Selective liner on backside via and method thereof
A method includes providing a structure having a substrate, a fin, source/drain (S/D) features, an isolation structure adjacent to sidewalls of the fin, one or more channel layers over a first dielectric layer and connecting the S/D features, and a gate structure engaging the one or more channel layers. The method further includes thinning down the structure from its backside until the fin is exposed and selectively etching the fin to form a trench that exposes surfaces of the S/D features, the first dielectric layer, and the isolation structure. The method further includes forming a silicide feature on the S/D features and depositing an inhibitor on the silicide feature but not on the surface of the first dielectric layer and the isolation structure, depositing a dielectric liner layer on the surfaces of the isolation structure and the first dielectric layer but not on the inhibitor, and selectively removing the inhibitor.
1. A method, comprising:
providing a structure having a frontside and a backside, the structure including a substrate, a semiconductor fin over the substrate, two source/drain (S/D) features over the semiconductor fin, a first dielectric layer over the semiconductor fin, an isolation structure adjacent to sidewalls of the semiconductor fin, one or more channel semiconductor layers over the first dielectric layer and connecting the two S/D features, and a gate structure engaging the one or more channel semiconductor layers, wherein the substrate is at the backside of the structure and the gate structure is at the frontside of the structure;
thinning down the structure from the backside of the structure until the semiconductor fin is exposed;
selectively etching the semiconductor fin from the backside of the structure to form a trench, wherein the trench exposes surfaces of the two S/D features, a surface of the first dielectric layer, and sidewalls of the isolation structure;
forming a silicide feature on the surfaces of the S/D features;
selectively depositing an inhibitor in the trench, wherein the inhibitor is deposited on the silicide feature but not on the surface of the first dielectric layer and the sidewalls of the isolation structure;
selectively depositing a dielectric liner layer in the trench, wherein the dielectric liner layer is deposited on the sidewalls of the isolation structure and the surface of the first dielectric layer but not on the inhibitor; and
selectively removing the inhibitor.
2. The method of claim 1 , further comprising:
depositing a second dielectric layer to fill the trench;
etching the second dielectric layer to form a via hole, the via hole exposing the silicide feature on one of the two S/D features and the dielectric liner layer; and
forming a via structure in the via hole.
3. The method of claim 2 , before the etching of the second dielectric layer, further comprising:
forming an etch mask on the backside of the structure, the etch mask providing an opening over a portion of the second dielectric layer that is below one of the two S/D features, wherein the etching of the second dielectric layer is performed through the opening.
4. The method of claim 2 , wherein at least a portion of the via structure is formed vertically between the one of the two S/D features and the dielectric liner layer.
5. The method of claim 1 , wherein the silicide feature includes titanium silicide (TiSi), nickel silicide (NiSi), tungsten silicide (WSi), nickel-platinum silicide (NiPtSi), nickel-platinum-germanium silicide (NiPtGeSi), nickel-germanium silicide (NiGeSi), ytterbium silicide (YbSi), platinum silicide (PtSi), iridium silicide (IrSi), erbium silicide (ErSi), cobalt silicide (CoSi), or a combination thereof.
6. The method of claim 1 , wherein the inhibitor includes an organic film having amphiphilic molecules and the dielectric liner layer includes at least one of La 2 O 3 , Al 2 O 3 , SiOCN, SiOC, SiCN, SiO 2 , SiC, ZnO, ZrN, Zr 2 Al 3 O 9 , TiO 2 , TaO 2 , ZrO 2 , HfO 2 , Si 3 N 4 , Y 2 O 3 , AlON, TaCN, and ZrSi.
7. The method of claim 1 , wherein the selectively removing of the inhibitor uses an etching process that is tuned to etch the inhibitor with no or minimal etching to the dielectric liner layer.
8. The method of claim 7 , wherein the selectively removing of the inhibitor includes plasma dry etching, chemical dry etching, ashing, wet etching, or a combination thereof.
9. The method of claim 7 , wherein the selectively removing of the inhibitor includes a wet etching with SPM cleaning solution at a temperature over 100° C.
10. A method, comprising:
providing a structure having a substrate, a semiconductor fin over the substrate, two source/drain (S/D) features over the semiconductor fin, an isolation structure on sidewalls of the semiconductor fin, a dielectric capping layer over the semiconductor fin, one or more channel semiconductor layers over the dielectric capping layer, and a gate structure engaging the one or more channel semiconductor layers;
thinning down the substrate until the semiconductor fin is exposed;
selectively etching the semiconductor fin to form a trench, wherein the trench exposes surfaces of the two S/D features, a surface of the dielectric capping layer, and sidewalls of the isolation structure;
forming a silicide feature on the surfaces of the S/D features;
depositing an inhibitor on the silicide feature but not on the surface of the dielectric capping layer and the sidewalls of the isolation structure;
depositing a dielectric liner layer on the sidewalls of the isolation structure and the surface of the dielectric capping layer but not on the inhibitor;
selectively removing the inhibitor; and
forming a via structure in the trench.
