Body tie optimization for stacked transistor amplifier
A transistor stack can include a combination of floating and body tied devices. Improved performance of the RF amplifier can be obtained by using a single body tied device as the input transistor of the stack, or as the output transistor of the stack, while other transistors of the stack are floating transistors. Transient response of the RF amplifier can be improved by using all body tied devices in the stack.
1. A stacked metal-oxide-semiconductor (MOS) power amplifier, comprising:
a transistor stack comprising a plurality of stacked transistors comprising an input transistor and an output;
wherein the input transistor comprises a four-terminal transistor having a body directly connected to a source of the four-terminal transistor,
wherein the plurality of stacked transistors comprises at least one three-terminal transistor, and wherein the at least one three-terminal transistor comprises a body that is not coupled to a potential.
2. The MOS power amplifier according to claim 1 , further comprising:
at least one gate capacitor connected between a gate of a transistor of the plurality of stacked transistors different from the input transistor, and a reference ground,
wherein the at least one gate capacitor is configured to allow a gate voltage of the corresponding transistor to vary along with an RF signal at a drain of said transistor.
3. The MOS power amplifier according to claim 1 , wherein the plurality of transistors are metal-oxide-semiconductor (MOS) field effect transistors (FETs), or complementary metal-oxide-semiconductor (CMOS) field effect transistors (FETs).
4. The MOS power amplifier according to claim 3 , wherein the plurality of transistors are fabricated using one of: a) silicon-on-insulator (SOI) technology, and b) silicon-on-sapphire technology (SOS).
5. The MOS power amplifier according to claim 3 , wherein the plurality of transistors are one of: a) N-type transistors, and b) P-type transistors.
6. The MOS power amplifier according to claim 1 ,
wherein the transistor stack is configured to operate between a supply voltage coupled to the output transistor and a reference ground coupled to the input transistor, and
wherein the supply voltage is configured to vary under control of a control signal.
7. An electronic module comprising the MOS power amplifier of claim 1 .
8. An electronic system comprising the electronic module of claim 7 , wherein the electronic system comprises one of: a) a television, b) a cellular telephone, c) a personal computer, d) a workstation, e) a radio, f) a video player, g) an audio player, h) a vehicle, i) a medical device, and j) other electronic systems.
9. A stacked metal-oxide-semiconductor (MOS) power amplifier, comprising:
a transistor stack comprising a plurality of stacked transistors comprising an input transistor for receiving an input RF signal, and an output transistor for outputting an output RF signal that is an amplified version of the input RF signal;
at least one gate capacitor connected between a gate of a transistor of the plurality of stacked transistors different from the input transistor, and a reference ground,
wherein at least one transistor of the plurality of stacked transistors is a four-terminal transistor having a body that is coupled to a source of said transistor,
wherein the plurality of stacked transistors comprises at least one three-terminal transistor, wherein the at least one three-terminal transistor comprises a body that is not coupled to a potential, and
wherein the body of the at least one transistor is directly connected to the source of said transistor.
10. The MOS power amplifier according to claim 9 ,
wherein the at least one gate capacitor is configured to allow a gate voltage of the corresponding transistor to vary along with an RF signal at a drain of said transistor.
11. The MOS power amplifier according to claim 9 , wherein the at least one transistor of the plurality of stacked transistors further comprises the output transistor.
12. The MOS power amplifier according to claim 9 , wherein the at least one transistor of the plurality of stacked transistors further comprises a transistor arranged between the input transistor and the output transistor.
13. The MOS power amplifier according to claim 9 , wherein each transistor of the plurality of stacked transistors, except the at least one three-terminal transistor, is a four-terminal transistor having a respective body that is coupled to a respective source.
14. The MOS power amplifier according to claim 9 , wherein the plurality of transistors are metal-oxide-semiconductor (MOS) field effect transistors (FETs), or complementary metal-oxide-semiconductor (CMOS) field effect transistors (FETs).
15. The MOS power amplifier according to claim 9 ,
wherein the transistor stack is configured to operate between a supply voltage coupled to the output transistor and the reference ground coupled to the input transistor, and
wherein the supply voltage is configured to vary under control of a control signal.
16. An electronic module comprising the MOS power amplifier of claim 9 .
17. A method for manufacturing a stacked metal-oxide-semiconductor (MOS) power amplifier, the method comprising:
providing a substrate comprising one of: a) silicon-on-insulator substrate, and b) a silicon-on-sapphire substrate; and
manufacturing, on the substrate, a transistor stack, the transistor stack comprising:
a plurality of series connected transistors comprising an input transistor and an output transistor,
wherein the input transistor comprises a four-terminal transistor having a body directly connected to a source of the four-terminal transistor,
wherein the plurality of series connected transistors comprises at least one three-terminal transistor, and wherein the at least one three-terminal transistor comprises a body that is not coupled to a potential.