IP Library › Granted Patent US 11,410,980
Granted Patent B2
US 11,410,980 · App. 17/086,908 · Granted Aug 9, 2022

Integrated assemblies comprising vertically-stacked decks

Inventor: Werner Juengling (Meridian, ID)
Assignee: Micron Technology, Inc.
H01L25/18G11C11/4085G11C11/4091H01L23/528H01L23/5226H01L23/544H01L25/0657H01L27/10805H01L27/10897H01L2223/54426H01L2223/54493H01L2225/06541H01L2225/06565
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Quick Facts
Patent No.
US 11,410,980
App. No.
17/086,908
Granted
Aug 9, 2022
Kind
B2
Abstract

Some embodiments include an integrated assembly having a base supporting first circuitry and first conductive lines. The first conductive lines extend along a first direction and are associated with the first circuitry. A deck is over the base and supports an array of memory cells and second conductive lines which are associated with the array of memory cells. The second conductive lines extend along a second direction which is substantially orthogonal to the first direction. Vertical interconnects extend from the deck to the base and couple the first conductive lines to the second conductive lines. Each of the vertical interconnects couples one of the first conductive lines to one of the second conductive lines. Each of the second conductive lines is coupled with only one of the first conductive lines.

Claims (103)

1. An integrated assembly, comprising:

a base comprising first circuitry;

first conductive lines associated with the base and extending to the first circuitry;

second conductive lines associated with the base and extending to the first circuitry; the second conductive lines being on an opposing side of the first circuitry relative to the first conductive lines; the first and second conductive lines extending along a first direction;

a first deck over the base and comprising a first array of first memory cells;

a second deck over the first deck and comprising a second array of second memory cells;

third conductive lines along the first deck and associated with the first array;

fourth conductive lines along the second deck and associated with the second array;

first conductive extensions along the first deck and extending outwardly from the third conductive lines along a second direction which crosses the first direction;

second conductive extensions along the second deck and extending outwardly from the fourth conductive lines along the second direction;

first vertical interconnects extending from the first deck to the base and coupling the first conductive lines to the first conductive extensions; each of the first vertical interconnects coupling one of the first conductive lines to one of the first conductive extensions; each of the first conductive lines being coupled with only one of the first conductive extensions;

second vertical interconnects extending from the second deck to the base and coupling the second conductive lines to the second conductive extensions; each of the second vertical interconnects coupling one of the second conductive lines to one of the second conductive extensions; each of the second conductive lines being coupled with only one of the second conductive extensions; and

wherein the second and fourth conductive lines are on a same pitch as one another.

2. The integrated assembly of claim 1 wherein the first circuitry is sense-amplifier-circuitry, and wherein the third and fourth conductive lines are digit-lines.

3. The integrated assembly of claim 1 wherein the first circuitry is wordline-driver-circuitry, and wherein the third and fourth conductive lines are wordlines.

4. The integrated assembly of claim 1 wherein the first and third conductive lines are on a same pitch as one another.

5. The integrated assembly of claim 1 wherein the first, second, third and fourth conductive lines are on a same pitch as one another.

6. The integrated assembly of claim 1 wherein the base comprises second circuitry in addition to the first circuitry; one of the first and second circuitries being sense-amplifier-circuitry and the other being wordline circuitry; and comprising:

fifth conductive lines associated with the base and extending to the second circuitry;

sixth conductive lines associated with the base and extending to the second circuitry; the sixth conductive lines being on an opposing side of the second circuitry relative to the fifth conductive lines; the fifth and sixth conductive lines extending along the second direction;

seventh conductive lines along the first deck and associated with the first array;

eighth conductive lines along the second deck and associated with the second array;

third conductive extensions along the first deck and extending outwardly from the seventh conductive lines along the first direction;

fourth conductive extensions along the second deck and extending outwardly from the eighth conductive lines along the first direction;

third vertical interconnects extending from the first deck to the base and coupling the fifth conductive lines to the third conductive extensions; each of the third vertical interconnects coupling one of the fifth conductive lines to one of the third conductive extensions; each of the fifth conductive lines being coupled with only one of the third conductive extensions; and

fourth vertical interconnects extending from the second deck to the base and coupling the sixth conductive lines to the fourth conductive extensions; each of the fourth vertical interconnects coupling one of the sixth conductive lines to one of the fourth conductive extensions; each of the sixth conductive lines being coupled with only one of the fourth conductive extensions.

