each configured to receive the amplified signal from said active tile circuit card assembly, and to radiate the amplified signal into space;
a tile frame configured to provide separation between said active tile circuit card assembly and said passive radiator circuit card assembly;
a heat exchanger;
wherein a first side of said tile frame is mounted against a first side of said heat exchanger;
wherein a first side of said passive radiator circuit card assembly is mounted against a second side of said tile frame; and
means for releasably securing said passive radiator circuit card assembly and said tile frame to said heat exchanger
a plurality of blind mating male and female RF connectors electrically coupled to said passive radiator circuit card assembly and to said active tile circuit card assembly, respectively, and being configured to transmit the amplified signal between said active tile circuit card assembly and said passive radiator circuit card assembly.
2. The stacked electronic packaging arrangement according to claim 1 further comprising:
a tile power converter board, said tile power converter board comprising electrical components on both a first side and a second side thereof;
a plurality of standoffs formed of a material comprising a high thermal conductivity; and
wherein said plurality of standoffs are mounted to said second side of said heat exchanger, and wherein said tile power converter board is mounted to said standoffs and is releasably secured to said heat exchanger.
3. The stacked electronic packaging arrangement according to claim 2 wherein each of said patch radiators plugins comprises a printed wiring board (PWB) stack-up of a plurality of RF materials and a cover comprising kapton.
4. The stacked electronic packaging arrangement according to claim 3 wherein each of said plurality of patch radiators plugins are configured to accept energy from said transmit/receive modules of said active tile circuit card assembly.
5. The stacked electronic packaging arrangement according to claim 4 wherein a thickness of said tile frame is at least as thick as a height of said male and female RF connectors when coupled together.
6. The stacked electronic packaging arrangement according to claim 5 wherein said heat exchanger is configured take in air from each of first and second opposite ends of said heat exchanger, and configured for the air to exit at a common central air outlet.