Semiconductor device and manufacturing method of semiconductor device
There is provided a semiconductor device comprising: a semiconductor substrate; an emitter region of a first conductivity type provided inside the semiconductor substrate; a base region of a second conductivity type provided below the emitter region inside the semiconductor substrate; an accumulation region of the first conductivity type provided below the base region inside the semiconductor substrate, and containing hydrogen as an impurity; and a trench portion provided to pass through the emitter region, the base region and the accumulation region from an upper surface of the semiconductor substrate.
1. A manufacturing method of a semiconductor device comprising:
forming an impurity region in an upper surface side of a semiconductor substrate, the impurity region including an emitter region of a first conductivity type and a base region of a second conductivity type provided below the emitter region;
forming a trench portion to pass through the emitter region and the base region from an upper surface of the semiconductor substrate; and
forming an accumulation region of the first conductivity type below the base region and entirely above a lower end of the trench portion by implanting protons into the semiconductor substrate, the accumulation region containing hydrogen as an impurity, wherein
a hydrogen concentration of the base region is higher than a doping concentration of a drift region of the first conductivity type provided below the accumulation region.
2. The manufacturing method of a semiconductor device according to claim 1 , further comprising, between forming the impurity region and forming the accumulation region:
forming an insulating film to cover an inner wall of the trench portion;
forming a conductive portion inside the trench portion having the inner wall covered with the insulating film; and
forming an interlayer dielectric film to cover the trench portion on the upper surface of the semiconductor substrate.
3. The manufacturing method of a semiconductor device according to claim 1 , further comprising, between forming the impurity region and forming the accumulation region, forming an emitter electrode above an upper surface of the semiconductor substrate.
4. The manufacturing method of a semiconductor device according to claim 1 , further comprising forming a buffer region of the first conductivity type having a plurality of peaks in a doping concentration distribution in a depth direction of the semiconductor substrate, each peak formed by implanting protons from a lower surface side of the semiconductor substrate, wherein
among the plurality of peaks of the buffer region, a peak located farthest from a lower surface of the semiconductor substrate has a larger doping concentration than a peak located second farthest from the lower surface of the semiconductor substrate.
5. The manufacturing method of a semiconductor device according to claim 1 , further comprising implanting protons into the base region and the accumulation region from a lower surface side of the semiconductor substrate.
6. The manufacturing method of a semiconductor device according to claim 1 , further comprising implanting protons into the base region.
7. The manufacturing method of a semiconductor device according to claim 1 , wherein the forming the accumulation region includes:
implanting protons into the semiconductor substrate from an upper surface side of the semiconductor substrate.
8. The manufacturing method of a semiconductor device according to claim 2 , further comprising:
forming a barrier metal on an entire upper surface of the interlayer dielectric film above the trench portion.
9. The manufacturing method of a semiconductor device according to claim 1 , wherein:
the hydrogen concentration of the base region is higher than a doping concentration of the base region.