Semiconductor device and method for fabricating the same
A method for fabricating a semiconductor device includes the steps of forming a magnetic tunneling junction (MTJ) on a MRAM region of a substrate, forming a first inter-metal dielectric (IMD) layer around the MTJ, forming a patterned mask on a logic region of the substrate, performing a nitridation process to transform part of the first IMD layer to a nitride layer, forming a first metal interconnection on the logic region, forming a stop layer on the first IMD layer, forming a second IMD layer on the stop layer, and forming a second metal intercom in the second IMD layer to connect to the MTJ.
1. A semiconductor device, comprising:
a magnetic tunneling junction (MTJ) on a substrate;
a first inter-metal dielectric (IMD) layer around the MTJ;
a nitride layer on the MTJ; and
a stop layer on and directly contacting the nitride layer.
2. The semiconductor device of claim 1 , wherein the substrate comprises a magnetic random access memory (MRAM) region and a logic region, the semiconductor device comprising:
a first metal interconnection on the logic region;
the stop layer on the nitride layer and the first metal interconnection;
a second IMD layer on the stop layer; and
a second metal interconnection in the second IMD layer and connected to the MTJ, wherein the nitride layer is around the second metal interconnection.
3. The semiconductor device of claim 2 , wherein top surfaces of the nitride layer and the first metal interconnection are coplanar.
4. The semiconductor device of claim 1 , wherein the nitride layer comprises a gradient nitrogen concentration.
5. The semiconductor device of claim 1 , wherein a nitrogen concentration of the nitride layer decreases toward the MTJ.