IP Library Granted Patent US 11,462,643
Granted Patent B2
US 11,462,643 · App. 17/091,959 · Granted Oct 4, 2022

Nanowire transistor with source and drain induced by electrical contacts with negative Schottky barrier height

Inventors: Paul A. Clifton (Palo Alto, CA); Andreas Goebel (Mountain View, CA); Walter A. Harrison (Palo Alto, CA)
Assignee: Acorn Semi, LLC
H01L29/78618B82Y10/00H01L29/0673H01L29/0847H01L29/41725H01L29/41791H01L29/42392H01L29/775H01L29/785H01L29/7839H01L29/7851H01L29/78696
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Quick Facts
Patent No.
US 11,462,643
App. No.
17/091,959
Granted
Oct 4, 2022
Kind
B2
Abstract

A nanowire transistor includes undoped source and drain regions electrically coupled with a channel region. A source stack that is electrically isolated from a gate conductor includes an interfacial layer and a source conductor, and is coaxially wrapped completely around the source region, extending along at least a portion of the source region. A Schottky barrier between the source conductor and the source region is a negative Schottky barrier and a concentration of free charge carriers is induced in the semiconductor source region.

Claims (24)

1. A nanowire transistor, comprising:

a nanowire disposed on a substrate, the nanowire having an undoped channel region of a first semiconductor material disposed longitudinally between and electrically coupled with an undoped semiconductor source region and an undoped semiconductor drain region;

a gate stack having a gate conductor and a gate insulator wrapped around the undoped channel region of the nanowire;

wherein the undoped semiconductor source region is included in a source stack having a source conductor and an interfacial layer coaxially wrapped around the semiconductor source region, and the undoped semiconductor drain region is included in a drain stack having a drain conductor and an interfacial layer coaxially wrapped around the semiconductor drain region.

2. The nanowire transistor of claim 1 , wherein the source conductor is separated from the gate conductor by an insulating material layer.

3. The nanowire transistor of claim 1 , wherein the source conductor is separated from the gate conductor by a gap.

4. The nanowire transistor of claim 1 , wherein the drain conductor is separated from the gate conductor by an insulating material layer.

5. The nanowire transistor of claim 1 , wherein the drain conductor is separated from the gate conductor by a gap.

6. The nanowire transistor of claim 1 , wherein a Schottky barrier between the source conductor and the semiconductor source region has a negative Schottky barrier height.

7. The nanowire transistor of claim 1 , wherein a Schottky barrier between the source conductor and the semiconductor source region is between −0.1 eV and −0.5 eV.

8. The nanowire transistor of claim 1 , wherein the interfacial layer of the source stack comprises a material that would be an insulator in its bulk state.

9. The nanowire transistor of claim 1 , wherein the interfacial layer of the source stack comprises a material that would be a semiconductor in its bulk state.

10. The nanowire transistor of claim 1 , wherein the interfacial layer of the drain stack comprises a material that would be an insulator in its bulk state.

11. The nanowire transistor of claim 1 , wherein the interfacial layer of the drain stack comprises a material that would be a semiconductor in its bulk state.

12. The nanowire transistor of claim 1 , wherein the interfacial layer of the source stack is a monolayer of a Group V element.

13. The nanowire transistor of claim 1 , wherein the interfacial layer of the source stack is a monolayer of a Group VI element.

14. The nanowire transistor of claim 1 , wherein the interfacial layer of the source stack is a monolayer of a Group III element.

15. The nanowire transistor of claim 1 , wherein the interfacial layer of the drain stack is a monolayer of a Group V element.

16. The nanowire transistor of claim 1 , wherein the interfacial layer of the drain stack is a monolayer of a Group VI element.

17. The nanowire transistor of claim 1 , wherein the interfacial layer of the drain stack is a monolayer of a Group III element.

18. The nanowire transistor of claim 1 , wherein the undoped channel region, the undoped semiconductor source region, and the undoped semiconductor drain region are all comprised of the first semiconductor material.

19. The nanowire transistor of claim 17 , wherein the first semiconductor material is one of: silicon, germanium, silicon carbide, a compound semiconductor, a fullerene, or an alloy comprising two or more of silicon, germanium, carbon and tin.

20. The nanowire transistor of claim 1 , wherein the undoped semiconductor source region and the undoped semiconductor drain region are not comprised of the first semiconductor material.

21. The nanowire transistor of claim 1 , wherein the source conductor comprises a degenerately doped n-type semiconductor.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2024
From: CLIFTON, PAUL A.
To: ACORN TECHNOLOGIES, INC.
Reel/Frame 067813/0525 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2024
From: GOEBEL, ANDREAS
To: ACORN TECHNOLOGIES, INC.
Reel/Frame 067814/0501 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2024
From: HARRISON, WALTER A.
To: ACORN TECHNOLOGIES, INC.
Reel/Frame 067814/0549 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2024
From: ACORN TECHNOLOGIES, INC.
To: ACORN SEMI, LLC
Reel/Frame 067814/0657 →
Continuity (6)
Continuation 16693143 · Nov 22, 2019
Continuation 16202507 · Nov 28, 2018
Division 15816231 · Nov 17, 2017
Provisional Application 62456437 · Feb 8, 2017
Provisional Application 62424176 · Nov 18, 2016
Related Publication 20210083123A1 · Mar 18, 2021
Cited By (1)
US 12,477,776