IP Library Granted Patent US 11,329,718
Granted Patent B2
US 11,329,718 · App. 17/142,778 · Granted May 10, 2022

Integrated mixed-signal ASIC with ADC, DAC, and DSP

Inventors: Paul Rutt (Longmont, CO); Erik Buehler (Castle Rock, CO); Damon Van Buren (Parker, CO)
Assignee: Seakr Engineering, Inc.
H04B7/18515H04B1/0007H04B1/0014H04B1/0039H04B1/0042H04B1/0046H04B1/40H04B1/44H04B7/08H04B7/1851H04B7/212
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Quick Facts
Patent No.
US 11,329,718
App. No.
17/142,778
Granted
May 10, 2022
Kind
B2
Abstract

An integrated analog to digital converting and digital to analog converting (ADDA) RF transceiver for satellite applications capable of flexibly processing high-bandwidth and low-bandwidth RF input signal(s). The RF transceiver may selectively distribute high-bandwidth RF input signals among one or more DSP pipelines for parallel processing of the RF input signals, and the RF transceiver may coherently recombine the processed signals from the one or more DSP pipelines to generate an RF output signal. The ADDA RF transceiver includes one or more ADCs, DSPs, and DACs, all on one or more ASICs, FPGAs, or modular electronic devices in a single semiconductor package. Further, the RF transceiver is radiation tolerant at the module, circuit, and/or system level for high availability and reliability in the ionizing radiation environment present in the space environment.

Claims (36)

1. An integrated analog to digital converting and digital to analog converting (ADDA) radio frequency (RF) transceiver for satellite applications, the RF transceiver being contained on one or more die, all located on the same package, the RF transceiver comprising:

a plurality of high speed analog to digital conversion (ADC) units, each configured for conversion of an RF signal to a sampled digital signal;

a plurality of high speed digital to analog conversion (DAC) units, each configured for conversion of processed digital data to an RF signal;

a plurality of digital inputs;

a plurality of digital outputs;

one or more first digital signal processing (DSP) cores, each core configured to process data from a high speed ADC unit and outputting the processed data on one or more digital outputs; and

one or more second digital signal processing (DSP) cores, each configured to process data from a digital input and outputting the processed data to a DAC unit;

where the provision of the RF transceiver on the same package has a single event effect cross-section of less than 1 cm 2 (square centimeter) at a linear energy transfer greater than or equal to 37 MeV cm 2 /mg (mega-electron Volts-square centimeter per milligram).

2. The RF transceiver of claim 1 , wherein the RF transceiver is configured to power off one or more of the ADC units while one or more of the other ADC units are powered on.

3. The RF transceiver of claim 1 , wherein the RF transceiver is configured to power off one or more of the DAC units while one or more of the other DAC units are powered on.

4. The RF transceiver of claim 1 , further comprising:

a configurable complex floating point data converter for complex numbers that include in-phase (i) and quadrature (q) portions.

5. The RF transceiver of claim 1 , wherein the ADC units, the DAC units, and the one or more first and second DSP cores use a semiconductor process with a feature size in the range of 10 nanometer (nm) to 45 nm.

6. The RF transceiver of claim 1 , wherein the RF transceiver is configured to perform direct conversion, upconversion, or downconversion of RF signals up to 30 GHz.

7. The RF transceiver of claim 1 , wherein the one or more first and second DSP cores include DSP features to facilitate beamforming, including equalizer, channelizer, and beamformer features.

8. The RF transceiver of claim 1 , further comprising:

a router for routing beamformed subchannel data.

9. The RF transceiver of claim 1 , further comprising:

a plurality of Serialized/Deserializer(SerDes) lanes connecting the ADC units, the DAC units, and the one or more first and second DSP cores.

10. The RF transceiver of claim 1 , where the RF transceiver is radiation hardened by process or radiation hardened by design.

11. The RF transceiver of claim 1 , wherein the RF transceiver uses silicon on insulator technology.

12. The RF transceiver of claim 1 , wherein the RF transceiver has the single event effect cross-section of less than 10 −2 cm 2 at the linear energy transfer greater than or equal to 37 MeV cm 2 /mg.

13. The RF transceiver of claim 1 , wherein the RF transceiver is configured to cause the ADC units to become non-operational to thereby provide the RF transceiver comprising the DAC units, the plurality of digital inputs, the plurality of digital outputs, and the one or more first and second DSP cores.

14. The RF transceiver of claim 1 , wherein the RF transceiver is configured to cause the DAC units to become non-operational to thereby provide the RF transceiver comprising the ADC units, the digital inputs, the digital outputs, and the one or more first and second DSP cores.

15. The RF transceiver of claim 1 , wherein the ADC units or the DAC units of the RF transceiver is caused to become non-operational by power islanding or clock gating.

16. A method of processing an RF input signal by an integrated analog to digital converting and digital to analog converting (ADDA) radio frequency (RF) transceiver for satellite applications, the RF transceiver being contained on one or more die, all located on the same package, the method comprising:

converting, by an analog to digital converter (ADC), the RF input signal to a sampled digital input signal;

processing, by a first digital signal processing (DSP) core, the sampled digital input signal from the ADC;

outputting, by the first DSP core, the processed sampled digital input signal to one or more digital outputs;

processing, by a second DSP core, data from a digital input;

outputting, by the second DSP core, the processed data from the digital input to a digital to analog converter (DAC); and

converting, by the DAC, the processed data from the digital input to an RF signal, where the provision of the RF transceiver on the same package has a single event effect cross-section of less than 1 cm 2 (square centimeter) at a linear energy transfer greater than or equal to 37 MeV cm 2 /mg (mega-electron Volt-square centimeters per milligram).

17. The method of claim 16 , further comprising powering off a second ADC while the ADC is powered on.

18. The method of claim 16 , further comprising powering off a second DAC while the DAC is powered on.

19. The method of claim 16 , wherein the RF transceiver is configured to perform direct conversion, upconversion, or downconversion of RF signals up to 30 GHz.

20. The method of claim 16 , further comprising causing the ADC or the DAC of the RF transceiver to become non-operational.

Assignments (2)
CHANGE OF NAME Recorded Sep 30, 2024
From: SEAKR ENGINEERING, INC
To: SEAKR ENGINEERING, LLC
Reel/Frame 069072/0750 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2022
From: RUTT, PAUL; HOBART, JESSE D.; PEREGO, RICHARD E.
To: SEAKR ENGINEERING, INC.
Reel/Frame 058893/0557 →
Continuity (7)
Continuation 16286567 · Feb 26, 2019
Continuation In Part 15351224 · Nov 14, 2016
Continuation In Part 15263134 · Sep 12, 2016
Continuation 14828126 · Aug 17, 2015
Continuation 14828126 · Aug 17, 2015
Provisional Application 62037816 · Aug 15, 2014
Related Publication 20210234609A1 · Jul 29, 2021
Cited By (2)
US 12,255,729 US 12,681,142