Granted Patent B2

US 12,456,720 · App. 18/425,205 · Granted Oct 28, 2025

Inventor: Markus Wimplinger (Ried in Kreis, AT)

Assignee: EV Group E. Thallner GmbH

H01L25/50H01L24/74H01L24/75H01L24/80H01L25/0652H05K13/0404H01L2224/80003H01L2224/80011H01L2224/80013H01L2224/80894

Abstract

Claims (12)

1. A method operatively associated with a bond head of a bonding device for bonding chips onto at least one of a semiconductor substrate or onto further chips, the method comprising:

forming a liquid film on mounting points on the at least one of the semiconductor substrate or the further chips, the at least one of the semiconductor substrate or the further chips comprising a dielectric surface region and an electric surface region;

positioning hybrid bond surfaces of the chips at the mounting points on the at least one of the semiconductor substrate or the further chips, by the bond head of a bonding device, the hybrid bond surfaces comprising a dielectric surface region and an electric surface region;

using the bond head to directly bond the chips to the mounting points on the at least one of the semiconductor substrate or the further chips, wherein using the bond head to directly bond the chips comprises first bonding a center of the chips onto the liquid film and then bonding outwards from the center of the chips onto the liquid film while holding the chips by the bond head; and

releasing the chips from fixation by the bond head, wherein the electric surface region of the chips and the electric surface region of the at least one of the semiconductor substrate or the further chips self-align congruently with one another.

2. The method according to claim 1 , comprising prior to positioning the hybrid bond surfaces, fixing a substrate onto a carrier and subsequently separating the substrate into the chips.

3. The method according to claim 2 , comprising prior to fixing the substrate on the carrier, cleaning a bond surface of the substrate.

4. The method according to claim 3 , wherein cleaning comprises cleaning the bond surfaces of the chips as the chips are removed from the carrier and/or while transporting the chips to bond positions.

5. The method according to claim 3 , wherein separating comprises mechanically separating the chips at joints having previously been introduced into the bond surface of the substrate.

6. The method according to claim 2 , wherein cleaning comprises cleaning the bond surfaces of the chips as the chips are removed from the carrier and/or while transporting the chips to bond positions.

7. The method according to claim 6 , wherein separating comprises mechanically separating the chips at joints having previously been introduced into the bond surface of the substrate.

8. The method according to claim 2 , wherein separating comprises mechanically separating the chips at joints having previously been introduced into the bond surface of the substrate.

Continuity (3)

References Cited (86)