Stacked integrated circuit devices
Stacked integrated circuit devices may include standard cells including a first standard cell in a first row and a second standard cell in a second row immediately adjacent to the first row. Each of the standard cells may include an upper transistor and a lower transistor. The upper transistor may include an upper active region, an upper gate structure, and an upper source/drain region. The lower transistor may include a lower active region, a lower gate structure, and a lower source/drain region. Each of the standard cells may also include a power line and a power via electrically connecting the power line to the lower source/drain region. The power via of the first standard cell and the power via of the second standard cell may be aligned with each other along the first direction.
1. An integrated circuit device comprising:
a substrate;
an upper transistor;
a lower transistor that is between, in a vertical direction, the substrate and the upper transistor; and
a power via that is adjacent and overlaps, in a horizontal direction, a sidewall of the lower transistor and a sidewall of the upper transistor.
2. The integrated circuit device of claim 1 , wherein the power via is electrically connected to the upper transistor.
3. The integrated circuit device of claim 2 ,
wherein the upper transistor is a P-type transistor, and
wherein the lower transistor is an N-type transistor.
4. The integrated circuit device of claim 3 , wherein the power via is electrically connected to a source/drain region of the P-type transistor.
5. The integrated circuit device of claim 1 , further comprising a power line, wherein the upper transistor is electrically connected to the power line by the power via.
6. The integrated circuit device of claim 5 , wherein the power line is in the substrate.
7. The integrated circuit device of claim 1 , wherein an uppermost surface of the power via is at a higher level, in the vertical direction, than an uppermost surface of a channel region of the upper transistor.
8. The integrated circuit device of claim 1 , wherein a lowermost surface of the power via is at a lower level, in the vertical direction, than a lowermost surface of a channel region of the lower transistor.
9. The integrated circuit device of claim 1 , wherein the upper transistor and the lower transistor each include nanosheets.
10. The integrated circuit device of claim 1 , further comprising a contact on and electrically connected to the upper transistor, wherein the power via is electrically connected to the contact.
11. An integrated circuit device comprising:
a standard cell that includes a transistor; and
a power via that is electrically connected to the transistor and is adjacent and overlaps, in a horizontal direction, a sidewall of the transistor,
wherein the power via is at a cell boundary of the standard cell.
12. The integrated circuit device of claim 11 , further comprising a contact that is on and electrically connected to a source/drain region of the transistor,
wherein the power via is electrically connected to the source/drain region of the transistor by the contact.
13. The integrated circuit device of claim 12 , wherein the power via is in contact with the contact.
14. The integrated circuit device of claim 11 , further comprising:
a second standard cell that includes a second transistor; and
a second power via that is adjacent and overlaps, in the horizontal direction, a sidewall of the second transistor,
wherein the standard cell and the second standard cell are in different rows of standard cells, and
wherein the second power via is aligned, in the horizontal direction, with the power via and is at a cell boundary of the second standard cell.
15. The integrated circuit device of claim 11 , further comprising:
a second standard cell that includes a second transistor; and
a second power via that is adjacent and overlaps, in the horizontal direction, a sidewall of the second transistor,
wherein the standard cell and the second standard cell are in the same row of standard cells,
wherein the second power is aligned with the power via along a second horizontal direction that intersects the horizontal direction.
16. The integrated circuit device of claim 11 , further comprising a power line that is electrically connected to the transistor by the power via,
wherein the power via overlaps the power line in a vertical direction, and
wherein the power line is at the cell boundary.
17. The integrated circuit device of claim 16 , wherein an uppermost surface of the power line is at a lower level, in the vertical direction, than a lowermost surface of the transistor.
18. The integrated circuit device of claim 11 , wherein an uppermost surface of the power via is at a higher level, in a vertical direction, than an uppermost surface of a channel region of the transistor.
19. The integrated circuit device of claim 11 , wherein a lowermost surface of the power via is at a lower level, in a vertical direction, than a lowermost surface of a channel region of the transistor.
20. The integrated circuit device of claim 11 , wherein the transistor includes nanosheets.