Image sensor having improved dicing properties
The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
1. A chip comprising:
a support substrate;
a plurality of layers stacked on the support substrate, the plurality of layers including:
an interconnection layer arranged on the support substrate; and
a silicon substrate arranged on the interconnection layer and including a plurality of photodiodes;
a first resin region including resin material and formed above the plurality of layers; and
a second resin region including resin material and formed on a side surface of the interconnection layer and on a side surface of the support substrate.
2. The chip according to claim 1 , further comprising:
a solder resist and a connection terminal formed below the support substrate.
3. The chip according to claim 1 , further comprising:
a through silicon via formed in the support substrate.
4. The chip according to claim 1 , wherein the plurality of layers further include:
a planarization film formed on the silicon substrate;
a light shielding film formed in the planarization film; and
a color filter layer formed on the planarization film.
5. The chip according to claim 4 , wherein the plurality of layers further include a microlens layer disposed above the color filter layer.
6. An image sensor, comprising:
a substrate;
a plurality of layers stacked on the substrate, the plurality of layers including:
a photodiode layer including a plurality of photodiodes formed therein; and
at least one layer having a groove formed therein such that a portion of the at least one layer is excavated, the groove being disposed outside the plurality of photodiodes;
an adhesive layer formed above the photodiode layer;
a passivation film formed in the groove; and
a cover glass above the plurality of photodiodes and on the adhesive layer.
7. The image sensor according to claim 6 , wherein the adhesive layer is formed above the groove.
8. The image sensor according to claim 6 , wherein the plurality of layers further includes an interconnection layer disposed below the photodiode layer.
9. The image sensor according to claim 6 , wherein the groove includes a portion of the photodiode layer such that the portion of the photodiode layer is excavated.
10. The image sensor according to claim 6 , wherein the adhesive layer is further formed in the groove.
11. The image sensor according to claim 6 , wherein the groove forms a pad opening portion.
12. The image sensor according to claim 11 , further comprising a hydrophobic film formed in the pad opening portion.
13. The image sensor according to claim 11 , further comprising a passivation film that covers an inner wall of the pad opening portion.
14. The image sensor according to claim 13 , wherein the passivation film comes into contact with a top surface of an electrode pad formed at a bottom of the pad opening portion.
15. An image sensor, comprising:
a substrate;
a plurality of layers stacked on the substrate, the plurality of layers including:
a photodiode layer including a plurality of photodiodes formed therein; and
at least one layer having a groove formed therein such that a portion of the at least one layer is excavated, the groove being disposed outside the plurality of photodiodes;
an adhesive layer formed above the photodiode layer; and
a cover glass above the plurality of photodiodes and on the adhesive layer wherein:
the plurality of layers further includes a planarization film formed above the photodiode layer; and
the groove is formed such that a portion of the planarization film is excavated.
16. The image sensor according to claim 15 , wherein:
the plurality of layers further includes a color filter layer formed above the planarization film; and
the groove is formed such that a portion of the color filter layer is excavated.