7. The integrated assembly of claim 1 wherein the base comprises second circuitry in addition to the first circuitry; one of the first and second circuitries being sense-amplifier-circuitry and the other being wordline circuitry; and comprising:

fifth conductive lines associated with the base and extending to the second circuitry;

sixth conductive lines associated with the base and extending to the second circuitry; the sixth conductive lines being on an opposing side of the second circuitry relative to the fifth conductive lines; the fifth and sixth conductive lines extending along the first direction;

seventh conductive lines along the first deck and associated with the first array;

eighth conductive lines along the second deck and associated with the second array;

third conductive extensions along the first deck and extending outwardly from the seventh conductive lines along the second direction;

fourth conductive extensions along the second deck and extending outwardly from the eighth conductive lines along the second direction;

third vertical interconnects extending from the first deck to the base and coupling the fifth conductive lines to the third conductive extensions; each of the third vertical interconnects coupling one of the fifth conductive lines to one of the third conductive extensions; each of the fifth conductive lines being coupled with only one of the third conductive extensions; and

fourth vertical interconnects extending from the second deck to the base and coupling the sixth conductive lines to the fourth conductive extensions; each of the fourth vertical interconnects coupling one of the sixth conductive lines to one of the fourth conductive extensions; each of the sixth conductive lines being coupled with only one of the fourth conductive extensions.

8. An integrated assembly, comprising:

a base comprising first circuitry;

first conductive lines associated with the base and extending to the first circuitry;

second conductive lines associated with the base and extending to the first circuitry; the second conductive lines being on an opposing side of the first circuitry relative to the first conductive lines; the first and second conductive lines extending along a first direction;

a first deck over the base and comprising a first array of first memory cells;

a second deck over the first deck and comprising a second array of second memory cells;

third conductive lines along the first deck and associated with the first array;

fourth conductive lines along the second deck and associated with the second array;

first conductive extensions along the first deck and extending outwardly from the third conductive lines along a second direction which crosses the first direction;

second conductive extensions along the second deck and extending outwardly from the fourth conductive lines along the second direction;

first vertical interconnects extending from the first deck to the base and coupling the first conductive lines to the first conductive extensions; each of the first vertical interconnects coupling one of the first conductive lines to one of the first conductive extensions; each of the first conductive lines being coupled with only one of the first conductive extensions;

second vertical interconnects extending from the second deck to the base and coupling the second conductive lines to the second conductive extensions; each of the second vertical interconnects coupling one of the second conductive lines to one of the second conductive extensions; each of the second conductive lines being coupled with only one of the second conductive extensions; and

wherein the first and third conductive lines are on a same pitch as one another.

9. The integrated assembly of claim 8 wherein the first circuitry is sense-amplifier-circuitry, and wherein the third and fourth conductive lines are digit-lines.

10. The integrated assembly of claim 8 wherein the first circuitry is wordline-driver-circuitry, and wherein the third and fourth conductive lines are wordlines.

11. The integrated assembly of claim 8 wherein the second and fourth conductive lines are on a same pitch as one another.

12. The integrated assembly of claim 8 wherein the first, second, third and fourth conductive lines are on a same pitch as one another.

13. The integrated assembly of claim 8 wherein the base comprises second circuitry in addition to the first circuitry; one of the first and second circuitries being sense-amplifier-circuitry and the other being wordline circuitry; and comprising:

fifth conductive lines associated with the base and extending to the second circuitry;

sixth conductive lines associated with the base and extending to the second circuitry; the sixth conductive lines being on an opposing side of the second circuitry relative to the fifth conductive lines; the fifth and sixth conductive lines extending along the second direction;

seventh conductive lines along the first deck and associated with the first array;

eighth conductive lines along the second deck and associated with the second array;

third conductive extensions along the first deck and extending outwardly from the seventh conductive lines along the first direction;

fourth conductive extensions along the second deck and extending outwardly from the eighth conductive lines along the first direction;

third vertical interconnects extending from the first deck to the base and coupling the fifth conductive lines to the third conductive extensions; each of the third vertical interconnects coupling one of the fifth conductive lines to one of the third conductive extensions; each of the fifth conductive lines being coupled with only one of the third conductive extensions; and

fourth vertical interconnects extending from the second deck to the base and coupling the sixth conductive lines to the fourth conductive extensions; each of the fourth vertical interconnects coupling one of the sixth conductive lines to one of the fourth conductive extensions; each of the sixth conductive lines being coupled with only one of the fourth conductive extensions.

14. The integrated assembly of claim 8 wherein the base comprises second circuitry in addition to the first circuitry; one of the first and second circuitries being sense-amplifier-circuitry and the other being wordline circuitry; and comprising:

fifth conductive lines associated with the base and extending to the second circuitry;

sixth conductive lines associated with the base and extending to the second circuitry; the sixth conductive lines being on an opposing side of the second circuitry relative to the fifth conductive lines; the fifth and sixth conductive lines extending along the first direction;

seventh conductive lines along the first deck and associated with the first array;

eighth conductive lines along the second deck and associated with the second array;

third conductive extensions along the first deck and extending outwardly from the seventh conductive lines along the second direction;

fourth conductive extensions along the second deck and extending outwardly from the eighth conductive lines along the second direction;

third vertical interconnects extending from the first deck to the base and coupling the fifth conductive lines to the third conductive extensions; each of the third vertical interconnects coupling one of the fifth conductive lines to one of the third conductive extensions; each of the fifth conductive lines being coupled with only one of the third conductive extensions; and

fourth vertical interconnects extending from the second deck to the base and coupling the sixth conductive lines to the fourth conductive extensions; each of the fourth vertical interconnects coupling one of the sixth conductive lines to one of the fourth conductive extensions; each of the sixth conductive lines being coupled with only one of the fourth conductive extensions.

