Electrode structure of light emitting device
A light-emitting device, comprising: a substrate; a semiconductor stacking layer comprising a first type semiconductor layer on the substrate, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer; and an electrode structure on the second semiconductor layer, wherein the electrode structure comprises a bonding layer, a conductive layer, and a first barrier layer between the bonding layer and the conductive layer; wherein the conductive layer has higher standard oxidation potential than that of the bonding layer.
1. A light-emitting device, comprising:
a first semiconductor layer;
an active layer on the first semiconductor layer;
a second semiconductor layer on the active layer; and
an electrode structure on the second semiconductor layer,
wherein the electrode structure comprises a conductive layer on the second semiconductor layer, a bonding layer on the conductive layer, and a first barrier layer between the bonding layer and the conductive layer,
wherein the first barrier layer comprises a material selected from a group consisting of Cr, Pt, Ti, TiW, W, and Zn, and
wherein a ratio of the thickness of the conductive layer to the total thickness of the electrode structure is between 0.4 and 0.7, or the total thickness of the conductive layer and the bonding layer is about 0.4˜0.7 times the total thickness of the electrode structure.
2. A light-emitting device according to claim 1 , wherein the conductive layer comprises a first conductive layer and a second conductive layer, and a second barrier layer is between the first conductive layer and the second conductive layer.
3. A light-emitting device according to claim 2 , wherein the thickness of the first conductive layer is of the same order as that of the second conductive layer.
4. A light-emitting device according to claim 1 , wherein the electrode structure further comprises an adhesion layer between the second semiconductor layer and the conductive layer.
5. A light-emitting device according to claim 4 , wherein the adhesion layer comprises Cr or Rh.
6. A light-emitting device according to claim 5 , wherein the adhesion layer comprises a thickness between 5 Å and 50 Å.
7. A light-emitting device according to claim 1 , further comprising a mirror layer between the second semiconductor layer and the conductive layer, wherein the mirror layer comprises Al or Ag.
8. A light-emitting device according to claim 7 , wherein the mirror layer comprises a thickness between 500 Å and 5000 Å.
9. A light-emitting device according to claim 1 , wherein the bonding layer comprises a first metal comprising Au, and the conductive layer comprises a second metal comprising Al, Ag or Cu.
10. A light-emitting device according to claim 1 , wherein the first barrier layer comprises a first metal layer and a second metal layer.
11. A light-emitting device according to claim 10 , wherein the first metal layer is one to three times thicker than the second metal layer.
12. A light-emitting device according to claim 10 , wherein the first metal layer comprises a material different from that of the second metal layer.
13. A light-emitting device according to claim 7 , further comprising a third barrier layer between the mirror layer and the conductive layer.
14. A light-emitting device according to claim 13 , wherein the third barrier layer comprises a plurality of metal layers, and one of the metal layers comprises a material selected from a group consisting of Cr, Pt, Ti, TiW, W, and Zn.
15. A light-emitting device according to claim 13 , wherein the third barrier layer comprises the third metal layer and a fourth metal layer stacked on the third metal layer, and the fourth metal layer comprises a material different from that of the third metal layer.
16. A light-emitting device according to claim 1 , further comprising a third conductive layer on the second semiconductor layer, and a fourth barrier layer between the second conductive layer and the third conductive layer.
17. A light-emitting device according to claim 16 , wherein the fourth barrier layer comprises a fifth metal layer and a sixth metal layer stacked on the fifth metal layer, wherein the sixth metal layer comprises a material different from that of the fifth metal layer.
18. A light-emitting device according to claim 2 , wherein the thickness of the first conductive layer is of the same order as that of the second conductive layer.
19. A light-emitting device according to claim 16 , wherein the thickness of the third conductive layer is of the same order as those of the second conductive layer and the first conductive layer.
20. A light-emitting device, comprising:
a first semiconductor layer;
an active layer on the first semiconductor layer;
a second semiconductor layer on the active layer; and
an electrode structure on the second semiconductor layer,
wherein the electrode structure comprises a conductive layer on the second semiconductor layer, a bonding layer on the conductive layer, and a first barrier layer between the bonding layer and the conductive layer,
wherein the first barrier layer comprises a material selected from a group consisting of Cr, Pt, Ti, TiW, W, and Zn, and
wherein the total thickness of the conductive layer and the bonding layer is about 0.6˜0.9 or 0.75˜0.95 times the total thickness of the electrode structure.