Patch substrate configured as a shield located over a cavity of a board

1. A device comprising:

a board comprising a cavity;

a package coupled to a first side of the board, the package comprising:

a substrate; and

an integrated device coupled to the substrate, wherein the integrated device is located at least partially in the cavity of the board; and

a patch substrate coupled to a second side of the board,

wherein the patch substrate is located over the cavity of the board, and

wherein the patch substrate is configured as an electromagnetic interference (EMI) shield for the package,

wherein the patch substrate includes a plurality of shield interconnects that are configured as an EMI shield for the integrated device, and

wherein the plurality of shield interconnects that are configured as the EMI shield for the integrated device include at least one shield interconnect that is located over a back side of the integrated device.

2. The device of claim 1 , wherein the board is configured to be part of the EMI shield for the integrated device located in the cavity of the board.

3. The device of claim 1 ,

wherein the board includes another plurality of shield interconnects that is configured to be part of the EMI shield for the integrated device located in the cavity of the board,

wherein the patch substrate is coupled to the board through a plurality of solder interconnects, and

wherein at least one solder interconnect from the plurality of solder interconnects is configured to be part of the EMI shield for the integrated device.

4. The device of claim 1 , wherein the patch substrate is further configured as a bridge that provides at least one electrical connection over the cavity of the board, and between a first portion of the board and a second portion of the board.

5. The device of claim 1 , wherein the patch substrate includes a plurality of interconnects that is configured to provide at least one electrical connection over the cavity of the board, and between a first portion of the board and a second portion of the board.

6. The device of claim 1 , further comprising a second integrated device coupled to the patch substrate.

7. The device of claim 1 , wherein the integrated device includes a memory die.

8. The device of claim 1 , further comprising:

a display; and

a cover,

wherein the board and the patch substrate are located in the device such that the patch substrate is located closer to the display.

9. The device of claim 1 , wherein a combined thickness of the package, the board the patch substrate is approximately 3.4 millimeters (mm) or less.

10. The device of claim 1 , wherein the device is incorporated into a particular device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an internet of things (IoT) device, and a device in an automotive vehicle.

11. The device of claim 6 , wherein the second integrated device is configured to be electrically coupled to the integrated device through at least the patch substrate, the board and the substrate.

12. An apparatus comprising:

a printed circuit board comprising a cavity;

a package coupled to a first side of the printed circuit board, the package comprising: a substrate; and an integrated device coupled to the substrate,

wherein the integrated device is located at least partially in the cavity of the printed circuit board; and

means for patch shield coupled to a second side of the printed circuit board,

wherein the means for patch shield includes a plurality of shield interconnects that are configured as an electromagnetic interference (EMI) shield for the integrated device located at least partially in the cavity of the printed circuit board,

wherein at least a portion of the means for patch shield is located over the cavity of the printed circuit board such that the integrated device is located between the substrate and the means for patch shield, and

wherein the means for patch shield is configured as the EMI shield over a back side of the integrated device of the package.

13. The apparatus of claim 12 , wherein the means for patch shield further includes a means for bridge interconnection that is configured to provide at least one electrical connection over the cavity of the printed circuit board, and between a first portion of the printed circuit board and a second portion of the printed circuit board.

14. The apparatus of claim 12 , wherein the means for patch shield includes a plurality of interconnects that is configured to provide at least one electrical connection over the cavity of the printed circuit board, and between a first portion of the printed circuit board and a second portion of the printed circuit board.

15. The apparatus of claim 12 , further comprising a second integrated device coupled to the means for patch shield.

16. The apparatus of claim 12 , wherein the integrated device includes a memory die.

17. The apparatus of claim 12 , further comprising:

a display; and

a cover,

wherein the printed circuit board and the means for patch shield are located in the apparatus such that the means for patch shield is located closer to the display.

18. The apparatus of claim 12 , wherein the apparatus is incorporated into a particular device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an internet of things (IoT) device, and a device in an automotive vehicle.

19. The apparatus of claim 15 , wherein the second integrated device is configured to be electrically coupled to the integrated device through at least the means for patch shield, the printed circuit board and the substrate.

20. A method for fabricating a device comprising:

coupling a package to a first side of a board comprising a cavity, the package comprising:

a substrate; and

an integrated device coupled to the substrate, wherein the integrated device is located at least partially in the cavity of the board; and

coupling a patch substrate to a second side of the board such that the patch substrate is located over the cavity of the board, wherein the patch substrate is configured as an electromagnetic interference (EMI) shield for the package,

wherein the patch substrate includes a plurality of shield interconnects that are configured as an EMI shield for the integrated device, and

wherein the plurality of shield interconnects that are configured as the EMI shield for the integrated device include at least one shield interconnect that is located over a back side of the integrated device.

21. The device of claim 20 , wherein the board is configured as part of the EMI shield for the integrated device located in the cavity of the board.

22. The device of claim 20 ,

wherein the board includes another plurality of shield interconnects that is configured to be part of the EMI shield for the integrated device located in the cavity of the board,

wherein the patch substrate is coupled to the board through a plurality of solder interconnects, and

wherein at least one solder interconnect from the plurality of solder interconnects is configured to be part of the EMI shield for the integrated device.

23. The device of claim 20 , wherein the patch substrate is configured as a bridge that provides at least one electrical connection over the cavity of the board, and between a first portion of the board and a second portion of the board.