Optical dielectric planar waveguide process
A method for depositing silicon oxynitride film structures is provided that is used to form planar waveguides. These film structures are deposited on substrates and the combination of the substrate and the planar waveguide is used in the formation of optical interposers and subassemblies. The silicon oxynitride film structures are deposited using low thermal budget processes and hydrogen-free oxygen and hydrogen-free nitrogen precursors to produce planar waveguides that exhibit low losses for optical signals transmitted through the waveguide of 1 dB/cm or less. The silicon oxynitride film structures and substrate exhibit low stress levels of less than 20 MPa.
1. A method comprising
forming multiple layers of films on a substrate,
wherein the multiple layers of films comprises a stack of silicon oxynitride films,
wherein at least a silicon oxynitride film in the stack of silicon oxynitride films is formed by a plasma enhanced chemical vapor deposition (PECVD) process,
wherein process gases in the PECVD process are configured to form the at least a silicon oxynitride film having a stress level less than 20 MPa in magnitude;
patterning the multiple layers of films to form a waveguide with the stack of films being a core of the waveguide.
2. A method as in claim 1
wherein the silicon oxynitride films in the stack of silicon oxynitride films are formed by a PECVD process,
wherein the silicon oxynitride films in the stack of silicon oxynitride films have a stress level less than 20 MPa in magnitude.
3. A method as in claim 1
wherein the multiple layers of films are configured to form a waveguide having a stress level less than 20 MPa in magnitude.
4. A method as in claim 1
wherein the waveguide further comprises a buffer layer and a lower cladding layer under the waveguide core, and an upper cladding layer above the waveguide core.
5. A method as in claim 1
wherein the stress level of less than 20 MPa in magnitude of the at least a silicon oxynitride film is achieved by forming formed the at least a silicon oxynitride film having an index of refraction between 1.6 and 2.05.
6. A method comprising
forming multiple layers of films on a substrate,
wherein the multiple layers of films comprises a stack of silicon oxynitride films;
patterning the multiple layers of films to form a waveguide with the stack of films being a core of the waveguide,
wherein at least a silicon oxynitride film in the stack of silicon oxynitride films is formed by a plasma enhanced chemical vapor deposition (PECVD) process,
wherein process gases in the PECVD process comprise an amount of hydrogen configured to form the at least a silicon oxynitride film using process temperatures less than 400 C to prevent damages to the substrate.
7. A method as in claim 6
wherein at least two silicon oxynitride films in the stack of silicon oxynitride films are formed by a PECVD process using different ratios of process gases,
wherein process gases used in the PECVD processes comprise an amount of hydrogen configured to form the waveguide using process temperatures less than 400 C.
8. A method as in claim 6
wherein the silicon oxynitride films in the stack of silicon oxynitride films are formed by PECVD processes,
wherein process gases used in the PECVD processes comprise an amount of hydrogen configured to form the waveguide using process temperatures less than 400 C.
9. A method as in claim 6
wherein the waveguide is formed using process temperatures less than 400 C to prevent damages to the substrate.
10. A method as in claim 6
wherein process gases used in the PECVD process comprises 10% or less of hydrogen.
11. A method as in claim 6
wherein the process gases comprises a precursor for silicon, a precursor for nitrogen, and a precursor for oxygen,
wherein at least one of the oxygen precursor and the nitrogen precursor comprises a hydrogen-free chemistry.
12. A method as in claim 6
wherein the process gases comprises a precursor for silicon and one or more precursors for nitrogen and oxygen,
wherein at least one of the one or more precursors for nitrogen and oxygen comprises a hydrogen-free chemistry.
13. A method as in claim 6
wherein ratios of process gases are configured to achieve a stoichiometry for the silicon oxynitride films that exhibits an index of refraction between 1.6 and 2.05.
14. A method as in claim 6
wherein ratios of process gases are configured to achieve a stress level less than 20 MPa in magnitude.
15. A method comprising
forming multiple layers of films on a substrate,
wherein the multiple layers of films comprises a stack of silicon oxynitride films,
wherein at least a silicon oxynitride film in the stack of silicon oxynitride films is formed by a plasma enhanced chemical vapor deposition (PECVD) process,
wherein process gases in the PECVD process comprise a silicon precursor and one or more precursors for oxygen and nitrogen,
wherein the precursors of silicon, oxygen, and nitrogen are configured to form the at least a silicon oxynitride film,
wherein the one or more precursors of oxygen and nitrogen comprise a hydrogen-free chemistry;
patterning the stack to form a core of a waveguide.
16. A method as in claim 15
wherein the one or more precursors of oxygen and nitrogen comprise a precursor for oxygen and a precursor for nitrogen, or a precursor containing oxygen and a precursor containing oxygen and nitrogen.
17. A method as in claim 15
wherein the process gases used in the PECVD process do not include hydrogen gas, hydrogen gas mixture, or ammonia.
18. A method as in claim 15
wherein the hydrogen-free chemistry comprises oxygen, nitrous oxide, and nitrogen.
19. A method as in claim 15
wherein the hydrogen-free chemistry is configured to form the waveguide at a temperature of 300° C. or lower.
20. A method as in claim 15
wherein ratios of process gases are configured to achieve a stress level less than 20 MPa in magnitude for the at least a silicon oxynitride film.