IP Library Granted Patent US 11,690,229
Granted Patent B2
US 11,690,229 · App. 17/131,926 · Granted Jun 27, 2023

Magnetoresistive stack with seed region and method of manufacturing the same

Inventors: Jijun Sun (Chandler, AZ); Sanjeev Aggarwal (Scottsdale, AZ); Han-Jong Chia (Hsinchu, TW); Jon M. Slaughter (Slingerlands, NY); Renu Whig (Chandler, AZ)
Assignee: EVERSPIN TECHNOLOGIES, INC.
H01L27/222G11B5/3909G11C11/1673H01L43/02H01L43/08H01L43/10H01L43/12
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Quick Facts
Patent No.
US 11,690,229
App. No.
17/131,926
Granted
Jun 27, 2023
Kind
B2
Abstract

A magnetoresistive stack/structure and method of manufacturing same comprising wherein the stack/structure includes a seed region, a fixed magnetic region disposed on and in contact with the seed region, a dielectric layer(s) disposed on the fixed magnetic region and a free magnetic region disposed on the dielectric layer(s). In one embodiment, the seed region comprises an alloy including nickel and chromium having (i) a thickness greater than or equal to 40 Angstroms (+/−10%) and less than or equal to 60 Angstroms (+/−10%), and (ii) a material composition or content of chromium within a range of 25-60 atomic percent (+/−10%) or 30-50 atomic percent (+/−10%).

Claims (49)

1. A magnetoresistive stack comprising:

an electrically conductive material;

a seed region disposed above the electrically conductive material, wherein the seed region includes tantalum;

a fixed magnetic region disposed above the seed region, wherein the fixed magnetic region includes a synthetic antiferromagnetic structure comprising:

a first ferromagnetic region disposed above the seed region;

a coupling layer disposed on and in contact with the first ferromagnetic region; and

a second ferromagnetic region disposed on and in contact with the coupling layer;

a first dielectric layer disposed above the second ferromagnetic region;

a free magnetic region disposed above the first dielectric layer;

a second dielectric layer disposed above the free magnetic region; and

a third magnetic region disposed above the second dielectric layer.

2. The magnetoresistive stack of claim 1 , wherein the fixed magnetic region is disposed on and in contact with the seed region.

3. The magnetoresistive stack of claim 1 , wherein the seed region further comprises iron, cobalt, palladium, platinum, nickel, ruthenium, tungsten, molybdenum, an alloy including: iron and boron, an alloy including: cobalt, iron, and boron, or a combination thereof.

4. The magnetoresistive stack of claim 1 , wherein the seed region has a thickness greater than or equal to approximately 30 Å.

5. The magnetoresistive stack of claim 1 , wherein the second dielectric layer is in contact with the free magnetic region.

6. The magnetoresistive stack of claim 5 , wherein the third magnetic region comprises iron and cobalt.

7. The magnetoresistive stack of claim 6 , further comprising a spacer region disposed above the third magnetic region.

8. The magnetoresistive stack of claim 7 , wherein the spacer region comprises ruthenium.

9. The magnetoresistive stack of claim 8 , wherein the electrically conductive material is a first electrically conductive material, and the magnetoresistive stack further comprises a second electrically conductive material disposed above the spacer region, wherein the second electrically conductive material comprises tantalum.

10. A magnetoresistive stack comprising:

an electrically conductive material;

a seed region disposed above the electrically conductive material, wherein the seed region comprises one or more of nickel, chromium, and ruthenium;

a fixed magnetic region disposed above the seed region, wherein the fixed magnetic region includes a synthetic antiferromagnetic structure comprising:

a first ferromagnetic region disposed above the seed region;

a coupling layer disposed on and in contact with the first ferromagnetic region; and

a second ferromagnetic region disposed on and in contact with the coupling layer;

a first dielectric layer disposed above the second ferromagnetic region;

a free magnetic region disposed above the first dielectric layer;

a second dielectric layer disposed above the free magnetic region; and

a third magnetic region disposed above the second dielectric layer.

11. The magnetoresistive stack of claim 10 , wherein the seed region has a thickness greater than or equal to approximately 30 Å.

12. The magnetoresistive stack of claim 10 , wherein the fixed magnetic region is disposed on and in contact with the seed region.

13. The magnetoresistive stack of claim 10 , wherein the third magnetic region comprises iron and cobalt.

14. A magnetoresistive stack comprising:

an electrically conductive material;

a seed region disposed above the electrically conductive material, wherein the seed region comprises tantalum and one or more of: nickel, chromium, ruthenium, iron, cobalt, palladium, platinum, tungsten, and molybdenum;

a fixed magnetic region disposed above the seed region, wherein the fixed magnetic region includes a synthetic antiferromagnetic structure comprising:

a first ferromagnetic region disposed above the seed region;

a coupling layer disposed on and in contact with the first ferromagnetic region; and

a second ferromagnetic region disposed on and in contact with the coupling layer;

a dielectric layer disposed above the second ferromagnetic region;

a free magnetic region disposed above the dielectric layer; and

a third magnetic region disposed above the free magnetic region.

15. The magnetoresistive stack of claim 14 , wherein the fixed magnetic region is disposed on and in contact with the seed region.

16. The magnetoresistive stack of claim 14 , wherein the dielectric layer is a first dielectric layer, and the magnetoresistive stack further comprises a second dielectric layer disposed above the free magnetic region.

17. The magnetoresistive stack of claim 14 , wherein the third magnetic region comprises iron and cobalt.

18. The magnetoresistive stack of claim 14 , further comprising a spacer region disposed above the free magnetic region, wherein the spacer region comprises ruthenium.

19. The magnetoresistive stack of claim 14 , wherein the electrically conductive material is a first electrically conductive material, and the magnetoresistive stack further comprises a second electrically conductive material disposed above the free magnetic region, wherein the second electrically conductive material comprises tantalum.

20. The magnetoresistive stack of claim 14 , wherein the seed region has a thickness greater than or equal to approximately 30 Å.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 23, 2020
From: SUN, JIJUN; AGGARWAL, SANJEEV; CHIA, HAN-JONG; SLAUGHTER, JON M.; WHIG, RENU
To: EVERSPIN TECHNOLOGIES, INC.
Reel/Frame 054743/0577 →
Continuity (7)
Continuation 16870099 · May 8, 2020
Continuation 16601848 · Oct 15, 2019
Continuation 16195178 · Nov 19, 2018
Continuation In Part 15373880 · Dec 9, 2016
Provisional Application 62712578 · Jul 31, 2018
Provisional Application 62265650 · Dec 10, 2015
Related Publication 20210111223A1 · Apr 15, 2021