Capping plate for panel scale packaging of MEMS products

1. A method of manufacturing microelectromechanical systems (“MEMS”) products comprising:

providing glass spacers;

depositing an anti-reflective coating on the glass spacers;

coupling a wavelength-specific transmissive window to the anti-reflective coating;

providing a window plate;

attaching the window plate to the glass spacers;

aligning the glass spacers with a MEMS device glass plate;

bonding the glass spacers to the MEMS device glass plate; and

singulating the glass spacers, window plate, and MEMS device glass plate to produce the MEMS products.

2. The method of claim 1 , wherein the MEMS device glass plate and the window plate each measure at least 750 mm by 620 mm.

3. The method of claim 1 , wherein the window plate is sufficiently thick and stiff to provide structural support.

4. The method of claim 1 , wherein depositing the anti-reflective coating comprises thin-film depositing at least two layers with different refractive indexes.

5. The method of claim 1 , wherein providing the window plate comprises thin-film depositing a wavelength-specific transmissive window.

6. The method of claim 1 , wherein providing the glass spacers comprises:

providing a glass substrate; and

forming the glass spacers from the glass substrate, wherein depositing the anti-reflective coating precedes forming the glass spacers from the glass substrate.

7. The method of claim 1 , wherein providing the glass spacers comprises:

providing a glass substrate; and

forming the glass spacers from the glass substrate.

8. The method of claim 7 , wherein attaching the window plate to the glass spacers comprises attaching the window plate to the glass substrate before forming the glass spacers from the glass substrate.

9. The method of claim 6 , wherein the glass substrate comprises a photo sensitive glass substrate and wherein forming the glass spacers comprises structurally modifying sections of the glass substrate and then removing the structurally modified sections.

10. The method of claim 6 , wherein providing the glass spacers comprises placing a mask on the glass substrate and removing non-masked sections.

11. The method of claim 1 , wherein providing the window plate comprises attaching a silicon wafer to the glass spacers.

12. The method of claim 11 , wherein the silicon wafer comprises single crystal silicon.

13. The method of claim 11 , wherein attaching the silicon wafer to the glass spacers comprises distributing the silicon wafer on the glass spacers and bonding the silicon wafer to the glass spacers.

14. The method of claim 11 , wherein the silicon wafer comprises an anti-reflective coating.

15. A method of manufacturing MEMS products comprising:

providing glass spacers;

providing a window plate;

attaching the window plate to the glass spacers;

aligning the glass spacers with a MEMS device glass plate;

bonding the glass spacers to the MEMS device glass plate; and

singulating the glass spacers, window plate, and MEMS device glass plate to produce the MEMS products,

wherein providing the glass spacers and providing the window plate comprises etching an array of wells in a plurality of silicon wafers,

wherein attaching the window plate to the glass spacers and aligning the glass spacers with a MEMS device glass plate comprises:

coupling a release layer to a handling plate;

coupling, to the release layer, the plurality of silicon wafers so that the array of wells is distal to the release layer; and

coupling, to the MEMS device glass plate, the plurality of silicon wafers so that the array of wells is proximal to the MEMS device glass plate;

wherein bonding the glass spacers to the MEMS device glass plate comprises bonding the plurality of silicon wafers to the MEMS device glass plate, and

wherein singulating the glass spacers, window plate, and MEMS device glass plate to produce the MEMS devices comprises:

decoupling the release layer from the plurality of silicon wafers; and

singulating the MEMS products from the bonded MEMS device and plurality of silicon wafers.

16. The method of claim 15 , wherein the silicon wafer is single crystal silicon.

17. The method of claim 1 , wherein bonding the glass spacers to the MEMS device glass plate comprises adding solder to the glass spacers on a surface distal to the window plate.

18. A method of manufacturing MEMS products comprising:

providing glass spacers;

providing a window plate;

attaching the window plate to the glass spacers;

aligning the glass spacers with a MEMS device glass plate;

bonding the glass spacers to the MEMS device glass plate;

singulating the glass spacers, window plate, and MEMS device glass plate to produce the MEMS products;

depositing a getter material on the glass spacers and window plate; and

dry-etching the getter material from the window plate.

19. The method of claim 1 , wherein bonding the glass spacers to the MEMS device glass plate comprises:

placing the window plate and MEMS device glass plate in a vacuum environment; and

increasing temperature in the vacuum environment.