Micro patterns created on the surface to control placement and uniformity of material with viscosity
Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate and a compute die on the package substrate. In an embodiment, an optics die is on the package substrate, and an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, channels are disposed on a surface of the IHS facing the package substrate.
1. An optical package, comprising:
a package substrate, wherein a channel is in the package substrate;
a compute die on the package substrate;
an optics die on the package substrate; and
an integrated heat spreader (IHS) over the compute die and the optics die, wherein channels are disposed on a surface of the IHS facing the package substrate.
2. The optical package of claim 1 , wherein the channels comprise:
a first channel running in a first direction; and
a second channel running in a second direction that is substantially orthogonal to the first direction.
3. The optical package of claim 1 , wherein the channels comprise:
a first ring channel; and
a second ring channel surrounding the first ring channel.
4. The optical package of claim 1 , wherein the channels comprise:
a first channel extending in a first direction;
a second channel intersecting the first channel, wherein the second channel has a first width; and
a third channel intersecting the first channel, wherein the third channel has a second width.
5. The optical package of claim 1 , wherein the package substrate comprises a recess along an edge.
6. The optical package of claim 5 , wherein the channels are positioned over the recess in the package substrate.
7. The optical package of claim 1 , further comprising:
an optical connector coupled to the optics die.
8. The optical package of claim 7 , further comprising:
a sealant around the optical connector, wherein the sealant at least partially fills the channels.
9. The optical package of claim 1 , wherein the channel is between the compute die and the optics die.
10. A photonics die, comprising:
a die substrate;
a V-groove in the die substrate; and
a channel into a surface of the V-groove.
11. Photonics die of claim 10 , wherein the V-groove has a length direction, and wherein the channel extends along the length direction.
12. The photonics die of claim 10 , wherein the V-groove has a first end and a second end at the edge of the die substrate, and wherein a spot size converter is at the first end of the V-groove.
13. The photonics die of claim 12 , wherein the channel extends between the first end and the second end, and wherein a second channel is provided between the channel and the second end.
14. The photonics die of claim 13 , wherein the second channel extends in a length direction that is substantially perpendicular to a length direction of the channel.
15. The photonics die of claim 10 , further comprising:
a plurality of channels into surfaces of the V-groove, wherein the plurality of channels run substantially parallel to each other.
16. The photonics die of claim 15 , wherein the plurality of channels are disposed into a first sidewall of the V-groove and a second sidewall of the V-groove.
17. An optical system, comprising:
a board;
a package substrate on the board, wherein a channel is in the package substrate;
a compute die on the package substrate;
an optics die on the package substrate; and
an integrated heat spreader (IHS) over the compute die and the optics die, wherein channels are disposed on a surface of the IHS facing the package substrate.
18. The optical system of claim 17 , wherein the package substrate comprises a recessed edge, and wherein the channels are disposed over the recess.
19. The optical system of claim 17 , wherein the optics die comprises a V-groove, and wherein a second channel is disposed into a surface of the V-groove.