Stacked integrated circuit devices

1. An integrated circuit device comprising:

a plurality of standard cells arranged on a substrate in multiple rows that each extend in a first direction, wherein the plurality of standard cells comprises a first standard cell in a first row and a second standard cell in a second row that is immediately adjacent to the first row,

wherein each of the plurality of standard cells comprises:

an upper transistor comprising:

an upper active region;

an upper gate structure on the upper active region; and

an upper source/drain region on the upper active region;

a lower transistor between the substrate and the upper transistor, the lower transistor comprising:

a lower active region;

a lower gate structure on the lower active region; and

a lower source/drain region on the lower active region;

a power line; and

a power via electrically connecting the power line to the lower source/drain region, and

wherein the power via of the first standard cell and the power via of the second standard cell are aligned with each other along the first direction.

2. The integrated circuit device of claim 1 , wherein the power via of the first standard cell and the power via of the second standard cell are aligned with each other along an interface between the first row and the second row.

3. The integrated circuit device of claim 1 , wherein the power line of the first standard cell comprises a first portion of a shared power line, and the power line of the second standard cell comprises a second portion of the shared power line, and

wherein the shared power line extends along an interface between the first row and the second row.

4. The integrated circuit device of claim 3 , wherein the power via of the first standard cell contacts the shared power line and protrudes upward from the shared power line, and the power via of the second standard cell contacts the shared power line and protrudes upward from the shared power line.

5. The integrated circuit device of claim 4 , wherein the power via of the first standard cell contacts a center of the shared power line in a second direction that is perpendicular to the first direction, and the power via of the second standard cell contacts the center of the shared power line in the second direction.

6. The integrated circuit device of claim 1 , wherein the upper source/drain region comprises a first upper source/drain region, and the lower source/drain region comprises a first lower source/drain region,

wherein each of the plurality of standard cells further comprises:

a second upper source/drain region on the upper active region;

a second lower source/drain region on the lower active region; and

an output via electrically connecting the second lower source/drain region to the second upper source/drain region, and

wherein the output via of the first standard cell and the power via of the first standard cell are aligned with each other along the first direction.

7. The integrated circuit device of claim 1 , wherein the power line of the first standard cell comprises a first portion of a shared power line, and the power line of the second standard cell comprises a second portion of the shared power line,

wherein the plurality of standard cells further comprises a third standard cell in the second row, and

wherein the power via of the first standard cell electrically connects the shared power line to the lower source/drain region of the third standard cell.

8. The integrated circuit device of claim 1 , wherein the upper source/drain region comprises a first upper source/drain region, and the lower source/drain region comprises a first lower source/drain region,

each of the plurality of standard cells further comprises:

a second upper source/drain region on the upper active region;

a second lower source/drain region on the lower active region; and

an output via electrically connecting the second lower source/drain region to the second upper source/drain region, and

the output via of the first standard cell overlaps an interface between the first row and the second row.

9. The integrated circuit device of claim 8 , wherein a first cell boundary of the second standard cell comprises the interface between the first row and the second row, and

the output via of the second standard cell overlaps a second cell boundary of the second standard cell that is opposite to the first cell boundary.

10. An integrated circuit device comprising:

a plurality of standard cells arranged on a substrate in multiple rows that each extend in a first direction, wherein the plurality of standard cells comprise a first standard cell in a first row and a second standard cell in a second row that is immediately adjacent to the first row; and

a shared power line extending along an interface between the first row and the second row,

wherein each of the plurality of standard cells comprises:

an upper transistor comprising:

an upper active region;

an upper gate structure on the upper active region; and

first and second upper source/drain regions on the upper active region;

a lower transistor between the substrate and the upper transistor, the lower transistor comprising:

a lower active region;

a lower gate structure on the lower active region; and

first and second lower source/drain regions on the lower active region;

a power via electrically connecting the shared power line to the first lower source/drain region; and

an output via electrically connecting the second lower source/drain region and the second upper source/drain region, and

wherein the power via of the first standard cell is spaced apart from the output via of the first standard cell by a first distance in a second direction that is perpendicular to the first direction, the power via of the second standard cell is spaced apart from the output via of the second standard cell by a second distance in the second direction, and the first distance is different from the second distance.

11. The integrated circuit device of claim 10 , wherein the first standard cell and the second standard cell are the same kind of standard cell.

12. The integrated circuit device of claim 10 , wherein the power via of the first standard cell and the output via of the first standard cell are aligned with each other along the first direction.

13. The integrated circuit device of claim 10 , wherein the output via of the first standard cell overlaps the interface between the first row and the second row.

14. The integrated circuit device of claim 13 , wherein the second standard cell comprises a first cell boundary comprising the interface between the first row and the second row and a second cell boundary opposite to the first cell boundary, and

wherein the output via of the second standard cell overlaps the second cell boundary of the second standard cell.

15. The integrated circuit device of claim 13 , wherein the power via of the second standard cell overlaps the interface between the first row and the second row, and

the output via of the first standard cell and the power via of the second standard cell are aligned with each other along the first direction.

16. The integrated circuit device of claim 10 , wherein the plurality of standard cells further comprises a third standard cell that is in the second row and contacts the first standard cell, and

wherein the power via of the first standard cell electrically connects the shared power line to the first lower source/drain region of the third standard cell.

17. The integrated circuit device of claim 10 , wherein the power via of the first standard cell contacts the shared power line and protrudes from the shared power line in a vertical direction, and the power via of the second standard cell contacts the shared power line and protrudes from the shared power line in the vertical direction.

18. An integrated circuit device comprising:

a first plurality of standard cells arranged in a first direction;

a second plurality of standard cells that are arranged in the first direction and contact the first plurality of standard cells, wherein an interface between the first plurality of standard cells and the second plurality of standard cells defines a cell boundary; and

wherein the first plurality of standard cells and the second plurality of standard cells each comprises:

an upper transistor on a substrate, the upper transistor comprising:

an upper active region;

an upper gate structure on the upper active region; and

an upper source/drain region on the upper active region;

a lower transistor between the substrate and the upper transistor, the lower transistor comprising:

a lower active region;

a lower gate structure on the lower active region; and

a lower source/drain region on the lower active region; and

an output via that electrically connects the lower source/drain region and the upper source/drain region,

wherein the first plurality of standard cells comprises a first standard cell, and the output via of the first standard cell overlaps the cell boundary.

19. The integrated circuit device of claim 18 , wherein the lower source/drain region comprises a first lower source/drain region,

the first plurality of standard cells and the second plurality of standard cells each further comprises:

a second lower source/drain region on the lower active region;

a power line; and

an power via electrically connecting the power line to the second lower source/drain region, and

wherein the power via of the first standard cell overlaps the cell boundary.

20. The integrated circuit device of claim 18 , wherein the second plurality of standard cells comprises a second standard cell,

the second standard cell comprises a first cell boundary comprising the cell boundary and a second cell boundary opposite to the first cell boundary, and

the output via of the second standard cell overlaps the second cell boundary of the second standard cell.