Reducing printed circuit board area for single-sided printed circuit board
A device includes a single-sided printed circuit board with an opening and a double-sided printed circuit board. The single-sided printed circuit board includes a first and a second side and has an opening extending from the first side. The double-sided printed circuit board is arranged and affixed in the opening of the single-sided printed circuit board, and components extending from one of the sides of the double-sided printed circuit board protrude into the opening but do not protrude beyond the second surface of the single-sided printed circuit board.
1 . A single-sided printed circuit board, comprising:
a first side comprising a first surface on which first components are arranged;
a second side comprising a second surface;
a first opening extending at least partially through from the first side to the second side, wherein a first double-sided printed circuit board is capable of being arranged and affixed in the first opening, wherein:
the first double-sided printed circuit board comprises a third side comprising a third surface on which second components are arranged, and a fourth side comprising a fourth surface on which third components are arranged,
the third surface and the first surface face a first direction, and the fourth surface and the second surface face a second direction, and
none of the third components protrude beyond the second surface;
a connector;
a heat spreader that covers the third components arranged on the fourth surface, wherein the heat spreader does not protrude beyond the second surface; and
at least one additional opening extending at least partially through from the first side to the second side, wherein a respective additional double-sided printed circuit board is arranged and affixed in a respective one of the at least one additional opening.
2 . The single-sided printed circuit board of claim 1 , wherein the first side comprises a fifth surface in the opening, the fifth surface facing the first direction, and wherein none of the third components protrude beyond the fifth surface.
3 . The single-sided printed circuit board of claim 1 , wherein the first opening extends from the first side through the second side.
4 . The single-sided printed circuit board of claim 1 , wherein the first double-sided printed circuit board is soldered to the single-sided printed circuit board.
5 . The single-sided printed circuit board of claim 1 , wherein the first double-sided printed circuit board is arranged and affixed within the first opening and within at least one of the at least one additional opening.
6 . The single-sided printed circuit board of claim 1 , wherein the third components arranged on the fourth surface of the double-sided printed circuit board are arranged in the opening and wherein at least the third surface is arranged above the first surface.
7 . The single-sided printed circuit board of claim 1 , wherein the third components arranged on the fourth surface comprise at least one of a NAND flash memory, an application-specific integrated circuit, a power management integrated circuit, or a temperature sensitive component.
8 . The single-sided printed circuit board of claim 1 , wherein the connector is on an edge of the single-sided printed circuit board.
9 . The single-sided printed circuit board of claim 7 , wherein the second components arranged on the third surface comprise at least one of a NAND flash memory, an application-specific integrated circuit, a power management integrated circuit, or a temperature sensitive component.
10 . A device, comprising:
a single-sided printed circuit board, comprising:
a first side comprising:
a first surface on which first components are arrangeable;
a second side comprising a second surface;
a first opening extending at least partially through from the first side to the second side;
a connector; and
at least one additional opening extending at least partially through from the first side to the second side;
a first double-sided printed circuit board arranged and affixed in the first opening, wherein:
the first double-sided printed circuit board comprises a third side comprising a third surface on which second components are arranged, and a fourth side comprising a fourth surface on which third components are arranged,
the third surface and the first surface face a first direction, and the fourth surface and the second surface face a second direction, and
none of the third components protrude beyond the second surface;
a heat spreader that covers the third components arranged on the fourth surface, wherein the heat spreader does not protrude beyond the second surface; and
at least one additional double-sided printed circuit board arranged and affixed in a respective one of the at least one additional opening.
11 . The device of claim 10 , wherein the first side comprises a fifth surface in the opening, the fifth surface facing the first direction, and wherein none of the third components protrude beyond the fifth surface.
12 . The device of claim 10 , wherein the first opening extends from the first side through the second side.
13 . The device of claim 10 , wherein the device comprises an M.2 form factor, 2.5 ″ form factor, mSATA form factor, U.2 form factor, 2230 form factor, 2242 form factor, 2280 form factor, or 22110 form factor.
14 . The device of claim 10 , wherein the first double-sided printed circuit board is soldered to the single-sided printed circuit board.
15 . The device of claim 10 , wherein the first double-sided printed circuit board is arranged and affixed in the first opening and in at least one of the at least one additional opening.
16 . The device of claim 10 , wherein the third components arranged on the fourth surface are arranged in the opening and wherein at least the third surface is arranged above the first surface.
17 . The device of claim 10 , wherein the third components arranged on the fourth surface comprise at least one of a NAND flash memory, an application-specific integrated circuit, a power management integrated circuit, or a temperature sensitive component.
18 . The device of claim 10 , wherein the connector is on an edge of the single-sided printed circuit board.
19 . The device of claim 17 , wherein the second components arranged on the third surface comprise at least one of a NAND flash memory, an application-specific integrated circuit, a power management integrated circuit, or a temperature sensitive component.
20 . A double-sided printed circuit board, comprising:
a first side comprising a first surface on which first components are arranged;
a second side comprising a second surface on which second components are arranged;
wherein the double-sided printed circuit board is configured to be arranged and affixed in a first opening of a single-sided printed circuit board that extends at least partially through from a third side of the single-sided printed circuit board to a fourth side of the single-sided printed circuit board, wherein third components extend from a third surface of the third side of the single-sided printed circuit board, wherein the second components protrude into the opening but none of the second components protrude beyond a fourth surface of the fourth side, and wherein at least one additional double-sided printed circuit board is arranged and affixed in a respective one of at least one additional opening of the single-sided printed circuit board that extend at least partially through from the third side of the single-sided printed circuit board to the fourth side of the single-sided printed circuit board; and
a heat spreader that covers the second components arranged on the second surface, wherein the heat spreader does not protrude beyond the fourth surface.
21 . The double-sided printed circuit board of claim 20 , wherein the third side of the single-sided printed circuit board comprises a fifth surface in the opening, the fifth surface and the third surface facing a first direction, and wherein none of the third components protrude beyond the fifth surface.
22 . The double-sided printed circuit board of claim 20 , wherein the opening extends from the third side of the single-sided printed circuit board through the fourth side.
23 . The double-sided printed circuit board of claim 20 , wherein the double-sided printed circuit board is soldered to the single-sided printed circuit board.
24 . The double-sided printed circuit board of claim 20 , wherein the double-sided printed circuit board is arranged and affixed within the first opening and within at least one of the at least one additional opening.
25 . The double-sided printed circuit board of claim 20 , wherein the components extending from the second surface of the double-sided printed circuit board are arranged in the opening of the single-sided printed circuit board and wherein at least the first surface is arranged above the third surface.
26 . The double-sided printed circuit board of claim 20 , wherein the second components arranged on the second surface comprise at least one of a NAND flash memory, an application-specific integrated circuit, a power management integrated circuit, or a temperature sensitive component.
27 . The double-sided printed circuit board of claim 20 , wherein a connector is on an edge of the single-sided printed circuit board.
28 . The double-sided printed circuit board of claim 26 , wherein the first components arranged on the first surface comprise at least one of a NAND flash memory, an application-specific integrated circuit, a power management integrated circuit, or a temperature sensitive component.