Device for bonding chips
A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond using a bond head having a first surface configured to couple to a chip that is to be bonded, and a second surface fixed to and disposed opposite the first surface. A first spring element having a first spring constant and a second spring element having a second spring constant are coupled to the second surface, where the first spring constant is different from the second spring constant.
1. A device for bonding a plurality of chips onto a semiconductor substrate or onto further chips, the device comprising:
an ejector including a storage area for storing the plurality of chips; and
a bond head for positioning and aligning a chip of the plurality of chips, the bond head including
a first surface configured to couple to the chip of the plurality of chips that is to be bonded, and a second surface fixed to and disposed opposite the first surface,
a first spring element having a first spring constant, and
a second spring element having a second spring constant,
wherein the first spring constant is different from the second spring constant, and the first and second spring elements are coupled to the second surface.
2. The device according to claim 1 , wherein the second spring element comprises at least two spring elements spaced apart from one another, and the first spring element is arranged between the at least two second spring elements.
3. The device according to claim 2 , wherein one of the at least two spring elements is arranged on a first peripheral edge of the bond head and another of the at least two spring elements is arranged on a second peripheral edge of the bond head, the second peripheral edge positionally opposite the first peripheral edge.
4. The device according to claim 3 , wherein the first spring element is centered on the bond head.
5. The device according to claim 2 , wherein the first spring constant is greater than the second spring constant.
6. The device according to claim 1 , wherein the bond head includes a fixing surface operable to selectively fix the fixing surface to the chip, and a second surface opposite the fixing surface, wherein the second surface is arranged between the fixing surface and the first and second spring elements.
7. The device according to claim 1 , wherein the first spring element is centered on the bond head.
8. The device according to claim 1 , wherein the first spring constant is greater than the second spring constant.
9. The device according to claim 1 , wherein the bond head includes a fixing device.
10. The device according to claim 9 , wherein the fixing device comprises at least one vacuum port.
11. The device according to claim 1 , wherein the storage area comprises
a plurality of cavities each having a through-hole, and
a lifting device movable within the through-hole to lift or lower a chip of the plurality of chips from the respective cavity.
12. The device according to claim 1 , wherein the first spring element is operative to apply a first force in a first direction to the bond head, and the second spring element is operative to apply second force in a second direction to the bond head, the first direction and the second direction being parallel to each other.
13. A device for bonding a plurality of chips onto a semiconductor substrate or onto further chips, the device comprising:
an ejector including a storage area for storing the plurality of chips; and
a bond head for positioning and aligning a chip of the plurality of chips, the bond head including
a first spring element having a first spring constant, and
a second spring element having a second spring constant,
wherein the first spring constant is different from the second spring constant, wherein the bond head further comprises a fixing surface including a plurality of fixations, the first spring element and the second spring element each biasing the fixing surface.