15. An integrated assembly, comprising:

a base comprising first circuitry;

first conductive lines associated with the base and extending to the first circuitry;

second conductive lines associated with the base and extending to the first circuitry; the second conductive lines being on an opposing side of the first circuitry relative to the first conductive lines; the first and second conductive lines extending along a first direction;

a first deck over the base and comprising a first array of first memory cells;

a second deck over the first deck and comprising a second array of second memory cells;

third conductive lines along the first deck and associated with the first array;

fourth conductive lines along the second deck and associated with the second array;

first conductive extensions along the first deck and extending outwardly from the third conductive lines along a second direction which crosses the first direction;

second conductive extensions along the second deck and extending outwardly from the fourth conductive lines along the second direction;

first vertical interconnects extending from the first deck to the base and coupling the first conductive lines to the first conductive extensions; each of the first vertical interconnects coupling one of the first conductive lines to one of the first conductive extensions; each of the first conductive lines being coupled with only one of the first conductive extensions;

second vertical interconnects extending from the second deck to the base and coupling the second conductive lines to the second conductive extensions; each of the second vertical interconnects coupling one of the second conductive lines to one of the second conductive extensions; each of the second conductive lines being coupled with only one of the second conductive extensions; and

wherein the first, second, third and fourth conductive lines are on a same pitch as one another.

16. The integrated assembly of claim 15 wherein the first circuitry is sense-amplifier-circuitry, and wherein the third and fourth conductive lines are digit-lines.

17. The integrated assembly of claim 15 wherein the first circuitry is wordline-driver-circuitry, and wherein the third and fourth conductive lines are wordlines.

18. The integrated assembly of claim 15 wherein the base comprises second circuitry in addition to the first circuitry; one of the first and second circuitries being sense-amplifier-circuitry and the other being wordline circuitry; and comprising:

fifth conductive lines associated with the base and extending to the second circuitry;

sixth conductive lines associated with the base and extending to the second circuitry; the sixth conductive lines being on an opposing side of the second circuitry relative to the fifth conductive lines; the fifth and sixth conductive lines extending along the second direction;

seventh conductive lines along the first deck and associated with the first array;

eighth conductive lines along the second deck and associated with the second array;

third conductive extensions along the first deck and extending outwardly from the seventh conductive lines along the first direction;

fourth conductive extensions along the second deck and extending outwardly from the eighth conductive lines along the first direction;

third vertical interconnects extending from the first deck to the base and coupling the fifth conductive lines to the third conductive extensions; each of the third vertical interconnects coupling one of the fifth conductive lines to one of the third conductive extensions; each of the fifth conductive lines being coupled with only one of the third conductive extensions; and

fourth vertical interconnects extending from the second deck to the base and coupling the sixth conductive lines to the fourth conductive extensions; each of the fourth vertical interconnects coupling one of the sixth conductive lines to one of the fourth conductive extensions; each of the sixth conductive lines being coupled with only one of the fourth conductive extensions.

19. The integrated assembly of claim 15 wherein the base comprises second circuitry in addition to the first circuitry; one of the first and second circuitries being sense-amplifier-circuitry and the other being wordline circuitry; and comprising:

fifth conductive lines associated with the base and extending to the second circuitry;

sixth conductive lines associated with the base and extending to the second circuitry; the sixth conductive lines being on an opposing side of the second circuitry relative to the fifth conductive lines; the fifth and sixth conductive lines extending along the first direction;

seventh conductive lines along the first deck and associated with the first array;

eighth conductive lines along the second deck and associated with the second array;

third conductive extensions along the first deck and extending outwardly from the seventh conductive lines along the second direction;

fourth conductive extensions along the second deck and extending outwardly from the eighth conductive lines along the second direction;

third vertical interconnects extending from the first deck to the base and coupling the fifth conductive lines to the third conductive extensions; each of the third vertical interconnects coupling one of the fifth conductive lines to one of the third conductive extensions; each of the fifth conductive lines being coupled with only one of the third conductive extensions; and

fourth vertical interconnects extending from the second deck to the base and coupling the sixth conductive lines to the fourth conductive extensions; each of the fourth vertical interconnects coupling one of the sixth conductive lines to one of the fourth conductive extensions; each of the sixth conductive lines being coupled with only one of the fourth conductive extensions.

Continuity (2)
Division 16213257 · Dec 7, 2018
Related Publication 20210050338A1 · Feb 18, 2021