Memory device having vertical structure
A memory device includes a cell wafer including a memory cell array; and a peripheral wafer including a row control circuit, a column control circuit and a peripheral circuit which control the memory cell array, and stacked on and bonded to the cell wafer in a first direction. The peripheral wafer includes a first substrate having a first surface and a second surface which face away from each other in the first direction; a first logic structure disposed on the first surface of the first substrate, and including the row control circuit and the column control circuit; and a second logic structure disposed on the second surface of the first substrate, and including the peripheral circuit.
1. A memory device comprising:
a cell wafer including a memory cell array; and
a peripheral wafer, including a row control circuit, a column control circuit and a peripheral circuit, stacked on and bonded to the cell wafer in a first direction,
the peripheral wafer comprising:
a first substrate having a first surface and a second surface that face away from each other in the first direction;
a first logic structure, disposed on the first surface of the first substrate, that includes the row control circuit and the column control circuit; and
a second logic structure, disposed on the second surface of the first substrate, that includes the peripheral circuit.
2. The memory device according to claim 1 , wherein the first surface is closer to the cell wafer in the first direction than the second surface.
3. The memory device according to claim 2 ,
wherein the cell wafer includes, on one surface thereof bonded to the peripheral wafer, a plurality of first bonding pads that are coupled to word lines and bit lines of the memory cell array, and
wherein the peripheral wafer includes, on the one surface thereof bonded to the cell wafer, a plurality of second bonding pads that are bonded to the plurality of first bonding pads, each of the plurality of second bonding pads are coupled to the row control circuit or the column control circuit.
4. The memory device according to claim 2 , wherein each of the row control circuit and the column control circuit is coupled to the peripheral circuit through a through via that passes through the first substrate.
5. The memory device according to claim 1 , wherein the memory cell array comprises:
a plurality of word lines and a plurality of interlayer dielectric layers alternately stacked on a second substrate; and
a plurality of vertical channels passing through the plurality of word lines and the plurality of interlayer dielectric layers.
6. The memory device according to claim 1 , wherein the row control circuit is disposed in a slimming region and the column control circuit is disposed in a cell region.
7. The memory device according to claim 1 , wherein, when viewed in the first direction, the row control circuit is disposed in a slimming region and divides the column control circuit, which is disposed in separate cell regions, and
wherein the slimming region and the cell regions are arranged in a second direction that is perpendicular to the first direction.
8. The memory device according to claim 1 , further comprising, when viewed in the first direction, a rectangular cell region divided into four quadrants,
wherein each of the four quadrants includes a portion of the row control circuit or the column control circuit.
9. The memory device according to claim 8 , wherein the portions of the row control circuit and the column control circuit are disposed at the corners of the rectangular cell region.
10. The memory device according to claim 8 , wherein the portions of the row control circuit and the column control circuit are disposed at the corners of each quadrant closest to the center of the rectangular cell region.
11. A memory device comprising:
a logic circuit part including a row control circuit, a column control circuit and a peripheral circuit; and
a cell part stacked on the logic circuit part in a first direction, and including the memory cell array,
the logic circuit part comprising:
a substrate having a first surface and a second surface that face away from each other in the first direction;
a first logic circuit part, disposed on the first surface of the substrate, and including the row control circuit and the column control circuit; and
a second logic circuit part, disposed on the second surface of the substrate, and including the peripheral circuit.
12. The memory device according to claim 11 , wherein the first surface is closer to the cell part in the first direction than the second surface.
13. The memory device according to claim 12 , wherein each of the row control circuit and the column control circuit is coupled to the peripheral circuit through a through via that passes through the substrate.
14. The memory device according to claim 12 ,
wherein the first logic circuit part further includes a first dielectric layer that covers the row control circuit and the column control circuit, and a first wiring line that is defined in the first dielectric layer,
wherein the second logic circuit part further includes a second dielectric layer that covers the peripheral circuit, and a second wiring line that is defined in the second dielectric layer, and wherein the second wiring line is formed of a material that has a resistivity lower than a resistivity of the first wiring line.
15. The memory device according to claim 11 , wherein the memory cell array comprises:
a source plate stacked on the first logic circuit part;
a plurality of word lines and a plurality of interlayer dielectric layers alternately stacked on the source plate; and
a plurality of vertical channels passing through the plurality of word lines and the plurality of interlayer dielectric layers.