Tribological properties of diamond films
Methods to manufacture integrated circuits are described. Nanocrystalline diamond is used as a hard mask in place of amorphous carbon. Provided is a method of processing a substrate in which nanocrystalline diamond is used as a hard mask, wherein processing methods result in a smooth surface. The method involves two processing parts. Two separate nanocrystalline diamond recipes are combined—the first and second recipes are cycled to achieve a nanocrystalline diamond hard mask having high hardness, high modulus, and a smooth surface. In other embodiments, the first recipe is followed by an inert gas plasma smoothening process and then the first recipe is cycled to achieve a high hardness, a high modulus, and a smooth surface.
1. A processing method comprising:
depositing a first nanocrystalline diamond layer on a substrate using a range of microwave power of 2 to 12 kW and a pressure in a range of 0.1 to 1 Torr, the first nanocrystalline diamond layer having a first thickness, a first roughness, a first hardness, and a first modulus; and
depositing a second nanocrystalline diamond layer on the first nanocrystalline diamond layer using a range of microwave power of 2 to 12 kW and a pressure in a range of 0.1 to 1 Torr, the second nanocrystalline diamond layer having a second thickness, and a second roughness,
wherein the first thickness is greater than the second thickness, and the second roughness is less than the first roughness.
2. The processing method of claim 1 , wherein depositing the first nanocrystalline diamond layer comprises generating a deposition gas comprising a carbon-containing gas and carbon dioxide and activating the deposition gas to form a plasma.
3. The processing method of claim 2 , further comprising exposing the substrate to a hydrogen plasma to form the first nanocrystalline diamond layer.
4. The processing method of claim 1 , further comprising depositing a seed layer on the substrate prior to depositing the first nanocrystalline diamond layer.
5. The processing method of claim 4 , wherein the seed layer comprises a nanocrystalline diamond.
6. The processing method of claim 1 , wherein depositing the second nanocrystalline layer comprises generating a deposition gas comprising a carbon-containing gas, carbon dioxide, and an inert gas and activating the deposition gas to form a plasma.
7. The processing method of claim 6 , further comprising exposing the first nanocrystalline diamond layer to a hydrogen plasma to form the second nanocrystalline diamond layer.
8. The processing method of claim 1 , wherein the first thickness is in a range of from about 250 nm to about 650 nm.
9. The processing method of claim 1 , wherein the second thickness is in a range of from about 5 nm to about 200 nm.
10. A processing method comprising:
depositing a first nanocrystalline diamond layer on a substrate using a range of microwave power of 2 to 12 kW and a pressure in a range of 0.1 to 1 Torr, the first nanocrystalline diamond layer having a first thickness, a first roughness, a first hardness, and a first modulus; and
exposing the first nanocrystalline diamond layer to an inert gas plasma to form a smooth nanocrystalline diamond layer.
11. The processing method of claim 10 , wherein depositing the first nanocrystalline diamond layer comprises generating a deposition gas comprising a carbon-containing gas and carbon dioxide and activating the deposition gas to form a plasma.
12. The processing method of claim 11 , further comprising exposing the substrate to a hydrogen plasma to form the first nanocrystalline diamond layer.
13. The processing method of claim 10 , further comprising depositing a seed layer on the substrate prior to depositing the first nanocrystalline diamond layer.
14. The processing method of claim 13 , wherein the seed layer comprises a nanocrystalline diamond.
15. The processing method of claim 10 , wherein the inert gas plasma comprises one or more of helium (He), neon (Ne), and argon (Ar).