Multilayer ceramic electronic component
A multilayer ceramic electronic component includes a body including an internal electrode alternately arranged with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a plurality of nickel (Ni) grains, and a composite layer including tin (Sn) and nickel (Ni) is disposed at a grain boundary of the nickel (Ni) grains.
1. A multilayer ceramic electronic component comprising:
a body including an internal electrode alternately arranged with a dielectric layer; and
an external electrode disposed on the body and connected to the internal electrode,
wherein the internal electrode includes a plurality of nickel (Ni) grains, and a composite layer including tin (Sn) and nickel (Ni) is disposed at an interface between the internal electrode and the dielectric layer,
wherein, in the composite layer, a molar ratio of tin (Sn) is greater than or equal to 0.0001, based on a total content of the composite layer.
2. The multilayer ceramic electronic component of claim 1 , wherein a thickness of the composite layer including tin (Sn) and nickel (Ni) is within a range from 1 to 15 nm.
3. The multilayer ceramic electronic component of claim 2 , wherein an average thickness of the internal electrode is 0.4 μm or less.
4. The multilayer ceramic electronic component of claim 3 , wherein an average thickness of the dielectric layer is 0.4 μm or less.
5. The multilayer ceramic electronic component of claim 4 , wherein the body includes a capacitance forming portion including the internal electrode alternately arranged with the dielectric layer, and a cover layer disposed on each of upper and lower surfaces of the capacitance forming portion.
6. The multilayer ceramic electronic component of claim 5 , wherein the thickness of the cover layer is 20 μm or less.
7. The multilayer ceramic electronic component of claim 6 , wherein the multilayer ceramic electronic component has a length of 0.4 mm or less and a width of 0.2 mm or less.
8. The multilayer ceramic electronic component of claim 7 , wherein 85%≤C, where C is a ratio of a length of a portion where an actual internal electrode is formed relative to a total length of the internal electrode.
9. The multilayer ceramic electronic component of claim 2 , wherein an average thickness of the dielectric layer is 0.4 μm or less.
10. The multilayer ceramic electronic component of claim 9 , wherein the body includes a capacitance forming portion including the internal electrode alternately arranged with the dielectric layer, and a cover layer disposed on each of upper and lower surfaces of the capacitance forming portion.
11. The multilayer ceramic electronic component of claim 10 , wherein the thickness of the cover layer is 20 μm or less.
12. The multilayer ceramic electronic component of claim 11 , wherein the multilayer ceramic electronic component has a length of 0.4 mm or less and a width of 0.2 mm or less.
13. The multilayer ceramic electronic component of claim 12 , wherein 85%≤C, where C is a ratio of a length of a portion where an actual internal electrode is formed relative to a total length of the internal electrode.
14. A multilayer ceramic electronic component comprising:
a body including an internal electrode alternately arranged with a dielectric layer; and
an external electrode disposed on the body and connected to the internal electrode,
wherein the internal electrode includes a plurality of nickel (Ni) grains, and a composite layer including tin (Sn) and nickel (Ni) is disposed at an interface between the internal electrode and the dielectric layer,
wherein the dielectric layer includes a plurality of dielectric grains,
wherein tin (Sn) is included at a grain boundary of the plurality of dielectric grains,
wherein a portion of the plurality of dielectric grains have a core-shell structure,
wherein tin (Sn) is included in a shell of the dielectric grains having the core-shell structure, and
wherein, in the composite layer, a molar ratio of tin (Sn) is greater than or equal to 0.0001, based on a total content of the composite layer.
15. The multilayer ceramic electronic component of claim 14 , wherein a thickness of the composite layer including tin (Sn) and nickel (Ni) is within a range from 1 to 15 nm.
16. The multilayer ceramic electronic component of claim 15 , wherein an average thickness of the internal electrode is 0.4 μm or less.
17. The multilayer ceramic electronic component of claim 16 , wherein an average thickness of the dielectric layer is 0.4 μm or less.
18. The multilayer ceramic electronic component of claim 17 , wherein the body includes a capacitance forming portion including the internal electrode alternately arranged with the dielectric layer, and a cover layer disposed on each of upper and lower surfaces of the capacitance forming portion.
19. The multilayer ceramic electronic component of claim 18 , wherein the thickness of the cover layer is 20 μm or less.
20. The multilayer ceramic electronic component of claim 19 , wherein the multilayer ceramic electronic component has a length of 0.4 mm or less and a width of 0.2 mm or less.
21. The multilayer ceramic electronic component of claim 20 , wherein 85%≤C, where C is a ratio of a length of a portion where an actual internal electrode is formed relative to a total length of the internal electrode.
22. The multilayer ceramic electronic component of claim 14 , wherein an average thickness of the internal electrode is 0.4 μm or less.
23. The multilayer ceramic electronic component of claim 22 , wherein an average thickness of the dielectric layer is 0.4 μm or less.
24. The multilayer ceramic electronic component of claim 23 , wherein the body includes a capacitance forming portion including the internal electrode alternately arranged with the dielectric layer, and a cover layer disposed on each of upper and lower surfaces of the capacitance forming portion.
25. The multilayer ceramic electronic component of claim 24 , wherein the thickness of the cover layer is 20 μm or less.
26. The multilayer ceramic electronic component of claim 25 , wherein the multilayer ceramic electronic component has a length of 0.4 mm or less and a width of 0.2 mm or less.
27. The multilayer ceramic electronic component of claim 26 , wherein 85%≤C, where C is a ratio of a length of a portion where an actual internal electrode is formed relative to a total length of the internal electrode.
28. The multilayer ceramic electronic component of claim 14 , wherein an average thickness of the dielectric layer is 0.4 μm or less.
29. The multilayer ceramic electronic component of claim 28 , wherein the body includes a capacitance forming portion including the internal electrode alternately arranged with the dielectric layer, and a cover layer disposed on each of upper and lower surfaces of the capacitance forming portion.
30. The multilayer ceramic electronic component of claim 29 , wherein the thickness of the cover layer is 20 μm or less.
31. The multilayer ceramic electronic component of claim 30 , wherein the multilayer ceramic electronic component has a length of 0.4 mm or less and a width of 0.2 mm or less.
32. The multilayer ceramic electronic component of claim 31 , wherein 85%≤C, where C is a ratio of a length of a portion where an actual internal electrode is formed relative to a total length of the internal electrode.