IP Library Granted Patent US 12,368,511
Granted Patent B2
US 12,368,511 · App. 17/119,844 · Granted Jul 22, 2025

Embedded faraday rotators and components for increasing bandwidth and/or reducing fiber count in photonics multi chip packages

Inventors: Brandon C. Marin (Gilbert, AZ); Kaveh Hosseini (San Jose, CA); Conor O'Keeffe (Cork, IE); Hiroki Tanaka (Chandler, AZ)
Assignee: Intel Corporation
H04B10/2581G02B27/283G02F1/0142G02F1/09H04B10/50H04B10/66
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Quick Facts
Patent No.
US 12,368,511
App. No.
17/119,844
Granted
Jul 22, 2025
Kind
B2
Abstract

Embodiments disclosed herein include photonics systems with a dual polarization module. In an embodiment, a photonics patch comprises a patch substrate, and a photonics die over a first surface of the patch substrate. In an embodiment, a multiplexer is over a second surface of the patch substrate. In an embodiment, a first optical path from the photonics die to the multiplexer is provided for propagating a first optical signal, and a second optical path from the photonics die to the multiplexer is provided for propagating a second optical signal. In an embodiment, a Faraday rotator is provided along the second optical path to convert the second optical signal from a first mode to a second mode before reaching the multiplexer.

Claims (21)

1. A photonics device, comprising:

a package substrate, the package substrate comprising a plurality of conductive routing layers;

a photonics die over a first surface of the package substrate;

a multiplexer over a second surface of the package substrate;

a first optical path from the photonics die to the multiplexer for propagating a first optical signal; and

a second optical path from the photonics die to the multiplexer for propagating a second optical signal, wherein a magnetic shell and an optically clear plug filling the magnetic shell is provided along the second optical path to convert the second optical signal from a first mode to a second mode before reaching the multiplexer, wherein the magnetic shell and the optically clear plug are within an opening in the package substrate, the optically clear plug extending from a top of the package substrate to the multiplexer.

2. The photonics device of claim 1 , wherein the first mode is a transverse electric (TE) mode, and wherein the second mode is a transverse magnetic TM mode.

3. The photonics device of claim 2 , wherein the first optical signal is a TE mode signal.

4. The photonics device of claim 1 , wherein the multiplexer combines the first optical signal with the second optical signal to form a multiplexed signal.

5. The photonics device of claim 4 , wherein the multiplexed signal is propagated along a single optical fiber.

6. The photonics device of claim 1 , further comprising:

a splitter, wherein the splitter is configured to split an incoming optical signal into the first optical signal and the second optical signal.

7. The photonics device of claim 6 , wherein the splitter is on the same surface of the package substrate as the multiplexer.

8. The photonics device of claim 6 , wherein an input laser provides the incoming optical signal to the splitter, and wherein the incoming optical signal is a TE mode signal.

9. The photonics device of claim 1 , wherein the magnetic shell and the optically clear plug function as a Faraday rotator.

10. The photonics device of claim 9 , wherein the Faraday rotator further comprises:

a tube wherein the magnetic shell is within the tube;

a first polarizer;

a second polarizer wherein the first polarizer and the second polarizer are on opposite ends of the magnetic shell.

11. The photonics device of claim 1 , further comprising:

a compute die over the package substrate, wherein the compute die is communicatively coupled to the photonics die by an embedded bridge.

Assignments (3)
SECURITY INTEREST Recorded Sep 12, 2025
From: ALTERA CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 073431/0309 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2025
From: INTEL CORPORATION
To: ALTERA CORPORATION
Reel/Frame 072704/0307 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 22, 2021
From: MARIN, BRANDON C.; HOSSEINI, KAVEH; O'KEEFFE, CONOR; TANAKA, HIROKI
To: INTEL CORPORATION
Reel/Frame 056012/0190 →