11. The method of claim 10 , after the selectively removing of the inhibitor and before the forming of the via structure, further comprising:
depositing a dielectric layer to fill the trench; and
etching the dielectric layer to form a via hole, the via hole exposing the silicide feature on one of the two S/D features, wherein the via structure is formed in the via hole.
12. The method of claim 11 , before the etching of the dielectric layer, further comprising:
forming an etch mask on a backside of the structure, the etch mask providing an opening over a portion of the dielectric layer, wherein the etching of the dielectric layer is performed through the opening.
13. The method of claim 10 , wherein the silicide feature includes titanium silicide (TiSi), nickel silicide (NiSi), tungsten silicide (WSi), nickel-platinum silicide (NiPtSi), nickel-platinum-germanium silicide (NiPtGeSi), nickel-germanium silicide (NiGeSi), ytterbium silicide (YbSi), platinum silicide (PtSi), iridium silicide (IrSi), erbium silicide (ErSi), and cobalt silicide (CoSi), or a combination thereof.
14. The method of claim 10 , wherein the inhibitor includes an organic film having amphiphilic molecules and the dielectric liner layer includes at least one of La 2 O 3 , Al 2 O 3 , SiOCN, SiOC, SiCN, SiO 2 , SiC, ZnO, ZrN, Zr 2 Al 3 O 9 , TiO 2 , TaO 2 , ZrO 2 , HfO 2 , Si 3 N 4 , Y 2 O 3 , AlON, TaCN, and ZrSi.
15. The method of claim 10 , wherein the selectively removing of the inhibitor includes plasma dry etching, chemical dry etching, ashing, wet etching, or a combination thereof.
16. A method, comprising:
providing a structure having a substrate, a semiconductor fin over the substrate, two source/drain (S/D) regions over the semiconductor fin, a first dielectric layer over the semiconductor fin, an isolation structure adjacent to sidewalls of the semiconductor fin, one or more channel semiconductor layers over the first dielectric layer and connecting the two S/D regions, and a gate structure wrapping around the one or more channel semiconductor layers, wherein the gate structure is disposed at a frontside of the structure;
thinning down the structure from a backside of the structure opposite to the frontside of the structure until the semiconductor fin is exposed from the backside of the structure;
selectively etching the semiconductor fin to form a trench, wherein the trench exposes surfaces of the two S/D regions, the first dielectric layer, and the isolation structure;
forming a silicide feature on the surfaces of the S/D regions;
selectively depositing an inhibitor in the trench and on the silicide feature but not on the surfaces of the first dielectric layer and the isolation structure;
selectively depositing a dielectric liner layer in the trench and on the surfaces of the isolation structure and the first dielectric layer but not on the surfaces of the inhibitor;
selectively removing the inhibitor;
depositing a dielectric layer to fill the trench;
etching the dielectric layer to form a via hole, the via hole exposing the silicide feature on one of the two S/D regions; and
forming a via structure in the via hole.
17. The method of claim 16 , wherein the silicide feature includes titanium silicide (TiSi), nickel silicide (NiSi), tungsten silicide (WSi), nickel-platinum silicide (NiPtSi), nickel-platinum-germanium silicide (NiPtGeSi), nickel-germanium silicide (NiGeSi), ytterbium silicide (YbSi), platinum silicide (PtSi), iridium silicide (IrSi), erbium silicide (ErSi), and cobalt silicide (CoSi), or a combination thereof.
18. The method of claim 17 , wherein the inhibitor includes an organic film having amphiphilic molecules.
19. The method of claim 18 , wherein the dielectric liner layer includes one of La 2 O 3 , Al 2 O 3 , SiOCN, SiOC, SiCN, SiO 2 , SiC, ZnO, ZrN, Zr 2 Al 3 O 9 , TiO 2 , TaO 2 , ZrO 2 , HfO 2 , Si 3 N 4 , Y 2 O 3 , AlON, TaCN, and ZrSi.
20. The method of claim 19 , wherein the selectively removing of the inhibitor includes a wet etching with SPM cleaning solution at a temperature over 100° C.